Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2006
03/28/2006US7018484 Semiconductor-on-insulator silicon wafer and method of formation
03/28/2006US7018482 Method of manufacturing electronic devices, and apparatus for carrying out such a method
03/28/2006US7018481 Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzle
03/28/2006US7018479 Rotating semiconductor processing apparatus
03/28/2006US7018478 Method of growing a thin film onto a substrate
03/28/2006US7018472 Photoresist applying device and applying method therefor
03/28/2006US7018468 Process for long crystal lateral growth in silicon films by UV and IR pulse sequencing
03/28/2006US7018276 Air platen for leading edge and trailing edge control
03/28/2006US7018275 Closed-loop control of wafer polishing in a chemical mechanical polishing system
03/28/2006US7018274 Polishing pad having slurry utilization enhancing grooves
03/28/2006US7018271 Method for monitoring a substrate during chemical mechanical polishing
03/28/2006US7018270 Method and apparatus for cutting semiconductor wafers
03/28/2006US7018269 Pad conditioner control using feedback from a measured polishing pad roughness level
03/28/2006US7018268 Protection of work piece during surface processing
03/28/2006US7018162 Articulated carrying device
03/28/2006US7017896 Jig for adjusting curvature of substrate
03/28/2006US7017830 Method and apparatus for separating sample
03/28/2006US7017821 Individual configuration
03/28/2006US7017794 Wire bonding method and wire bonding apparatus
03/28/2006US7017791 Ultrasonic bonding method and device
03/28/2006US7017758 Wafer protective cassette
03/28/2006US7017750 Thin plate storage container
03/28/2006US7017749 Precision substrate storage container and retaining member therefor
03/28/2006US7017662 High temperature environment tool system and method
03/28/2006US7017658 Heat processing device
03/28/2006US7017654 Apparatus and method of forming channels in a heat-exchanging device
03/28/2006US7017652 Method and apparatus for transferring heat from a substrate to a chuck
03/28/2006US7017638 Forming folded-stack packaged device using vertical progression folding tool
03/28/2006US7017637 Thin film forming apparatus and thin film forming method
03/28/2006US7017636 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
03/28/2006US7017597 Megasonic cleaning apparatus for fabricating semiconductor device
03/28/2006US7017594 Atmospheric pressure non-thermal plasma device to clean and sterilize the surfaces of probes, cannulas, pin tools, pipettes and spray heads
03/28/2006US7017570 Apparatus and method for splitting substrates
03/28/2006US7017514 Method and apparatus for plasma optimization in water processing
03/28/2006US7017430 Inspection device and inspection method of dielectric film, and method of manufacturing semiconductor device
03/28/2006US7017428 Test kit for semiconductor package and method for testing semiconductor package using the same
03/28/2006US7017281 Substrate processing apparatus and substrate processing method drying substrate by spraying gas
03/28/2006US7017269 Suspended gas distribution plate
03/28/2006US7017258 Mounting system for high-mass heatsinks
03/28/2006US7017248 Device for coupling PCB sheet
03/28/2006CA2333973C Scaleable integrated data processing device
03/23/2006WO2006031975A2 Improved systems and methods for wafer translation
03/23/2006WO2006031956A2 Multi-single wafer processing apparatus
03/23/2006WO2006031654A2 Hemt device and method of making
03/23/2006WO2006031452A2 Apparatus for the optimization of atmospheric plasma in a plasma processing system
03/23/2006WO2006031270A1 System and methods for surface cleaning
03/23/2006WO2006031257A2 METHOD FOR GROWING Si-Ge SEMICONDUCTOR MATERIALS AND DEVICES ON SUBSTRATES
03/23/2006WO2006031247A2 Method of creating defect free high ge content (25%) sige-on-insulator (sgoi) substrates using wafer bonding techniques
03/23/2006WO2006031235A1 Method for preapplying underfill to a microelectronic packaging and microelectronic packages formed thereby
03/23/2006WO2006030953A1 Substrate cleaning treatment apparatus and substrate treatment unit
03/23/2006WO2006030937A1 Semiconductor device
03/23/2006WO2006030918A1 Method for fabrication of group iii nitride semiconductor
03/23/2006WO2006030910A1 Substrate for exposure, exposure method and device manufacturing method
03/23/2006WO2006030908A1 Substrate holding apparatus, exposure apparatus and device manufacturing method
03/23/2006WO2006030902A1 Exposure apparatus, exposure method, and method for manufacturing device
03/23/2006WO2006030895A1 Plasma processing apparatus and plasma processing method
03/23/2006WO2006030884A1 Thin film producing method
03/23/2006WO2006030857A1 Heat treatment apparatus and substrate manufacturing method
03/23/2006WO2006030849A1 Semiconductor manufacturing equipment and semiconductor device manufacturing method
03/23/2006WO2006030816A1 Cleaning system of sulfuric acid recycling type and persulfuric acid feeder of sulfuric acid recycling type
03/23/2006WO2006030775A1 Coating method and coating device
03/23/2006WO2006030727A1 Correction method and exposure device
03/23/2006WO2006030714A1 Liquid and method for removing deteriorated layer of copper containing copper oxide
03/23/2006WO2006030699A1 Soi wafer manufacturing method and soi wafer
03/23/2006WO2006030684A1 Projection optical system, production method for projection optical system, exposure system and exposure method
03/23/2006WO2006030674A1 Flip chip mounting method and flip chip mounting element
03/23/2006WO2006030641A1 Composition for forming antireflective film and wiring forming method using same
03/23/2006WO2006030627A1 Reflective mask blank for euv lithography and method for producing same
03/23/2006WO2006030617A1 METHOD OF VAPOR-PHASE GROWING, AND VAPOR-PHASE GROWING APPARATUS, FOR AlGaN
03/23/2006WO2006030611A1 Function element mounting module and manufacturing method thereof
03/23/2006WO2006030609A1 Lactone compound, lactone-containing monomer, polymer of those, resist composition using same, method for forming pattern using same
03/23/2006WO2006030604A1 Resist composition and method for forming resist pattern
03/23/2006WO2006030595A1 Polishing slurry for cmp
03/23/2006WO2006030380A1 A sonos memory device with optimized shallow trench isolation
03/23/2006WO2006030148A1 Optical structure provided with at least two elements assembled by molecular adhesion and method for assembling said two elements
03/23/2006WO2006030016A1 Improved semiconductor scheme for reduced circuit area in a simplified process using silicide interconnects
03/23/2006WO2006009578A3 High-resolution in-plane tuning fork gyroscope and methods of fabrication
03/23/2006WO2006003584A3 Field-effect transistors fabricated by wet chemical deposition
03/23/2006WO2005086237A3 Ldmos transistor and method of making the same
03/23/2006WO2005072472A3 Method of manufacturing non-volatile dram
03/23/2006WO2005037418A3 Processes for fabricating conductive patterns using nanolithography as a patterning tool
03/23/2006WO2005034181A3 Method for monitoring status of system components
03/23/2006US20060064272 Semiconductor device having a test circuit for testing an output circuit
03/23/2006US20060064191 Semiconductor device and semiconductor production management system
03/23/2006US20060063472 Method for polishing substrate
03/23/2006US20060063395 Manufacturing method of a semiconductor device
03/23/2006US20060063394 Precursors for film formation
03/23/2006US20060063393 Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
03/23/2006US20060063392 Deposition and patterning of boron nitride nanotube ILD
03/23/2006US20060063391 Method of forming silicon oxynitride layer in semiconductor device and apparatus of forming the same
03/23/2006US20060063390 Hdpcvd process and method for improving uniformity of film thickness
03/23/2006US20060063389 Structure having a shallow trench-deep trench isolation region for a BiCMOS/CMOS technology
03/23/2006US20060063388 Method for using a water vapor treatment to reduce surface charge after metal etching
03/23/2006US20060063387 Method of Patterning Surfaces While Providing Greater Control of Recess Anisotropy
03/23/2006US20060063386 Method for photoresist stripping and treatment of low-k dielectric material
03/23/2006US20060063385 Etching method and computer-readable storage medium
03/23/2006US20060063384 Mask patterns for semiconductor device fabrication and related methods and structures
03/23/2006US20060063383 CMP process endpoint detection method by monitoring and analyzing vibration data
03/23/2006US20060063382 Method to fabricate copper-cobalt interconnects
03/23/2006US20060063381 Method for fabricating an integrated circuit arrangement which contains a metal nitride layer, and integrated circuit arrangement