| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/20/2006 | US20060081876 Process for fabricating a heterostructure-channel insulated-gate field-effect transistor, and the corresponding transistor |
| 04/20/2006 | US20060081872 Compound semiconductor, method for producing the same, semiconductor light-emitting device and method for fabricating the same |
| 04/20/2006 | US20060081870 Method of forming a lamination film pattern and improved lamination film pattern |
| 04/20/2006 | US20060081865 Light-emitting diode |
| 04/20/2006 | US20060081862 Device and method for emitting output light using quantum dots and non-quantum fluorescent material |
| 04/20/2006 | US20060081855 Thin film transistor and method of forming thin film transistor |
| 04/20/2006 | US20060081852 Semiconductor device and manufacturing method thereof |
| 04/20/2006 | US20060081849 Organic thin film transistor array and manufacturing method thereof |
| 04/20/2006 | US20060081847 Methods for fabricating a wafer structure having a strained silicon utility layer |
| 04/20/2006 | US20060081846 Semiconductor device and method of manufacturing the same |
| 04/20/2006 | US20060081845 Organic electro-luminescence display device and method of fabricating the same |
| 04/20/2006 | US20060081843 Semiconductor article and method for manufacturing the same |
| 04/20/2006 | US20060081842 Monitor pattern of semiconductor device and method of manufacturing semiconductor device |
| 04/20/2006 | US20060081841 Gelable composition |
| 04/20/2006 | US20060081834 Semiconductor luminescent device and manufacturing method thereof |
| 04/20/2006 | US20060081792 Alignment systems and methods for lithographic systems |
| 04/20/2006 | US20060081791 Alignment systems and methods for lithographic systems |
| 04/20/2006 | US20060081790 Alignment systems and methods for lithographic systems |
| 04/20/2006 | US20060081596 Thermal processing apparatus and thermal processing method |
| 04/20/2006 | US20060081559 Plasma processing apparatus and plasma processing method |
| 04/20/2006 | US20060081558 Plasma immersion ion implantation process |
| 04/20/2006 | US20060081460 Method and apparatus for electrochemical planarization of a workpiece |
| 04/20/2006 | US20060081339 Method of transferring a substantially disc-shaped workpiece, and device for carrying out this method |
| 04/20/2006 | US20060081336 Atmospheric pressure non-thermal plasma device to clean and sterilize the surfaces of probes, cannulas, pin tools, pipettes and spray heads |
| 04/20/2006 | US20060081334 Substrate processing method |
| 04/20/2006 | US20060081270 Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus |
| 04/20/2006 | US20060081269 Method and apparatus for cleaning and drying wafers |
| 04/20/2006 | US20060081187 Susceptor system |
| 04/20/2006 | US20060081186 Single-substrate-heat-processing apparatus for performing reformation and crystallization |
| 04/20/2006 | US20060081183 Plasma treatment processing apparatus |
| 04/20/2006 | US20060081180 Substrate processing apparatus |
| 04/20/2006 | US20060081171 Method for producing photonic crystal and photonic crystal |
| 04/20/2006 | US20060080896 edge polishing a semiconductor substrate using a mixture containing imidazole and the imidazole derivative contribute to an improvement of the polishing ability; silica abrasives, tetramethylammonium hydroxide, a water-soluble polymer, a chelating agent, and water, and containing no oxidizing agent |
| 04/20/2006 | DE4315918B4 Lötverfahren Soldering |
| 04/20/2006 | DE19931886B4 Halbleiterwafer und Halbleiterbauelement Semiconductor wafer, and semiconductor component |
| 04/20/2006 | DE19902450B4 Miniaturisiertes elektronisches System und zu dessen Herstellung geeignetes Verfahren Miniaturized electronic system and suitable for its production process |
| 04/20/2006 | DE19616014B4 Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen A process for producing micromechanical structures having semiconductor devices |
| 04/20/2006 | DE19611407B4 Halbleiterbaustein und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 04/20/2006 | DE19542989B4 Anordnung zum Erkennen von Drahtunterbrüchen und/oder von Drahtkurzschlüssen in einer Halbleiterschaltung Arrangement for detecting interruptions of wire and / or wire of short circuits in a semiconductor circuit |
| 04/20/2006 | DE19512144B4 Automatische Transportvorrichtung mit einem Anschlagmechanismus zum Positionieren von Prüftabletts Automatic transport device with a stop mechanism for positioning Prüftabletts |
| 04/20/2006 | DE112004001041T5 Chemisch-mechanisches Mehrschrittpolierverfahren für einen Gatebereich in einem FINFET Chemical mechanical polishing multiple-step process for a gate area in a FinFET |
| 04/20/2006 | DE112004001003T5 Verfahren zum Strukturieren einer unteren Elektrode einer magnetischen Speicherzelle vor dem Abscheiden des magnetischen Stapels A method of patterning a lower electrode of a magnetic memory cell prior to the deposition of the magnetic stack |
| 04/20/2006 | DE10301480B4 Verfahren zur Herstellung von Halbleiter-Bauelement-Pins Process for the preparation of semiconductor device pins |
| 04/20/2006 | DE10226965B4 Integrierter Halbleiterspeicher und Herstellungsverfahren Integrated semiconductor memory and manufacturing processes |
| 04/20/2006 | DE102005049998A1 Dielektrische Mehrfachschicht, mikroelektronisches Bauelement, Kondensator und Herstellungsverfahren Dielectric multilayer microelectronic device, capacitor and manufacturing method |
| 04/20/2006 | DE102005049195A1 Non-volatile storage component, has floating gate electrode provided with storage gate electrodes between control gate electrode and rib, and blocking isolation layer provided between control gate electrode and floating gate electrode |
| 04/20/2006 | DE102005048678A1 Verfahren zum Bearbeiten einer flexiblen Schaltungsplatte A method for processing a flexible circuit board |
| 04/20/2006 | DE102005048036A1 Verfahren zur Herstellung einer Halbleitervorrichtung mit tiefen Grabenstrukturen A process for producing a semiconductor device with deep structures grave |
| 04/20/2006 | DE102005047124A1 Laserstrahl-Bearbeitungsmaschine Laser beam processing machine |
| 04/20/2006 | DE102005047123A1 Siliziumwafer-Laserbearbeitungsverfahren und Laserstrahl-Bearbeitungsmaschine Silicon wafer laser processing method and laser beam processing machine |
| 04/20/2006 | DE102005047122A1 Verfahren zum Unterteilen eines Halbleiterwafers entlang von Straßen A method for dividing a semiconductor wafer along streets |
| 04/20/2006 | DE102005045081A1 Suszeptor Susceptor |
| 04/20/2006 | DE102005025398A1 Maskenrohling, Herstellungsverfahren für eine Phasenänderungsmaske und Herstellungsverfahren für eine Form Mask blank manufacturing method of a phase change mask and fabrication method of a mold |
| 04/20/2006 | DE102005011842A1 Speicherstruktur eines dynamischen Speichers mit wahlfreiem Zugriff Memory structure of a dynamic random access memory |
| 04/20/2006 | DE102005006838A1 Substrate e.g. wafer, testing device, has frame that is manually or electrically moved and/or rotated on base plate in x/y direction, and substrate carrier that is fastened within frame, where substrate is fastened on carrier |
| 04/20/2006 | DE102005004392A1 Resistmuster-Verdickungsmaterial und Verfahren zum Ausbilden von Resistmustern, und Halbleitervorrichtung und Prozess zur Herstellung derselben Resist pattern thickening material and process for forming resist patterns, and semiconductor device and process for producing the same |
| 04/20/2006 | DE102004062994A1 Semiconductor component with semiconductor chip and flip-chip contacts, including flat pattern on reverse side of chip to allow precise orientation of chip with wiring substrate surfaces |
| 04/20/2006 | DE102004052910A1 Verfahren zur Herstellung von Charge-Trapping-Speicherzellen A process for the preparation of charge-trapping memory cells |
| 04/20/2006 | DE102004051662B3 Verfahren zur Herstellung von Submikronstrukturen A process for the production of submicron structures |
| 04/20/2006 | DE102004050792A1 Bauelemente-Modul für Hochtemperaturanwendungen und Verfahren zum Herstellen eines derartigen Bauelemente-Moduls Components module for high temperature applications and methods for producing such components module |
| 04/20/2006 | DE102004050740A1 Halbleitergegenstand und Verfahren zur Herstellung Semiconductor article and method for producing |
| 04/20/2006 | DE102004050177A1 Wiring system for electronic component containing material interface on surface of wafer supporting wiring system, consists of conductive tracks, in which at least one track continuously surmounts interface(s) between different materials |
| 04/20/2006 | DE102004050117A1 Determination of metallic impurities such as copper in semiconductor wafers with a surface getter layer, involves providing the surface with a negative charge, heating the sample and analysing by TXRF |
| 04/20/2006 | DE102004050028A1 Verfahren zur Verminderung des Auswertungsaufwands bei der Kontrolle von Layoutänderungen bei Halbleiterchips A method for reducing the analysis effort on the control of the layout changes in the semiconductor chip |
| 04/20/2006 | DE102004049453A1 Elektrischer Schaltkreis mit einer Nanostruktur und Verfahren zum Herstellen einer Kontaktierung einer Nanostruktur Electrical circuit with a nanostructure and methods for manufacturing a contact of a nanostructure |
| 04/20/2006 | DE102004049452A1 Microelectronic semiconductor component has at least one electrode comprising a carbon containing layer |
| 04/20/2006 | DE102004047059A1 Leiterrahmen für ein elektronisches Bauelement und Verfahren zu dessen Herstellung Lead frame for an electronic device and method for its production |
| 04/20/2006 | DE102004046227B3 Verfahren zur Herstellung eines Halbleiterbauteils mit Durchkontakten durch eine Kunststoffgehäusemasse und entsprechendes Halbleiterbauteil A method for manufacturing a semiconductor device having vias through a plastic housing composition and corresponding semiconductor component |
| 04/20/2006 | DE102004044882B3 Halbleitermodul mit gestapelten Halbleiterbauteilen und elektrischen Verbindungselementen zwischen den gestapelten Halbleiterbauteilen A semiconductor module with stacked semiconductor devices and electrical connecting elements between the stacked semiconductor devices |
| 04/20/2006 | DE102004042071B3 Verfahren zum Herstellen einer Speichervorrichtung A method of manufacturing a memory device |
| 04/20/2006 | DE102004036961B3 Semiconductor chip e.g. LED, connecting method, involves introducing ultrasonic chip, and providing fixed mechanical connection between chip substrate, where layer on chip, metal foil and layer on substrate contain same metal |
| 04/20/2006 | DE102004030612B3 Halbleitersubstrat und Verfahren zu dessen Herstellung Semiconductor substrate and process for its preparation |
| 04/20/2006 | DE102004021113B4 SOI-Scheibe und Verfahren zu ihrer Herstellung SOI wafer and processes for their preparation |
| 04/20/2006 | DE102004019015B4 Mobile, manual, electrostatic holder for semiconductor wafers, thin conductive, disc-shaped substrates etc. in semiconductor industry, with holder integrated in support of wafer, or substrate holder |
| 04/20/2006 | DE102004005242B4 Verfahren und Vorrichtung zur plasmabasierten Erzeugung intensiver kurzwelliger Strahlung Method and apparatus for plasma-based production of intense short-wave radiation |
| 04/20/2006 | DE10123594B4 Integrierte Halbleiterschaltung mit unterschiedlich häufig geschalteten Transistoren A semiconductor integrated circuit with varying frequency transistors connected |
| 04/20/2006 | DE10039185B4 Halbleitervorrichtung mit Potential-Fuse, sowie Verfahren zu ihrer Herstellung A semiconductor device with potential-fuse, as well as processes for their preparation |
| 04/19/2006 | EP1648027A2 DRAM with asymmetrical channel doping |
| 04/19/2006 | EP1648026A2 Thin plate supporting container clamping device |
| 04/19/2006 | EP1648025A1 Storage container |
| 04/19/2006 | EP1648024A1 Method for removing particles from a surface |
| 04/19/2006 | EP1648023A1 Process for fabricating semiconductor device |
| 04/19/2006 | EP1648022A1 Single-wafer type heat treatment apparatus for semiconductor processing system |
| 04/19/2006 | EP1648005A1 Electric double layer capacitor |
| 04/19/2006 | EP1647868A1 Temperature control method and apparatus |
| 04/19/2006 | EP1647789A1 Continuous heat treatment furnace and heat treatment method |
| 04/19/2006 | EP1647614A2 Plating system for semiconductor materials |
| 04/19/2006 | EP1647359A1 Polishing pad |
| 04/19/2006 | EP1647334A1 Apparatus for two dimensional assembly of particles |
| 04/19/2006 | EP1647070A1 An antenna |
| 04/19/2006 | EP1647058A1 Insulated gate power semiconductor devices |
| 04/19/2006 | EP1647054A2 Plasma processing apparatus |
| 04/19/2006 | EP1647053A2 Method for producing an anisotropic conductive film |
| 04/19/2006 | EP1647052A1 Underfill and mold compounds including siloxane-based aromatic diamines |
| 04/19/2006 | EP1647050A1 Nonvolatile memory device with a floating gate comprising semiconductor nanocrystals |
| 04/19/2006 | EP1647049A2 Method and system for electronic spatial filtering of spectral reflectometer optical signals |
| 04/19/2006 | EP1647048A2 Micellar technology for post-etch residues |
| 04/19/2006 | EP1647047A2 A transistor device with metallic electrodes and a method for use in forming such a device |
| 04/19/2006 | EP1647046A2 DEPOSITION OF SiGE ON SILICON-ON-INSULATOR STRUCTURES AND BULK SUBSTRATES |
| 04/19/2006 | EP1647045A1 Method of manufacturing a semiconductor device and an apparatus for use in such a method |