Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2006
03/08/2006EP1632992A1 Method for improving surface roughness of processed film of substrate and apparatus for processing substrate
03/08/2006EP1632990A2 Capacitor electrode for a ferroelectric memory cell and method for fabricating the same
03/08/2006EP1632989A2 Processing apparatus
03/08/2006EP1632953A1 Supporting unit, and moving table device and linear-motion guiding device using the supporting unit
03/08/2006EP1632590A2 Thick single crystal diamond layer method for making it and gemstones produced from the layer
03/08/2006EP1632466A1 Piezoelectric material working method
03/08/2006EP1632110A2 Retention mechanism for heating coil of high temperature diffusion furnace
03/08/2006EP1631990A2 Field effect transistor, especially a double diffused field effect transistor, and method for the production thereof
03/08/2006EP1631989A1 Gate-induced strain for performance improvement of a mos semiconductor device
03/08/2006EP1631986A1 A method of preparation of an epitaxial substrate
03/08/2006EP1631985A1 Method of manufacturing a substrate, having a porous dielectric layer and air gaps, and a substrate
03/08/2006EP1631984A1 Method for obtaining a structure having a supporting substrate and an ultra-thin layer
03/08/2006EP1631983A1 Method for simultaneously obtaining a pair of substrates covered by a useful layer
03/08/2006EP1631982A1 Method for production of a very thin layer with thinning by means of induced self-support
03/08/2006EP1631981A2 Method of room temperature covalent bonding
03/08/2006EP1631980A2 Methods of incorporating germanium within cmos process
03/08/2006EP1631966A2 Transplanted magnetic random access memory (mram) devices on thermally-sensitive substrates using laser transfer and method for making the same
03/08/2006EP1631964A2 Ferroelectric memory device
03/08/2006EP1631728A1 Profiled rail and method for producing a profiled rail
03/08/2006EP1631701A2 Atmospheric pressure non-thermal plasma device to clean and sterilize the surface of probes, cannulas, pin tools, pipettes and spray heads
03/08/2006EP1631697A1 Electrochemical method for the direct nanostructured deposition of material onto a substrate, and semiconductor component produced according to said method
03/08/2006EP1631416A2 Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
03/08/2006EP1631415A1 Focusing an optical beam to two foci
03/08/2006EP1631396A2 Megasonic cleaning using supersaturated cleaning solution
03/08/2006EP1579494A4 N-channel pull-up element logic circuit
03/08/2006EP1579273A4 System and method for aerial image sensing
03/08/2006EP1573804A4 Methods of forming structure and spacer and related finfet
03/08/2006EP1535309A4 Radiation detector
03/08/2006EP1463628A4 Nanocrystal structures
03/08/2006EP1423873B1 Method for obtaining a self-supported semiconductor thin film for electronic circuits
03/08/2006EP1397260A4 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
03/08/2006EP1349794A4 System for preventing improper insertion of foup door into foup
03/08/2006EP1339622A4 Wafer carrier with stacking adaptor plate
03/08/2006EP1315792B1 Composition for cleaning chemical mechanical planarization apparatus
03/08/2006EP1309820A4 Automatic refill system for ultra pure or contamination sensitive chemicals
03/08/2006EP1305829A4 Solder bar for high power flip chips
03/08/2006EP1300878B1 Device for plasma processing
03/08/2006EP1196015B1 Method for soldering and soldered joint
03/08/2006EP1188097B1 Robot pre-positioning in a wafer processing system
03/08/2006EP1167559B1 Composite material and use thereof
03/08/2006EP1166090B8 Device for rapidly measuring angle-dependent diffraction effects on finely structured surfaces
03/08/2006EP0870188B8 Variable spot-size scanning apparatus
03/08/2006EP0608335B1 Structure for suppression of field inversion caused by charge build-up in the dielectric
03/08/2006CN2763969Y Machine for removing burr in support rod of plastics packaged integrated circuit
03/08/2006CN2763968Y Chemical-mechanical abrading device
03/08/2006CN2763965Y Long service life ion source cathode
03/08/2006CN2763899Y Glass substrate
03/08/2006CN2762970Y Transferring robot
03/08/2006CN1745487A Electronic devices
03/08/2006CN1745483A Method for producing a semiconductor component
03/08/2006CN1745480A Array board liquid crystal display and method for producing array board
03/08/2006CN1745474A SOI structure comprising substrate contacts on both sides of the box, and method for the production of such a structure
03/08/2006CN1745473A Method for producing bit lines for ucp flash memories
03/08/2006CN1745472A Adaptive negative differential resistance device
03/08/2006CN1745471A Sacrificial metal liner for copper interconnects
03/08/2006CN1745470A Method for inspection, process for making analytic piece, method for analysis, analyzer, process for producing soi wafer, and soi wafer
03/08/2006CN1745469A Method for fabrication of semiconductor device
03/08/2006CN1745468A Large-area nanoenabled macroelectronic substrates and uses therefor
03/08/2006CN1745467A Method for manufacturing display device
03/08/2006CN1745466A Method of manufacturing semiconductor device and display device
03/08/2006CN1745465A Method of manufacturing display device
03/08/2006CN1745464A Method for manufacturing semi-transparent semi-reflective electrode substrate, reflective element substrate, method for manufacturing same, etching composition used for the method for manufacturing th
03/08/2006CN1745463A Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method
03/08/2006CN1745462A Manufacture method of display device
03/08/2006CN1745461A Manufacturing method for display device
03/08/2006CN1745460A CMP polishing compound and polishing method
03/08/2006CN1745459A 半导体装置 Semiconductor device
03/08/2006CN1745458A Thin-film semiconductor component and production method for said component
03/08/2006CN1745457A Projection optical system, exposure apparatus, and exposure method
03/08/2006CN1745456A Installation for processing a substrate
03/08/2006CN1745455A Apparatus and methods for dispensing fluids with rotatable dispense arms
03/08/2006CN1745311A TCP handling device and positional deviation correcting method for the same
03/08/2006CN1745193A 半导体装置 Semiconductor device
03/08/2006CN1745153A Adhesive sheet and layered product
03/08/2006CN1744970A Vacuum suction head
03/08/2006CN1744954A Biological control of nanoparticles
03/08/2006CN1744939A Process for decomposing fluorine compounds
03/08/2006CN1744777A Laser induced thermal imaging method and a method of fabricating organic light emitting display
03/08/2006CN1744771A Organic light emitting display with circuit measuring pad and method of fabricating the same
03/08/2006CN1744439A Level shifter circuit, display device and its driving circuit and stress test method
03/08/2006CN1744337A Nitride-based compound semiconductor light emitting device
03/08/2006CN1744329A Semiconductor device having super junction structure and method for manufacturing the same
03/08/2006CN1744328A Multiple-charcter storage device and forming method thereof
03/08/2006CN1744327A Thin-layer chemical transistor and making method
03/08/2006CN1744326A 外延基底和半导体元件 Epitaxial substrate and the semiconductor element
03/08/2006CN1744323A Method for fabricating CMOS image sensor
03/08/2006CN1744319A Semiconductor device
03/08/2006CN1744318A Semiconductor device and method for fabricating the same
03/08/2006CN1744315A Method for manufacturing semiconductor device and semiconductor device
03/08/2006CN1744314A Semiconductor device having laminated structure and manufacturing method
03/08/2006CN1744313A Semiconductor apparatus having stacked semiconductor components
03/08/2006CN1744312A Semiconductor apparatus having stacked semiconductor components
03/08/2006CN1744309A Semiconductor device and wire bonding chip size package therefor
03/08/2006CN1744308A Flip chip semiconductor device and manufacturing method thereof
03/08/2006CN1744306A Semiconductor device and process for manufacturing the same
03/08/2006CN1744303A Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device
03/08/2006CN1744301A Sapphire substrate, epitaxial substrate and semiconductor device
03/08/2006CN1744300A Method of manufacturing a thin film transistor substrate and stripping composition
03/08/2006CN1744299A Memory cell with an asymmetrical area
03/08/2006CN1744298A Method for manufacturing silicon of insulator