| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/09/2006 | US20060050274 Management system, apparatus, and method, exposure apparatus, and control method therefor |
| 03/09/2006 | US20060050259 Exposure apparatus and method, and device fabricating method using the same |
| 03/09/2006 | US20060050258 Projection system for EUV lithography |
| 03/09/2006 | US20060050257 Exposure apparatus and device manufacturing method |
| 03/09/2006 | US20060050220 Liquid crystal display device |
| 03/09/2006 | US20060049838 Pattern evaluation method, manufacturing method of semiconductor device, correction method of mask pattern and manufacturing method of exposure mask |
| 03/09/2006 | US20060049531 Semiconductor package having a partial slot cover for encapsulation process |
| 03/09/2006 | US20060049530 Method of embedding semiconductor chip in support plate and embedded structure thereof |
| 03/09/2006 | US20060049529 Flip chip metal bonding to plastic leadframe |
| 03/09/2006 | US20060049526 Processing methods of forming an electrically conductive plug to a node location |
| 03/09/2006 | US20060049522 Grooved substrates for uniform underfilling solder ball assembled electronic devices |
| 03/09/2006 | US20060049517 Flip chip semiconductor device and manufacturing method thereof |
| 03/09/2006 | US20060049516 Nickel/gold pad structure of semiconductor package and fabrication method thereof |
| 03/09/2006 | US20060049514 Semiconductor device with reduced contact resistance |
| 03/09/2006 | US20060049505 High density interconnect power and ground strap and method therefor |
| 03/09/2006 | US20060049503 Substrate-based housing component with a semiconductor chip |
| 03/09/2006 | US20060049498 Methods of making microelectronic assemblies including compliant interfaces |
| 03/09/2006 | US20060049487 Semiconductor device and method of manufacturing the same |
| 03/09/2006 | US20060049486 Method of self-assembling electronic circuitry and circuits formed thereby |
| 03/09/2006 | US20060049484 Semiconductor device |
| 03/09/2006 | US20060049469 Integrated semiconductor circuit comprising a transistor and a strip conductor |
| 03/09/2006 | US20060049461 Thin-film transistor with vertical channel region |
| 03/09/2006 | US20060049459 Semiconductor device and manufacturing method thereof |
| 03/09/2006 | US20060049457 Semiconductor device and method of fabricating the same |
| 03/09/2006 | US20060049456 Insulated gate semiconductor device and method of manufacturing insulated gate semiconductor device |
| 03/09/2006 | US20060049453 Vertical insulated gate transistor and manufacturing method |
| 03/09/2006 | US20060049451 Non-volatile memory integrated circuit |
| 03/09/2006 | US20060049450 Non-volatile memory integrated circuit |
| 03/09/2006 | US20060049446 Method for manufacturing a semiconductor device |
| 03/09/2006 | US20060049443 Flip FERAM cell and method to form same |
| 03/09/2006 | US20060049442 Methods for fabricating ferroelectric memory devices |
| 03/09/2006 | US20060049439 Image device and method of fabricating the same |
| 03/09/2006 | US20060049437 CMOS image sensors and methods for fabricating the same |
| 03/09/2006 | US20060049431 Solid-state image sensor |
| 03/09/2006 | US20060049428 Tft electronic devices and their manufacture |
| 03/09/2006 | US20060049413 Array substrate with reduced pixel defect, method of manufacturing the same and liquid crystal display panel having the same |
| 03/09/2006 | US20060049411 Method for fabricating group-III nitride devices and devices fabricated using method |
| 03/09/2006 | US20060049406 Power semiconductor and method of fabrication |
| 03/09/2006 | US20060049399 Germanium-on-insulator fabrication utilizing wafer bonding |
| 03/09/2006 | US20060049382 Metal surface protective film forming agent and use thereof |
| 03/09/2006 | US20060049143 Polishing composition and polishing method using the same |
| 03/09/2006 | US20060049142 Apparatus and method for polishing semiconductor wafer |
| 03/09/2006 | US20060049140 Method and apparatus for liquid etching |
| 03/09/2006 | US20060049056 Electropolishing and electroplating methods |
| 03/09/2006 | US20060048896 Apparatus and method for fabricating bonded substrate |
| 03/09/2006 | US20060048894 Dry etching apparatus, etching method, and method of forming a wiring |
| 03/09/2006 | US20060048893 Atmospheric pressure plasma processing reactor |
| 03/09/2006 | US20060048892 Plasma processing method for working the surface of semiconductor devices |
| 03/09/2006 | US20060048889 Method for connecting a chip and a substrate |
| 03/09/2006 | US20060048801 Tungsten plug corrosion prevention method using gas sparged water |
| 03/09/2006 | US20060048711 Systems and methods of forming tantalum silicide layers |
| 03/09/2006 | US20060048710 Substrate processing apparatus |
| 03/09/2006 | US20060048707 Anti-clogging nozzle for semiconductor processing |
| 03/09/2006 | US20060048706 Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device by using the same |
| 03/09/2006 | US20060048697 Monitoring and control of a fabrication process |
| 03/09/2006 | US20060048696 Methods of crystal precipitation |
| 03/09/2006 | US20060048572 Physical quantity sensor and method for manufacturing the same |
| 03/09/2006 | US20060048379 Board carrier component mounter, and method for carrying board in component mounting |
| 03/09/2006 | US20060048376 Forming ferroelectric polymer memories |
| 03/09/2006 | US20060048333 Tool for cleaning particles from wafer stage |
| 03/09/2006 | DE60019255T2 Verfahren und Vorrichtung zur Trimmung von elektronischen Schaltungen Method and apparatus for trimming of electronic circuits |
| 03/09/2006 | DE20321146U1 Gluing microcomponents to substrate for assembling electronic or mechanical microsystems involves initial fusing of precise pattern of hot-melt adhesive |
| 03/09/2006 | DE20321073U1 Device for accommodating substrates, especially for making photovoltaic elements, has carrier counter element arranged to limit vertical movement of substrate relative to walls |
| 03/09/2006 | DE19807009B4 Verfahren zur Herstellung einer nichtflüchtigen Speichereinrichtung mit Programmierleitungen A method of manufacturing a nonvolatile memory device comprising programming lines |
| 03/09/2006 | DE19746448B4 DRAM-Zelle mit einem vertikalen Kanal, welche auf einer isolierenden Schicht gebildet ist, sowie ein Herstellungsverfahren für diese DRAM-Zelle DRAM cell comprising a vertical duct, which is formed on an insulating layer, and a manufacturing method for this DRAM cell |
| 03/09/2006 | DE19723431B4 Mit einer ESD-Schutzschaltung versehenes Halbleiterbauelement With an ESD protection circuit provided semiconductor component |
| 03/09/2006 | DE19623450B4 Fotomaske und deren Verwendung Photomask and their use |
| 03/09/2006 | DE19527682B4 Verfahren zur Herstellung einer EEPROM-Flashzelle A method of manufacturing a flash EEPROM cell |
| 03/09/2006 | DE10358909B4 Plasma-CVD-Vorrichtung sowie Beschichtungsverfahren und Verfahren zur Herstellung eines Halbleiterbauteils unter Verwendung derselben Plasma CVD coating method and apparatus as well as method of manufacturing a semiconductor device using the same |
| 03/09/2006 | DE10357756B4 Verfahren zur Herstellung von Metall-Oxynitriden durch ALD-Prozesse unter Verwendung von NO und/oder N2O A process for the production of metal oxynitrides by ALD processes using NO and / or N2O |
| 03/09/2006 | DE10334946B4 Verfahren zum Ausbilden einer selbstjustierenden Buried-Strap-Verbindung A method for forming a self-aligned buried strap connection |
| 03/09/2006 | DE10308064B4 Poliermittelzuführung bei CMP-Prozessen Slurry supplying in CMP processes |
| 03/09/2006 | DE10227492B4 Verfahren zur Herstellung eines Deep-Trench-Kondensators für dynamische Speicherzellen A process for producing a deep trench capacitor memory cells for dynamic |
| 03/09/2006 | DE10203146B4 Einspannfutteranordnung eines Ätzgerätes zum Verhindern von Nebenprodukten Einspannfutteranordnung a Ätzgerätes for preventing by-products |
| 03/09/2006 | DE102005042780A1 Halbleiteranordnung mit einer Lotschicht auf Zinnbasis und Verfahren zum Herstellen derselben A semiconductor device with a solder layer and a tin-based method for manufacturing the same |
| 03/09/2006 | DE102005040213A1 Manufacturing semiconductor device involves depositing photosensitive layer to cover exposed portion of electrode, and subjecting photosensitive layer to photolithography to partially remove photosensitive layer |
| 03/09/2006 | DE102005039564A1 Halbleiterbauteil und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 03/09/2006 | DE102005038152A1 Halbleiterbauteil und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 03/09/2006 | DE102005030675A1 Fabrication of organic thin film transistor useful for liquid crystal display device, by forming organic active pattern on gate insulating layer using rear exposing process, and forming source and drain electrodes on organic active pattern |
| 03/09/2006 | DE102005025802A1 Lift device has frame and vertically movable carriage on lift cylinder whose horizontal movement is converted by cable pulley into vertical movement of carriage in the frame |
| 03/09/2006 | DE102005011348A1 Halbleitervorrichtung Semiconductor device |
| 03/09/2006 | DE102004051442A1 Wafer-Level-Package-Herstellungsverfahren unter Verwendung von Laserbestrahlung Wafer-level package manufacturing method using laser irradiation |
| 03/09/2006 | DE102004043305A1 Selbstorganisierende Formulierungen und ihre Verwendung als Bausteine in funktionalen Bauteilen Self-organizing formulations and their use as building blocks in functional components |
| 03/09/2006 | DE102004042755A1 Optical sensor unit, comprises a housing, a frame, an optical sensor chip, wire connections for the chips, and a pacifying agent |
| 03/09/2006 | DE102004042167A1 Verfahren zum Ausbilden einer Halbleiterstruktur, die Transistorelemente mit unterschiedlich verspannten Kanalgebieten umfasst Includes methods of forming a semiconductor structure, the transistor elements with differently strained channel regions |
| 03/09/2006 | DE102004042156A1 Transistor mit asymmetrischem Source/Drain- und Halo- Implantationsgebiet und Verfahren zum Herstellen desselben Of the same transistor with an asymmetrical source / drain and halo implant region and process for producing |
| 03/09/2006 | DE102004041088A1 Halbleiterbauteil in Flachleitertechnik mit einem Halbleiterchip Semiconductor device in flat wire technology with a semiconductor chip |
| 03/09/2006 | DE102004040798A1 Mask for a semiconductor structure formed by applying a moulding layer over the whole structure, structuring, applying a hard mask, planarising and removing the remaining moulded layer |
| 03/09/2006 | DE102004040765A1 Halbleiterspeicher und Verfahren zur Herstellung des Halbleiterspeichers A semiconductor memory and method of manufacturing the semiconductor memory |
| 03/09/2006 | DE102004030354B3 Method of manufacturing an integrated semiconductor circuit with a conductor structure embedded in the substrate in which the concentrations of dopant in overlapping regions are greatly varied by diffusion |
| 03/09/2006 | DE10062014B4 Verfahren zum Dünnen und Separieren selektierter Bereiche dünner Scheiben Method of thinning and separation of selected areas of thin slices |
| 03/08/2006 | EP1633004A2 Guard ring for semiconductor devices |
| 03/08/2006 | EP1633003A2 GaN epitaxial substrate and semiconductor element |
| 03/08/2006 | EP1633001A1 Frequency converting circuit of direct conversion reception, semiconductor integrated circuit thereof, and direct conversion receiver |
| 03/08/2006 | EP1633000A1 Mixer circuit |
| 03/08/2006 | EP1632997A2 Substrate dividing method |
| 03/08/2006 | EP1632996A2 Integrated circuit comprising copper lines and process for manufacturing copper lines |
| 03/08/2006 | EP1632995A2 Oxygen free plasma stripping process |
| 03/08/2006 | EP1632994A1 Plasma processing apparatus and plasma processing method |
| 03/08/2006 | EP1632993A1 Production method for semiconductor wafer |