Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2006
03/21/2006CA2127238C Photopolymerisable compositions
03/16/2006WO2006029414A2 Method of making a microelectronic and/or optoelectronic circuitry sheet
03/16/2006WO2006029388A2 Method and apparatus for fabricating low-k dielectrics, conducting films, and strain-controlling conformable silica-carbon materials
03/16/2006WO2006029374A2 System and method for processing a wafer including stop-on-aluminum processing
03/16/2006WO2006029363A1 Methods of cleaning optical substrates
03/16/2006WO2006029250A2 Process and fabrication methods for emitter wrap through back contact solar cells
03/16/2006WO2006029169A2 Grooved substrates for uniform underfilling solder ball assembled electronic devices
03/16/2006WO2006029160A2 Copper processing using an ozone-solvent solution
03/16/2006WO2006029096A1 Thermally controlled fluidic self-assembly
03/16/2006WO2006029091A2 Thermally controlled fluidic self-assembly method and support
03/16/2006WO2006029061A1 A method for making a semiconductor device that includes a metal gate electrode
03/16/2006WO2006029025A2 Substrate carrier having reduced height
03/16/2006WO2006028983A2 Megasonic processing system with gasified fluid
03/16/2006WO2006028942A2 Thermally controlled self-assembly method and support
03/16/2006WO2006028858A2 Methods of removing photoresist on substrates
03/16/2006WO2006028844A1 Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors
03/16/2006WO2006028811A2 Amorphous silicon thin-film transistors and methods of making the same
03/16/2006WO2006028793A1 Metal oxide semiconductor device including a shielding structure for low gate-drain capacitance
03/16/2006WO2006028777A1 Dram cells with vertical u-shaped transistors
03/16/2006WO2006028775A2 Dram transistor with a gate buried in the substrate and method of forming thereof
03/16/2006WO2006028731A2 Multiple-depth sti trenches in integrated circuit fabrication
03/16/2006WO2006028705A2 Mask material conversion
03/16/2006WO2006028690A1 A method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
03/16/2006WO2006028673A1 Etch with uniformity control
03/16/2006WO2006028597A2 Laser separation of encapsulated submount
03/16/2006WO2006028577A2 Using different gate dielectrics with nmos and pmos transistors of a complementary metal oxide semiconductor integrated circuit
03/16/2006WO2006028568A1 Soft de-chucking sequence
03/16/2006WO2006028299A1 Antiferromagnetic half metallic semiconductor and method for forming the same
03/16/2006WO2006028260A1 Method and apparatus for forming metal film
03/16/2006WO2006028228A1 Glass substrate storage case, glass substrate exchange device, glass substrate management device, glass substrate distribution method, seal member, and seal structure using the seal member
03/16/2006WO2006028215A1 Thin film capacitor, method for forming same, and computer readable recording medium
03/16/2006WO2006028195A1 Wireless chip
03/16/2006WO2006028188A1 Stage apparatus and exposure apparatus
03/16/2006WO2006028173A1 Coating/developing apparatus, exposure apparatus and resist pattern forming method
03/16/2006WO2006028168A1 Photomask blank and photomask
03/16/2006WO2006028066A1 Pattern generation method
03/16/2006WO2006028040A1 Wafer chuck
03/16/2006WO2006028017A1 Method for producing silicon wafer
03/16/2006WO2006028014A1 Resist composition and process for formation of resist patterns
03/16/2006WO2006027997A1 Electron-beam or euv (extreme ultraviolet) resist composition and process for the formation of resist patterns
03/16/2006WO2006027996A1 Resist composition for euv and method of forming resist pattern
03/16/2006WO2006027972A1 Plasma processing apparatus
03/16/2006WO2006027942A1 Immersion liquid for liquid immersion lithography process and method for forming resist pattern using such immersion liquid
03/16/2006WO2006027928A1 Photomask blank, photomask and method for producing those
03/16/2006WO2006027920A1 Nonvolatile semiconductor storage device
03/16/2006WO2006027912A1 Semiconductor device
03/16/2006WO2006027909A1 Pump unit for feeding chemical liquid
03/16/2006WO2006027900A1 Coating and developing apparatus, resist pattern forming method, exposure apparatus and cleaning apparatus
03/16/2006WO2006027891A1 Substrate cleaning method and developing apparatus
03/16/2006WO2006027778A2 Core-alloyed shell semiconductor nanocrystals
03/16/2006WO2006027739A2 Semiconductor devices and methods of manufacture thereof
03/16/2006WO2006027332A1 Method for selective etching
03/16/2006WO2006026974A2 Dmos-transistor and corresponding production method
03/16/2006WO2006026886A1 Substrate processing system
03/16/2006WO2006008747A3 On-chip inductor
03/16/2006WO2006007142A3 Ultra-thin die and method of fabricating same
03/16/2006WO2006001001A3 An electroluminescent device for the production of ultra-violet light
03/16/2006WO2005122275A3 Semiconductor on insulator semiconductor device and method of manufacture
03/16/2006WO2005093116A3 Replacing chamber components in a vacuum environment
03/16/2006WO2005056499A3 Oligo(p-phenylene vinylene) amphiphiles and methods for self-assembly
03/16/2006WO2005038995A3 Memory link processing with picosecond lasers
03/16/2006WO2005031233A3 Thermal processing system with cross-flow liner
03/16/2006WO2005027200A3 Method and device for contacting vo semiconductor chips on a metallic substrate
03/16/2006US20060059501 Method of manufacturing an optical data storage medium, optical data storage medium and apparatus for performing said method
03/16/2006US20060059445 Method of designing wiring structure of semiconductor device and wiring structure designed accordingly
03/16/2006US20060058489 Silicon-containing compositions for spin-on arc/hardmask materials
03/16/2006US20060057942 Polishing apparatus, polishing head and polishing method
03/16/2006US20060057886 Holding device for holding an electronic component
03/16/2006US20060057875 Probe card covering system and method
03/16/2006US20060057866 Microelectronic packaging and components
03/16/2006US20060057861 Movable operating device and method of controlling the movable operating device
03/16/2006US20060057860 Manufacturing method of semiconductor device and semiconductor manufacturing device
03/16/2006US20060057859 Buffer layer for selective SiGe growth for uniform nucleation
03/16/2006US20060057858 Method for oxidation of a layer and corresponding holder device for a substrate
03/16/2006US20060057857 Aperture masks for circuit fabrication
03/16/2006US20060057856 Manufacturing method for strained silicon wafer
03/16/2006US20060057855 Method for making toughening agent materials
03/16/2006US20060057854 High frequency power supply device and plasma generator
03/16/2006US20060057853 Thermal oxidation for improved silicide formation
03/16/2006US20060057852 Process for low k dielectric plasma etching with high selectivity to deep uv photoresist
03/16/2006US20060057851 Method for fabricating fine features by jet-printing and surface treatment
03/16/2006US20060057850 Method of manufacturing carrier wafer and resulting carrier wafer structures
03/16/2006US20060057849 Apparatus and method for stripping silicon nitride
03/16/2006US20060057848 Method for preparing a deep trench and an etching mixture for the same
03/16/2006US20060057847 Resin forming mold and production method for the resin forming mold
03/16/2006US20060057846 Composition for use as sanitary earthenware material, method for production thereof, method for manufacturing sanitary earthenware using said composition
03/16/2006US20060057845 Method of forming nickel-silicon compound, semiconductor device, and semiconductor device manufacturing method
03/16/2006US20060057844 Structure and method for enhanced uni-directional diffusion of cobalt silicide
03/16/2006US20060057843 Methods and apparatus for forming barrier layers in high aspect ratio vias
03/16/2006US20060057842 Ultra-thick metal-copper dual damascene process
03/16/2006US20060057841 Interconnection structure for IC metallization
03/16/2006US20060057840 Guard ring for improved matching
03/16/2006US20060057839 Method and apparatus for forming metal film
03/16/2006US20060057838 Low k ILD layer with a hydrophilic portion
03/16/2006US20060057837 Treating agent materials
03/16/2006US20060057836 Method of stacking thin substrates by transfer bonding
03/16/2006US20060057835 Air-gap insulated interconnections
03/16/2006US20060057834 Semiconductor device and fabrication process thereof
03/16/2006US20060057833 Method of forming solder ball, and fabricating method and structure of semiconductor package using the same
03/16/2006US20060057832 Wafer level packages and methods of fabrication