| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/23/2006 | US20060063380 Salicide process and method of fabricating semiconductor device using the same |
| 03/23/2006 | US20060063379 Forming a combined copper diffusion barrier and seed layer |
| 03/23/2006 | US20060063378 Top layers of metal for integrated circuits |
| 03/23/2006 | US20060063377 Methods for creating electrophoretically insulated vias in semiconductive substrates |
| 03/23/2006 | US20060063376 Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base material |
| 03/23/2006 | US20060063375 Integrated barrier and seed layer for copper interconnect technology |
| 03/23/2006 | US20060063374 Post passivation interconnection schemes on top of the IC chips |
| 03/23/2006 | US20060063373 Method of fabricating copper damascene and dual damascene interconnect wiring |
| 03/23/2006 | US20060063372 Semiconductor device and manufacturing method thereof |
| 03/23/2006 | US20060063371 Top layers of metal for integrated circuits |
| 03/23/2006 | US20060063370 Semiconductor device interconnect fabricating techniques |
| 03/23/2006 | US20060063369 Sub-resolution gaps generated by controlled over-etching |
| 03/23/2006 | US20060063368 Reduction of a feature dimension in a nano-scale device |
| 03/23/2006 | US20060063367 Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device |
| 03/23/2006 | US20060063366 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 03/23/2006 | US20060063365 Aluminum cap for reducing scratch and wire-bond bridging of bond pads |
| 03/23/2006 | US20060063364 Method of forming a semiconductor device having a metal layer |
| 03/23/2006 | US20060063363 Semiconductor structures |
| 03/23/2006 | US20060063362 Semiconductor device and method of manufacturing a semiconductor device |
| 03/23/2006 | US20060063361 Plasma-assisted doping |
| 03/23/2006 | US20060063360 Technique for boron implantation |
| 03/23/2006 | US20060063359 Patterning substrates employing multi-film layers defining etch differential interfaces |
| 03/23/2006 | US20060063358 Method for preventing sidewall consumption during oxidation of SGOI islands |
| 03/23/2006 | US20060063357 Singulation method used in image sensor packaging process and support for use therein |
| 03/23/2006 | US20060063356 SOI structure having a sige layer interposed between the silicon and the insulator |
| 03/23/2006 | US20060063355 Method and device for forming spacer structures for packaging optical reflection devices |
| 03/23/2006 | US20060063354 Microelectromechanical system pressure sensor and method for making and using |
| 03/23/2006 | US20060063353 Method of layer transfer comprising sequential implantations of atomic species |
| 03/23/2006 | US20060063352 Process for manufacturing wafers of semiconductor material by layer transfer |
| 03/23/2006 | US20060063351 Method of making a microelectronic and/or optoelectronic circuitry sheet |
| 03/23/2006 | US20060063350 Semiconductor constructions |
| 03/23/2006 | US20060063349 Method of forming a shallow trench-deep trench isolation region for a BiCMOS/CMOS technology |
| 03/23/2006 | US20060063348 Method of forming improved rounded corners in STI features |
| 03/23/2006 | US20060063347 Method for detecting alignment mark shielding |
| 03/23/2006 | US20060063346 Method of forming a layer and method of forming a capacitor of a semiconductor device having the same |
| 03/23/2006 | US20060063345 Methods of forming plurality of capacitor devices |
| 03/23/2006 | US20060063344 Methods of forming a plurality of capacitor devices |
| 03/23/2006 | US20060063343 Method for making thin film transistors with lightly doped regions |
| 03/23/2006 | US20060063342 Method for manufacturing semiconductor device |
| 03/23/2006 | US20060063341 Bipolar transistor for an integrated circuit having variable value emitter ballast resistors |
| 03/23/2006 | US20060063340 Collector layer structure for a double hetero-junction bipolar transistor for power amplification applications |
| 03/23/2006 | US20060063339 Multi-bit stacked-type non-volatile memory and manufacture method thereof |
| 03/23/2006 | US20060063338 Shallow trench isolation depth extension using oxygen implantation |
| 03/23/2006 | US20060063337 Semiconductor device and manufacturing method thereof |
| 03/23/2006 | US20060063336 Method of forming a semiconductor device having a dielectric layer with high dielectric constant |
| 03/23/2006 | US20060063335 Semiconductor device |
| 03/23/2006 | US20060063334 Fin FET diode structures and methods for building |
| 03/23/2006 | US20060063333 Method of manufacturing split gate type nonvolatile memory device |
| 03/23/2006 | US20060063332 U-gate transistors and methods of fabrication |
| 03/23/2006 | US20060063331 Nonvolatile memory devices with trenched side-wall transistors and method of fabricating the same |
| 03/23/2006 | US20060063330 Memory cell and method for forming the same |
| 03/23/2006 | US20060063329 Method of fabricating a non-volatile memory |
| 03/23/2006 | US20060063328 Programming and erasing structure for a floating gate memory cell and method of making |
| 03/23/2006 | US20060063327 Programming and erasing structure for a floating gate memory cell and method of making |
| 03/23/2006 | US20060063326 Chemical mechanical polishing method |
| 03/23/2006 | US20060063325 Embedded capacitor structure in circuit board and method for fabricating the same |
| 03/23/2006 | US20060063324 Method of manufacturing a semiconductor device |
| 03/23/2006 | US20060063323 High-speed RFID circuit placement method and device |
| 03/23/2006 | US20060063322 Transistor with high dielectric constant gate and method for forming the same |
| 03/23/2006 | US20060063321 Semiconductor device and method of fabricating the same |
| 03/23/2006 | US20060063320 Semiconductor process with first transistor types oriented in a first plane and second transistor types oriented in a second plane |
| 03/23/2006 | US20060063319 Semiconductor device and method of manufacturing the same |
| 03/23/2006 | US20060063318 Reducing ambipolar conduction in carbon nanotube transistors |
| 03/23/2006 | US20060063317 Polysilicon conductor width measurement for 3-dimensional FETs |
| 03/23/2006 | US20060063316 Method for fabricating semiconductor device |
| 03/23/2006 | US20060063315 Method for fabricating thin film transistor |
| 03/23/2006 | US20060063314 Field effect transistor and method of manufacturing the same |
| 03/23/2006 | US20060063313 Method for fabricating forward and reverse blocking devices |
| 03/23/2006 | US20060063312 Semiconductor device and method for manufacturing the same |
| 03/23/2006 | US20060063311 Wafer scale integration packaging and method of making and using the same |
| 03/23/2006 | US20060063310 Method for attaching a semiconductor die to a substrate and heat spreader |
| 03/23/2006 | US20060063309 Method for manufacturing semiconductor device |
| 03/23/2006 | US20060063308 Method for cleaning semiconductor device having dual damascene structure |
| 03/23/2006 | US20060063307 Method and apparatus for assembling an array of micro-devices |
| 03/23/2006 | US20060063306 Semiconductor package having a heat slug and manufacturing method thereof |
| 03/23/2006 | US20060063305 Process of fabricating flip-chip packages |
| 03/23/2006 | US20060063304 Structure and method of high performance two layer ball grid array substrate |
| 03/23/2006 | US20060063303 Packaging method, packaging structure and package substrate for electronic parts |
| 03/23/2006 | US20060063302 Apparatus and method for high density multi-chip structures |
| 03/23/2006 | US20060063301 Manufacturing method of a multi-layer circuit board with an embedded passive component |
| 03/23/2006 | US20060063300 Structural design for flip-chip assembly |
| 03/23/2006 | US20060063299 Scaffold-organized clusters and electronic devices made using such clusters |
| 03/23/2006 | US20060063298 Providing driving current arrangement for oled device |
| 03/23/2006 | US20060063297 Reducing leakage currents in memories with phase-change material |
| 03/23/2006 | US20060063295 Solid-state image pickup device and driving method thereof |
| 03/23/2006 | US20060063294 Hollow dielectric for image sensor |
| 03/23/2006 | US20060063293 Micromechanical sensor element |
| 03/23/2006 | US20060063292 Method for producing a packaged integrated circuit |
| 03/23/2006 | US20060063291 Thermoelectric transducing material thin film, sensor device, and its manufacturing method |
| 03/23/2006 | US20060063290 Method of fabricating metal-insulator-metal capacitor |
| 03/23/2006 | US20060063289 Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
| 03/23/2006 | US20060063288 High power AllnGaN based multi-chip light emitting diode |
| 03/23/2006 | US20060063287 Methods of assembly for a semiconductor light emitting device package |
| 03/23/2006 | US20060063286 Using a time invariant statistical process variable of a semiconductor chip as the chip identifier |
| 03/23/2006 | US20060063285 Methods for measuring die temperature |
| 03/23/2006 | US20060063284 DC bias voltage measurement circuit and plasma CVD apparatus comprising the same |
| 03/23/2006 | US20060063283 Stacked die module and techniques for forming a stacked die module |
| 03/23/2006 | US20060063282 Test structure and method for yield improvement of double poly bipolar device |
| 03/23/2006 | US20060063281 Method and apparatus for uniformity and brightness correction in an OLED display |
| 03/23/2006 | US20060063280 Lamp heating apparatus and method for producing semiconductor device |