Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2006
04/20/2006WO2006041208A1 Tracing method and apparatus
04/20/2006WO2006041201A1 Tracing method and apparatus
04/20/2006WO2006041196A1 Polishing apparatus and polishing method
04/20/2006WO2006041153A1 Method for manufacturing electroconductive pattern and electronic device, and electronic device
04/20/2006WO2006041144A1 Etching method and manufacturing method of semiconductor device
04/20/2006WO2006041142A1 Semiconductor integrated circuit and designing method of the same, and electronic apparatus using the same
04/20/2006WO2006041100A1 Exposure apparatus and device manufacturing method
04/20/2006WO2006041091A1 Exposure apparatus maintenance method, exposure apparatus, device manufacturing method and liquid recovering member for immersion exposure apparatus maintenance
04/20/2006WO2006041086A1 Exposure device, exposure method, and device manufacturing method
04/20/2006WO2006041083A1 Exposure apparatus, exposure method and device manufacturing method
04/20/2006WO2006041077A1 Substrate processing method and substrate processing apparatus
04/20/2006WO2006041069A1 Annealed wafer manufacturing method and annealed wafer
04/20/2006WO2006041059A1 Test device, test method, and electronic device
04/20/2006WO2006041052A1 Microcomputer and its lssd scan test method
04/20/2006WO2006041033A1 Noncontact ic label and method and apparatus for manufacturing the same
04/20/2006WO2006041028A1 Treatment liquid supply device
04/20/2006WO2006041022A1 Electronic component supplying apparatus and electronic component supplying method
04/20/2006WO2006040984A1 Laser beam machining method
04/20/2006WO2006040956A1 Composition for forming bottom coating for lithography containing metal oxide
04/20/2006WO2006040949A1 Positive resist composition for immersion exposure and method of forming resist pattern
04/20/2006WO2006040945A1 Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
04/20/2006WO2006040924A1 Shield body and vacuum processing apparatus
04/20/2006WO2006040922A1 Composition for forming bottom anti-reflective coating containing aromatic sulfonic acid ester compound and light photoacid-generating agent
04/20/2006WO2006040921A1 Sulfur-atom-containing composition for forming of lithographic antireflection film
04/20/2006WO2006040918A1 Composition for forming of lithographic antireflection film, containing nitrogenous aromatic ring structure
04/20/2006WO2006040890A1 Exposure device and device manufacturing method
04/20/2006WO2006040864A1 Abrasive pad
04/20/2006WO2006040738A1 Semiconductor device having a frontside contact and vertical trench isolation and method of fabricating same
04/20/2006WO2006040735A1 Bicmos compatible jfet device and method of manufacturing same
04/20/2006WO2006040499A1 Mgo-base coating for electrically insulating semi-conductor substrates and production method
04/20/2006WO2006040165A2 Method for production of charge-trapping memory cells
04/20/2006WO2006040132A1 System and method for corrosive vapor reduction by ultraviolet light
04/20/2006WO2006012298A9 Gallium nitride material and methods associated with the same
04/20/2006WO2005111817A3 Semiconductor device and method of forming the same
04/20/2006WO2005098960A3 Bipolar-transistor and method for the production of a bipolar-transistor
04/20/2006WO2005093836A3 Semiconductor constructions having a buried bit line, and methods of forming same
04/20/2006WO2005079472A3 Dry etching process for compound semiconductors
04/20/2006WO2005059651A3 Method for repairing errors of patterns embodied in thin layers
04/20/2006WO2005036599A3 Non-volatile memory device
04/20/2006US20060084766 Resin composition for optical use
04/20/2006US20060084727 comprising borosilicate glass particle fillers, hardeners, accelerators, and ternary epoxy mixture consisting of bisphenol-A epoxy resins, cyclo-aliphatic epoxy resins and triglycidyl isocyanurate resins, used for encapsulation of optoelectronic device or optical components
04/20/2006US20060084369 Polishing apparatus
04/20/2006US20060084365 Polishing pad
04/20/2006US20060084283 Low temperature sin deposition methods
04/20/2006US20060084282 Porous organosilicates with improved mechanical properties
04/20/2006US20060084281 Novel deposition of high-k MSiON dielectric films
04/20/2006US20060084280 Method of forming a carbon polymer film using plasma CVD
04/20/2006US20060084279 Method for forming a multi-layer low-K dual damascene
04/20/2006US20060084278 Metal oxide-containing nanoparticles
04/20/2006US20060084277 Method of forming amorphous silica-based coating film with low dielectric constant and thus obtained silica-based coating film
04/20/2006US20060084276 Methods for surface treatment and structure formed therefrom
04/20/2006US20060084275 Etch stop structure and method of manufacture, and semiconductor device and method of manufacture
04/20/2006US20060084274 Edge protection process for semiconductor device fabrication
04/20/2006US20060084273 Semiconductor device using damascene technique and manufacturing method therefor
04/20/2006US20060084272 Polishing slurries for copper and associated materials
04/20/2006US20060084271 Systems, methods and slurries for chemical mechanical polishing
04/20/2006US20060084270 Composition for selectively polishing silicon nitride layer and polishing method employing it
04/20/2006US20060084269 Apparatus for generating gas plasma, gas composition for generating plasma and method for manufacturing semiconductor device using the same
04/20/2006US20060084268 Method for production of charge-trapping memory cells
04/20/2006US20060084267 Method for fabricating planar semiconductor wafers
04/20/2006US20060084266 Film formation method
04/20/2006US20060084265 Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data
04/20/2006US20060084264 Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatment
04/20/2006US20060084263 Method of forming metal layer used in the fabrication of semiconductor device
04/20/2006US20060084262 Low-k dielectric process for multilevel interconnection using microcavity engineering during electric circuit manufacture
04/20/2006US20060084261 Interconnect layout method
04/20/2006US20060084260 Copper processing using an ozone-solvent solution
04/20/2006US20060084259 Manufacturing method of passivation layer on wafer and manufacturing method of bumps on wafer
04/20/2006US20060084258 Semiconductor device and method of manufacturing the same
04/20/2006US20060084257 Dye sensitization photoelectric converter and process for fabricating the same
04/20/2006US20060084256 Method of forming low resistance and reliable via in inter-level dielectric interconnect
04/20/2006US20060084255 Semiconductor device and method of manufacturing the same
04/20/2006US20060084254 Method for making electronic packages
04/20/2006US20060084253 Plating method, semiconductor device fabrication method and circuit board fabrication method
04/20/2006US20060084252 Method for fabricating a gold contact on a microswith
04/20/2006US20060084251 Plating method, semiconductor device fabrication method and circuit board fabrication method
04/20/2006US20060084250 Methods of making microelectronic packages with conductive elastomeric posts
04/20/2006US20060084249 Method for manufacturing a hybrid semiconductor wafer having a buried oxide film
04/20/2006US20060084248 Methods of optimization of implant conditions to minimize channeling and structures formed thereby
04/20/2006US20060084247 Transistors, integrated circuits, systems, and processes of manufacture with improved work function modulation
04/20/2006US20060084246 Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device
04/20/2006US20060084245 Semiconductor device, semiconductor device production method, and substrate for the semiconductor device
04/20/2006US20060084244 Silicon-on-insulator chip with multiple crystal orientations
04/20/2006US20060084243 Oxidation sidewall image transfer patterning method
04/20/2006US20060084242 Memory device and method of manufacturing including deuterated oxynitride charge trapping structure
04/20/2006US20060084241 Apparatus for controlled fracture substrate singulation
04/20/2006US20060084240 Apparatus and method for packaging circuits
04/20/2006US20060084239 Wafer dividing method
04/20/2006US20060084238 Method for bonding wafers
04/20/2006US20060084237 Solid electrolytic capacitor and method of manufacturing the same
04/20/2006US20060084236 Plasma-enhanced chemical vapour deposition process for depositing silicon nitride or silicon oxynitride, process for producing one such layer arrangement, and layer arrangement
04/20/2006US20060084235 Low rc product transistors in soi semiconductor process
04/20/2006US20060084234 Method for producing a spacer structure
04/20/2006US20060084233 Method for forming STI structures with controlled step height
04/20/2006US20060084232 Process for fabricating a self-aligned deposited source/drain insulated gate field-effect transistor
04/20/2006US20060084231 Method of inhibiting degradation of gate oxide film
04/20/2006US20060084230 Application of different isolation schemes for logic and embedded memory
04/20/2006US20060084229 Post high voltage gate oxide pattern high-vacuum outgas surface treatment
04/20/2006US20060084228 Low thermal resistance semiconductor device and method therefor
04/20/2006US20060084227 Increasing adherence of dielectrics to phase change materials