Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2006
03/09/2006US20060051964 Method and system for etching a film stack
03/09/2006US20060051963 Devices containing zirconium-platinum-containing materials and methods for preparing such materials and devices
03/09/2006US20060051962 Damascene method capable of avoiding copper extrusion
03/09/2006US20060051961 Method and process for forming a self-aligned silicide contact
03/09/2006US20060051960 Method to form relaxed SiGe layer with high Ge content using co-implantation of silicon with boron or helium and hydrogen
03/09/2006US20060051959 Dual silicide via contact structure and process
03/09/2006US20060051957 Method for making a semiconductor device that includes a metal gate electrode
03/09/2006US20060051956 Imageable bottom anti-reflective coating for high resolution lithography
03/09/2006US20060051955 Top layers of metal for high performance IC's
03/09/2006US20060051954 Bump structure of semiconductor package and method for fabricating the same
03/09/2006US20060051953 Module assembly and method for stacked BGA packages
03/09/2006US20060051952 Method for fabricating conductive bump of circuit board
03/09/2006US20060051951 Method of clearing electrical contact pads in thin film sealed OLED devices
03/09/2006US20060051950 Apparatus and a method for forming an alloy layer over a substrate
03/09/2006US20060051949 Semiconductor device manufacturing method and electronic equipment using same
03/09/2006US20060051948 Microprobe tips and methods for making
03/09/2006US20060051947 Plasma treatment to improve barrier layer performance over porous low-K insulating dielectrics
03/09/2006US20060051946 Method for realizing a hosting structure of nanometric elements
03/09/2006US20060051945 Method for manufacturing soi wafer and soi wafer
03/09/2006US20060051944 Method for implanting atomic species through an uneven surface of a semiconductor layer
03/09/2006US20060051943 Method and producing thin-film semicoductor and production device
03/09/2006US20060051942 Method for producing group III element nitride single crystal and group III element nitride transparent single crystal prepared thereby
03/09/2006US20060051941 Methods of forming a layer comprising epitaxial silicon, and methods of forming field effect transistors
03/09/2006US20060051940 Deposition from liquid sources
03/09/2006US20060051939 Nitride semiconductor substrate and nitride semiconductor device using same
03/09/2006US20060051938 Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
03/09/2006US20060051937 Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology
03/09/2006US20060051936 Mask and production method therefor and production for semiconductor device
03/09/2006US20060051935 Method of separating MEMS devices from a composite structure
03/09/2006US20060051934 Method for manufacturing semiconductor device
03/09/2006US20060051933 Drain extended MOS transistor with improved breakdown robustness
03/09/2006US20060051932 Semiconductor device and method for manufacturing semiconductor device
03/09/2006US20060051931 Method for fabricating a trench isolation structure having a high aspect ratio
03/09/2006US20060051930 Method for forming isolation layer in semiconductor memory device
03/09/2006US20060051929 Electrical properties of shallow trench isolation materials via high temperature annealing in the presence of reactive gases
03/09/2006US20060051928 Reaction vessel for producing capacitor element, production method for capacitor element, capacitor element and capacitor
03/09/2006US20060051927 Manufacture of insulated gate type field effect transistor
03/09/2006US20060051926 Methods of forming semiconductor devices having a trench with beveled corners
03/09/2006US20060051925 Atomic layer deposition of metal oxynitride layers as gate dielectrics
03/09/2006US20060051924 Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
03/09/2006US20060051923 Method for fabricating field rings
03/09/2006US20060051922 Strained silicon device manufacturing method
03/09/2006US20060051921 Methods of manufacturing semiconductor device gate structures by performing a surface treatment on a gate oxide layer
03/09/2006US20060051920 Information storage element, manufacturing method thereof, and memory array
03/09/2006US20060051919 Nanometric structure and corresponding manufacturing method
03/09/2006US20060051918 Methods of forming a plurality of capacitors
03/09/2006US20060051917 Capacitive element and method of manufacturing the same
03/09/2006US20060051916 Deep trench capacitor and method of fabricating thereof
03/09/2006US20060051915 Semiconductor device and manufacturing method thereof
03/09/2006US20060051914 Manufacturing method of semiconductor device
03/09/2006US20060051913 Piezoelectric element and head for jetting liquid and method for manufacturing them
03/09/2006US20060051912 Method and apparatus for a stacked die configuration
03/09/2006US20060051911 Large-grain p-doped polysilicon films for use in thin film transistors
03/09/2006US20060051910 Semiconductor device, manufacturing method for the same, and electronic device
03/09/2006US20060051909 Active matrix substrate and manufacturing method thereof, electric optical device and electronic device
03/09/2006US20060051908 Method of fabricating semiconductor device
03/09/2006US20060051907 Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same
03/09/2006US20060051906 Method of fabricating a semiconductor device
03/09/2006US20060051905 Method of fabricating planarized poly-silicon thin film transistors
03/09/2006US20060051904 Method for forming polycrystalline silicon thin film transistor
03/09/2006US20060051903 Method of manufacturing thin film semiconductor device, and thin film semiconductor device
03/09/2006US20060051902 Method for manufacturing power diode and equipment for the same
03/09/2006US20060051901 Method of producing led bodies with the aid of a cross-sectional restriction
03/09/2006US20060051900 Method of manufacturing a semiconductor device
03/09/2006US20060051899 Method of forming precision leads on a chip-supporting leadframe
03/09/2006US20060051898 Electronic assemblies having a low processing temperature
03/09/2006US20060051897 Technique for attaching die to leads
03/09/2006US20060051896 Stacking circuit elements
03/09/2006US20060051895 Method for manufacturing electronic component-mounted board
03/09/2006US20060051894 Method for bonding flip chip on leadframe
03/09/2006US20060051893 Thin substrate support
03/09/2006US20060051892 Methods for packaging image sensitive electronic devices
03/09/2006US20060051891 Methods for packaging image sensitive electronic devices
03/09/2006US20060051890 Methods for packaging image sensitive electronic devices
03/09/2006US20060051889 Chip assembly reinforcement
03/09/2006US20060051887 Manufacturing method and joining device for solid-state imaging devices
03/09/2006US20060051886 Liquid crystal display device and fabrication method thereof
03/09/2006US20060051885 Method of fabricating mask of gate electrode of field-emission display
03/09/2006US20060051884 Systems and methods for thin film thermal diagnostics with scanning thermal microstructures
03/09/2006US20060051883 Apparatus and system for suspending a chip-scale device and related methods
03/09/2006US20060051882 Method for making a semiconductor device having a high-k gate dielectric
03/09/2006US20060051881 System and method for processing a wafer including stop-on-aluminum processing
03/09/2006US20060051880 Method for making a semiconductor device having a high-k gate dielectric
03/09/2006US20060051684 Photo-mask having exposure blocking region and methods of designing and fabricating the same
03/09/2006US20060051683 Method of manufacturing mask for exposure, mask for exposure, and package body of mask for exposure
03/09/2006US20060051615 Organic electroluminescent element
03/09/2006US20060051610 A bright tin or bright lead-free tin-alloy having no whiskers after 4 months storage at 52 degrees C. and 98% relative humidity; preferred alloying elements are nickel, copper, bismuth, zinc, silver or indium; prepared from a solution of acidic electrolytes and carboxylated polyalkyleneimines
03/09/2006US20060051601 Ceramic film and method of manufacturing the same, ferroelectric capacitor, semiconductor device, and other element
03/09/2006US20060051596 Nickel silicides formed by low-temperature annealing of compositionally modulated multilayers
03/09/2006US20060051584 Process for producing a product having a structured surface
03/09/2006US20060051573 Adhesive sheet for affixation of a wafer and method for processing using the same
03/09/2006US20060051554 To be used for growth of a nitride semiconductor on a sapphire substrate
03/09/2006US20060051515 Non-dripping nozzle apparatus
03/09/2006US20060051506 Nitridation of high-k dielectrics
03/09/2006US20060051184 Methods and apparatus for mapping carrier contents
03/09/2006US20060050588 Semiconductor integrated circuit device
03/09/2006US20060050583 Semiconductor integrated circuit device
03/09/2006US20060050557 Nonvolatile semiconductor memory device
03/09/2006US20060050400 Correction of birefringence in cubic crystalline optical systems
03/09/2006US20060050371 Antireflection coating for ultraviolet light at large angles of incidence