Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2006
04/25/2006US7034377 Semiconductor device and method of manufacturing the device
04/25/2006US7034376 Schottky barrier diode semiconductor device
04/25/2006US7034369 Semiconductor device and method for manufacturing the same
04/25/2006US7034368 Semiconductor memory device and fabrication method thereof using damascene gate and epitaxial growth
04/25/2006US7034367 Semiconductor device having an STI structure and a dummy pattern with a rectangular shape
04/25/2006US7034366 Semiconductor device, manufacturing method thereof, and CMOS integrated circuit device
04/25/2006US7034365 Integrated circuit devices having contact holes exposing gate electrodes in active regions
04/25/2006US7034362 Double silicon-on-insulator (SOI) metal oxide semiconductor field effect transistor (MOSFET) structures
04/25/2006US7034360 High voltage transistor and method of manufacturing the same
04/25/2006US7034359 Vertical MOS transistor
04/25/2006US7034358 Vertical transistor, and a method for producing a vertical transistor
04/25/2006US7034356 Non-volatile semiconductor memory device and process for fabricating the same
04/25/2006US7034355 Nonvolatile semiconductor storage and its manufacturing method
04/25/2006US7034354 Semiconductor structure with lining layer partially etched on sidewall of the gate
04/25/2006US7034353 Methods for enhancing capacitors having roughened features to increase charge-storage capacity
04/25/2006US7034352 DRAM with very shallow trench isolation
04/25/2006US7034351 Memory cell and method for forming the same
04/25/2006US7034350 Capacitors including a cavity containing a buried layer
04/25/2006US7034348 Magnetoresistive effect element and magnetic memory device
04/25/2006US7034346 Semiconductor device and method for manufacturing the same
04/25/2006US7034344 Integrated semiconductor power device for multiple battery systems
04/25/2006US7034337 Semiconductor device and method of manufacturing the same
04/25/2006US7034336 Capacitorless 1-transistor DRAM cell and fabrication method
04/25/2006US7034335 ITO film contact structure, TFT substrate and manufacture thereof
04/25/2006US7034332 Nanometer-scale memory device utilizing self-aligned rectifying elements and method of making
04/25/2006US7034330 Group-III nitride semiconductor device, production method thereof and light-emitting diode
04/25/2006US7034329 Semiconductor device including band-engineered superlattice having 3/1-5/1 germanium layer structure
04/25/2006US7034328 Vertical geometry InGaN LED
04/25/2006US7034321 Electron beam exposure apparatus and electron beam measurement module
04/25/2006US7034318 Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and stencil mask
04/25/2006US7034314 Projection apparatus for projecting a pattern formed on a mask onto a substrate and a control method for a projection apparatus
04/25/2006US7034308 Radiation system, contamination barrier, lithographic apparatus, device manufacturing method and device manufactured thereby
04/25/2006US7034298 Inspection method and apparatus using an electron beam
04/25/2006US7034285 Beam source and beam processing apparatus
04/25/2006US7034255 Light irradiation type thermal processing apparatus
04/25/2006US7033978 Post-planarization clean-up
04/25/2006US7033962 Methods for manufacturing silicon wafer and silicone epitaxial wafer, and silicon epitaxial wafer
04/25/2006US7033961 Epitaxy/substrate release layer
04/25/2006US7033960 Multi-chamber deposition of silicon oxynitride film for patterning
04/25/2006US7033959 Method for manufacturing organic semiconductor systems
04/25/2006US7033958 Semiconductor device and process for producing the same
04/25/2006US7033957 ONO fabrication process for increasing oxygen content at bottom oxide-substrate interface in flash memory devices
04/25/2006US7033956 Semiconductor memory devices and methods for making the same
04/25/2006US7033955 Method for fabricating a semiconductor device
04/25/2006US7033954 Etching of high aspect ration structures
04/25/2006US7033952 Apparatus and method using a remote RF energized plasma for processing semiconductor wafers
04/25/2006US7033951 Process for forming pattern and method for producing liquid crystal display apparatus
04/25/2006US7033950 Graded junction termination extensions for electronic devices
04/25/2006US7033949 Structure and manufacturing method for nitride-based light-emitting diodes
04/25/2006US7033948 Method for reducing dimensions between patterns on a photoresist
04/25/2006US7033947 Dual trench alternating phase shift mask fabrication
04/25/2006US7033946 Plasmaless dry contact cleaning method using interhalogen compounds
04/25/2006US7033945 Gap filling with a composite layer
04/25/2006US7033944 Dual damascene process
04/25/2006US7033943 Etching solution, etching method and method for manufacturing semiconductor device
04/25/2006US7033942 Chemical mechanical polishing composition and process
04/25/2006US7033941 Method of producing semiconductor devices using chemical mechanical polishing
04/25/2006US7033940 Method of forming composite barrier layers with controlled copper interface surface roughness
04/25/2006US7033939 Chemistry for chemical vapor deposition of titanium containing films
04/25/2006US7033938 Method of making a long wavelength indium gallium arsenide nitride (InGaAsN) active region
04/25/2006US7033937 Apparatus and method for use in manufacturing a semiconductor device
04/25/2006US7033936 Process for making island arrays
04/25/2006US7033935 Semiconductor device and method for manufacturing the same
04/25/2006US7033934 Method of production of semiconductor package
04/25/2006US7033933 Manufacturing method of semiconductor device
04/25/2006US7033932 Method for fabricating a semiconductor device having salicide
04/25/2006US7033931 Temperature optimization of a physical vapor deposition process to prevent extrusion into openings
04/25/2006US7033930 Interconnect structures in a semiconductor device and processes of formation
04/25/2006US7033929 Dual damascene interconnect structure with improved electro migration lifetimes
04/25/2006US7033928 Method of fabricating semiconductor device
04/25/2006US7033927 Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer
04/25/2006US7033926 Strip conductor arrangement and method for producing a strip conductor arrangement
04/25/2006US7033925 Pattern transfer mask related to formation of dual damascene structure and method of forming dual damascene structure
04/25/2006US7033924 Versatile system for diffusion limiting void formation
04/25/2006US7033923 Method of forming segmented ball limiting metallurgy
04/25/2006US7033922 Method and system for controlling the presence of fluorine in refractory metal layers
04/25/2006US7033921 Method and device for depositing crystalline layers on crystalline substrates
04/25/2006US7033920 Method for fabricating a silicon carbide interconnect for semiconductor components
04/25/2006US7033919 Fabrication of dual work-function metal gate structure for complementary field effect transistors
04/25/2006US7033918 Semiconductor device including p-channel type transistor, and production method for manufacturing such semiconductor device
04/25/2006US7033917 Packaging substrate without plating bar and a method of forming the same
04/25/2006US7033916 Shallow junction semiconductor and method for the fabrication thereof
04/25/2006US7033915 Method for crystallizing amorphous silicon film
04/25/2006US7033914 Method of making a package structure by dicing a wafer from the backside surface thereof
04/25/2006US7033913 Semiconductor device and method of manufacturing the same
04/25/2006US7033912 Silicon carbide on diamond substrates and related devices and methods
04/25/2006US7033911 Adhesive of folded package
04/25/2006US7033910 Method of fabricating multi layer MEMS and microfluidic devices
04/25/2006US7033909 Method of forming trench isolations
04/25/2006US7033908 Methods of forming integrated circuit devices including insulation layers
04/25/2006US7033907 Method for forming isolation layer of semiconductor device
04/25/2006US7033906 Airdome enclosure for components
04/25/2006US7033905 Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means
04/25/2006US7033904 Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device
04/25/2006US7033903 Method and apparatus for forming patterned photoresist layer
04/25/2006US7033902 Method for making thin film transistors with lightly doped regions
04/25/2006US7033901 Buried power buss utilized as a ground strap for high current, high power semiconductor devices and a method for providing the same
04/25/2006US7033900 Protection of integrated circuit gates during metallization processes
04/25/2006US7033899 Method of making semiconductor devices
04/25/2006US7033898 Method for fabricating a self-aligned bipolar transistor having recessed spacers