Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2006
03/23/2006US20060060299 Wafer edge expose alignment method
03/23/2006US20060060232 Liquid treatment device and liquid treatment method
03/23/2006US20060060146 Semiconductor manufacturing apparatus and methods
03/23/2006US20060060145 Susceptor with surface roughness for high temperature substrate processing
03/23/2006US20060060143 Method and apparatus for forming a thin layer
03/23/2006US20060060142 Substrate processing apparatus
03/23/2006US20060060141 Process gas introducing mechanism and plasma processing device
03/23/2006US20060060140 Apparatus for treating thin film and method of treating thin film
03/23/2006US20060060136 Semiconductor producing device using mini-environment system
03/23/2006US20060060132 Production method for thin-film crystal wafer, semiconductor device using it and production method therefor
03/23/2006US20060060130 Process and system for laser crystallization processing of film regions on a substrate to provide substantial uniformity within arears in such regions and edge areas thereof, and a structure of film regions
03/23/2006DE19935947B4 Verfahren zum Ausbilden von Zwischenverbindungen in einem ferroelektrischen Speicherbauelement A process for forming interconnections in a ferroelectric memory device
03/23/2006DE19845315B4 Halbleitervorrichtung und Herstellungsverfahren der Halbleitervorrichtung A semiconductor device and manufacturing method of the semiconductor device
03/23/2006DE19821191B4 Plug-Herstellungsverfahren für Halbleitervorrichtung Plug-manufacturing method for semiconductor device
03/23/2006DE19724221B4 Nichtflüchtiger Speicher Non-volatile memory
03/23/2006DE19713495B4 Verfahren zum rationellen Prüfen und Schaltungsanordnung zur Durchführung des Verfahrens A method for efficient testing and circuit arrangement for performing the method
03/23/2006DE19712777B4 Vorrichtung zum Verhindern des Schmelzens von Heizelektroden in einer Einkristallziehvorrichtung A device for preventing the melting of heating electrodes in a single crystal pulling apparatus
03/23/2006DE112004000572T5 Multi-Chip-Ball-Grid-Array-Gehäuse und Herstellungsverfahren Multi-chip ball grid array package and manufacturing processes
03/23/2006DE112004000564T5 Leiterrahmenstruktur mit Öffnung oder Rille für einen Flipchip in a leaded molded package Leadframe structure with hole or groove for a flip in a leaded molded package
03/23/2006DE10343083B4 Transistor-Halbleiterbauteil Transistor semiconductor device
03/23/2006DE10342775B4 Verfahren zur Ausrichtung eines Halbleiterwafers und Justiermarke A method of aligning a semiconductor wafer alignment mark and
03/23/2006DE10255378B4 Teststruktur zum Bestimmen der Stabilität elektronischer Vorrichtungen die miteinander verbundene Substrate umfassen For determining the stability of electronic devices include test structure, the substrates interconnected
03/23/2006DE10245928B4 Verfahren zur strukturierten, selektiven Matallisierung einer Oberfläche eines Substrats A process for the structured surface of a substrate a selective Matallisierung
03/23/2006DE102005040228A1 Transistor und Verfahren zur Herstellung desselben Of the same transistor and methods for making
03/23/2006DE102005038943A1 Field effect transistor comprises wire channels electrically connecting source and drain regions and arranged in two columns and at least two rows
03/23/2006DE102005036646A1 Halbleiterchip und Herstellungsverfahren Semiconductor chip and the manufacturing method
03/23/2006DE102005036073A1 Ferromagnetische Liner für Leiterbahnen von magnetischen Speicherzellen Ferromagnetic liner for conductor tracks of magnetic memory cells
03/23/2006DE102005035144A1 Belichtungsmaskenherstellungsverfahren, Zeichnungsvorrichtung, Halbleitereinrichtungsherstellungsverfahren und Maskenrohlingsprodukt Exposure mask manufacturing process, drawing device, semiconductor device manufacturing method and mask blank product
03/23/2006DE102005034667A1 Einkapseln von Leiterbahnen von Halbleiter-Einrichtungen Encapsulation of traces of semiconductor devices
03/23/2006DE102005033715A1 Integrated circuit has upper metal traces routed on insulating layer, which electrically connect with conductive vias, and maintain dummy conductive trace and dummy conductive vias in unused and electrically floating condition
03/23/2006DE102005023662A1 Wärmebehandlungseinrichtung und Wärmebehandlungsverfahren Heat treatment device and heat treatment process
03/23/2006DE102005019683A1 Verfahren zur Bildung einer Passivierungsschicht in einem Halbleiterbauelement A method of forming a passivation layer in a semiconductor device
03/23/2006DE102004063946A1 Transistor Transistor
03/23/2006DE102004063643A1 Ions implantation apparatus for use during transistor manufacture, has beam parallelizer to rotate converged/diverged ion beam in synchronization with quadrupole magnet assembly, to implant ions into wafer
03/23/2006DE102004063147A1 Complementary metal-oxide semiconductor image sensor for converting optical image to electric signal, has photodiode with active area covered by p-type impurity area, and color filter layers and micro-lenses formed on the photodiode
03/23/2006DE102004063025A1 Speicherbauelement und Verfahren zur Herstellung desselben Memory device and method of manufacturing the same
03/23/2006DE102004043063A1 Semiconductor device e.g. ROM, operating method, involves operating pin of device in normal operation mode as application-function-pin, where pin is operated in two test operating modes as test pin and application-function pin, respectively
03/23/2006DE102004038063A1 Verfahren zur Herstellung einer Standardzellenanordnung und eine Vorrichtung zur Durchführung des Verfahrens A process for the preparation of a standard cell arrangement and a device for carrying out the method
03/23/2006DE102004037524A1 Display, e.g. liquid crystal display, organic light-emitting display, or plasma display panel, comprises substrate, silane derivative layer, and electrode layer containing conductors
03/23/2006DE102004037297A1 Verfahren zum Korrigieren von Layoutfehlern A method of correcting layout errors
03/23/2006DE102004037252A1 Verfahren zur Integration von drei Bipolartransistoren in einem Halbleiterkörper, Mehrschichtbauelement und Halbleiteranordnung A method for integration of three bipolar transistors in a semiconductor body, multilayer component, and the semiconductor arrangement
03/23/2006DE102004037153A1 Manufacturing method for power semiconductor component forming edge terminal region in edge region of semiconductor material
03/23/2006DE102004036971A1 Technik zur Bewertung lokaler elektrischer Eigenschaften in Halbleiterbauelementen Technique for assessing local electrical properties in semiconductor devices
03/23/2006DE102004036909A1 Halbleiterbasisbauteil mit Verdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung Basic semiconductor device having wiring substrate and intermediate wiring board for a semiconductor component stack and process for their preparation
03/23/2006DE102004036803A1 Verfahren zum Ätzen einer Schicht auf einem Substrat A method for etching a layer on a substrate
03/23/2006DE102004036753A1 Stickstofffreie ARC-Deckschicht und Verfahren zur Herstellung derselben Nitrogen-free ARC-covering layer and method of manufacturing the same
03/23/2006DE102004036509A1 Trench transistor manufacturing method, involves oxidizing and etching top of polysilicon layer and coordinating depth and oxidation of polysilicon layer such that residue polysilicon layer is oxidized in relation to contacting layer
03/23/2006DE102004036387A1 Hochvolt-MOS-Transistor und entsprechendes Herstellungsverfahren High-voltage MOS transistor and corresponding production method
03/23/2006DE102004036220A1 Laserdotierung von Festkörpern mit einem linienfokussierten Laserstrahl und darauf basierende Herstellung von Solarzellen-Emittern Laser doping of solids with a line-focused laser beam and based thereon production of solar cell emitters
03/23/2006DE102004036156A1 Semiconductor memory component has bitline contacts with filling which widens towards top, insulating spacer being mounted on this which improves insulation of wordlines
03/23/2006DE10149885B4 Testwafer und Verfahren zu dessen Herstellung Test wafers and process for its preparation
03/23/2006DE10134101B4 Integrierter Halbleiterspeicher und Herstellungsverfahren Integrated semiconductor memory and manufacturing processes
03/23/2006DE10123858B4 Atomschicht-Abscheidungsverfahren zur Bildung einer Siliciumnitrid-haltigen Dünnschicht Atomic layer deposition method of forming a silicon nitride thin film containing
03/23/2006DE10058782B4 Verfahren zum Herstellen einer Kondensatoranordnung A method for manufacturing a capacitor arrangement
03/22/2006EP1638149A2 Method of manufacture of an heterostructure channel insulated gate field effect transistor and corresponding transistor
03/22/2006EP1638148A2 Semiconductor device and method of manufacturing semiconductor device
03/22/2006EP1638142A2 SRAM cell with stacked thin-film transistors
03/22/2006EP1638141A1 Process for manufacturing composite wafers of semiconductor material by layer transfer
03/22/2006EP1638140A2 Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device
03/22/2006EP1638139A1 Plasma processing device
03/22/2006EP1638138A1 Removing agent composition and removing/cleaning method using same
03/22/2006EP1638137A1 Electron beam microprocessing method
03/22/2006EP1638136A1 Silicon epitaxial wafer manufacturing method and silicon epitaxial wafer
03/22/2006EP1638135A2 Susceptor with surface roughness for high temperature substrate processing
03/22/2006EP1638134A2 Thin plate supporting container
03/22/2006EP1638040A1 Method of building electronic label for electronic device
03/22/2006EP1637950A1 Device for dividing and feeding gas flow from flow rate- regulating device-equipped gas-feeding equipment to chamber
03/22/2006EP1637931A1 Lithographic apparatus and device manufacturing method
03/22/2006EP1637894A2 Boundary scan chain routing
03/22/2006EP1637893A1 Method and apparatus for testing electrical characteristics of object under test
03/22/2006EP1637892A1 Electronic component handling device, and method for temperature application in electronic component handling device
03/22/2006EP1637624A1 Thin film forming device and thin film forming method
03/22/2006EP1637238A1 Method for controlled cavitation
03/22/2006EP1636860A2 Methods for forming patterns of a filled dielectric material on substrates
03/22/2006EP1636855A2 Gallium arsenide hbt having increased performance and method for its fabrication
03/22/2006EP1636853A2 Steady-state-non-equilibrium distribution of free carriers and photon energy up-conversion using same
03/22/2006EP1636852A1 Body-tied soi transistor and method for fabrication thereof
03/22/2006EP1636851A1 Prevention of a parasitic channel in an integrated soi process
03/22/2006EP1636849A2 Mirror image non-volatile memory cell transistor pairs with single poly layer
03/22/2006EP1636848A1 Semiconductor device
03/22/2006EP1636846A1 Integrated circuit arrangement with npn and pnp bipolar transistors and corresponding production method
03/22/2006EP1636843A1 Package for a high-frequency electronic device
03/22/2006EP1636842A2 Stackable semiconductor device and method of manufacturing the same
03/22/2006EP1636840A1 Micro lead frame package and method to manufacture the micro lead frame package
03/22/2006EP1636837A2 Coiled circuit device and method of making the same
03/22/2006EP1636836A1 Method for the production of semi-conductor chips
03/22/2006EP1636835A1 System and method for integrating in-situ metrology within a wafer process
03/22/2006EP1636834A1 Floating gate structures with vertical projections
03/22/2006EP1636833A2 Plasma spraying for joining silicon parts
03/22/2006EP1636832A1 A method of fault detection in manufacturing equipment
03/22/2006EP1636831A2 Three-dimensional integrated circuit structure and method of making same
03/22/2006EP1636830A2 Strained-silicon-on-insulator single- and double-gate mosfet and method for forming the same
03/22/2006EP1636829A2 Patterned thin film graphite devices and method for making same
03/22/2006EP1636828A2 Compositions and methods for high-efficiency cleaning/polishing of semiconductor wafers
03/22/2006EP1636827A2 Thermoplastic fluxing underfill composition and method
03/22/2006EP1636826A2 Compound used to form a self-assembled monolayer, layer structure, semiconductor component having a layer structure, and method for producing a layer structure
03/22/2006EP1636653A2 Adhesion method using gray-scale photolithography
03/22/2006EP1636555A2 Polarization modulation photoreflectance characterization of semiconductor quantum confined structures
03/22/2006EP1636400A1 Method and apparatus for generating a precursor for a semiconductor processing system
03/22/2006EP1636130A2 Integrated circuit on high performance chip