Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2006
05/02/2006US7038284 Methods for making a dielectric stack in an integrated circuit
05/02/2006US7038283 Thin film transistor device, method of manufacturing the same and liquid crystal panel
05/02/2006US7038282 Semiconductor storage device
05/02/2006US7038281 Semiconductor device and method of manufacturing the same
05/02/2006US7038279 Process parameter event monitoring system and method for process
05/02/2006US7038277 Transferable device-containing layer for silicon-on-insulator applications
05/02/2006US7038275 Buried-gate-type semiconductor device
05/02/2006US7038274 Switching regulator with high-side p-type device
05/02/2006US7038273 Semiconductor device
05/02/2006US7038271 Non-volatile semiconductor memory device and process for fabricating the same
05/02/2006US7038270 Nonvolatile memory device with a non-planar gate-insulating layer and method of fabricating the same
05/02/2006US7038269 Non-volatile semiconductor memory with single layer gate structure
05/02/2006US7038268 Nonvolatile semiconductor memory device
05/02/2006US7038267 Non-volatile memory cell and manufacturing method thereof
05/02/2006US7038266 Metal-insulator-metal (MIM) capacitor structure formed with dual damascene structure
05/02/2006US7038265 Capacitor having tantalum oxynitride film and method for making same
05/02/2006US7038264 Semiconductor device and method for manufacturing the same
05/02/2006US7038263 Integrated circuits with rhodium-rich structures
05/02/2006US7038262 Integrated circuit devices including an intaglio pattern
05/02/2006US7038258 Semiconductor device having a localized halo implant therein and method of manufacture therefor
05/02/2006US7038255 Integrated circuit arrangement having PNP and NPN bipolar transistors, and fabrication method
05/02/2006US7038254 Hetero-junction bipolar transistor having a transition layer between the base and the collector
05/02/2006US7038253 GaN-based field effect transistor of a normally-off type
05/02/2006US7038252 Semiconductor device using a nitride semiconductor
05/02/2006US7038249 Horizontal current bipolar transistor and fabrication method
05/02/2006US7038244 Semiconductor device and method of manufacturing the same
05/02/2006US7038243 Semiconductor light emitting device
05/02/2006US7038241 Channel-etch thin film transistor
05/02/2006US7038240 Color display device
05/02/2006US7038239 Semiconductor element and display device using the same
05/02/2006US7038232 Quantum efficiency enhancement for CMOS imaging sensor with borderless contact
05/02/2006US7038231 Non-planarized, self-aligned, non-volatile phase-change memory array and method of formation
05/02/2006US7038226 Electrooptic system array, charged-particle beam exposure apparatus using the same, and device manufacturing method
05/02/2006US7038225 Method and apparatus for electron beam processing of substrates
05/02/2006US7038224 Contact opening metrology
05/02/2006US7038223 Controlled charge neutralization of ion-implanted articles
05/02/2006US7038222 System and method for using areas near photo global alignment marks or unpatterned areas of a semiconductor wafer to create structures for SIMS or E-Beam or XRD testing
05/02/2006US7038218 Inspection by a transmission electron microscope of a sample
05/02/2006US7038213 Composite active-matrix substrates, methods for manufacturing same, and electromagnetic wave capturing devices
05/02/2006US7038204 Method for reducing proximity effects in electron beam lithography
05/02/2006US7038174 Heating device for heating semiconductor wafers in thermal processing chambers
05/02/2006US7038173 Heat substrates; positioning lamps perpendicular with reflector; efficient radiation; ring of reflective light; uniform temperature
05/02/2006US7038144 Electronic component and method and structure for mounting semiconductor device
05/02/2006US7038082 Preparation of a multimetal oxide material
05/02/2006US7037870 Comprising 90-99.8% by volume cordierite and 0.2-10% by volume mullite and having density of 2.48 g/cm3 or more; for semiconductor manufacture devices, ceramic parts for precision control machines, ceramic parts for optical instruments
05/02/2006US7037863 Post thermal treatment methods of forming high dielectric layers over interfacial layers in integrated circuit devices
05/02/2006US7037862 Dielectric layer forming method and devices formed therewith
05/02/2006US7037861 Method and apparatus for oxidizing nitrides
05/02/2006US7037860 Modified source/drain re-oxidation method and system
05/02/2006US7037859 Method using TEOS ramp-up during TEOS/ozone CVD for improved gap-fill
05/02/2006US7037858 Method for manufacturing semiconductor device including an ozone process
05/02/2006US7037857 Method for elimination of excessive field oxide recess for thin Si SOI
05/02/2006US7037856 Method of fabricating a low-defect strained epitaxial germanium film on silicon
05/02/2006US7037855 Method of forming fluorine-doped low-dielectric-constant insulating film
05/02/2006US7037854 Method for chemical-mechanical jet etching of semiconductor structures
05/02/2006US7037853 Wafer cleaning apparatus
05/02/2006US7037852 For removing a photoresist pattern from an underlying layer; for manufacturing a semiconductor device
05/02/2006US7037851 Methods for selective integration of airgaps and devices made by such methods
05/02/2006US7037850 Method for fabricating semiconductor device with fine patterns
05/02/2006US7037849 Process for patterning high-k dielectric material
05/02/2006US7037848 Methods of etching insulative materials, of forming electrical devices, and of forming capacitors
05/02/2006US7037847 Methods for fabricating read sensor for magnetic heads with reduced read track width
05/02/2006US7037846 Method and apparatus for micro-jet enabled, low energy ion generation and transport in plasma processing
05/02/2006US7037845 Selective etch process for making a semiconductor device having a high-k gate dielectric
05/02/2006US7037844 Method for manufacturing a housing for a chip having a micromechanical structure
05/02/2006US7037843 Plasma etching method
05/02/2006US7037842 Method and apparatus for dissolving a gas into a liquid for single wet wafer processing
05/02/2006US7037841 Dual damascene interconnecting line structure and fabrication method thereof
05/02/2006US7037840 Methods of forming planarized surfaces over semiconductor substrates
05/02/2006US7037839 Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry
05/02/2006US7037838 Method for polishing a substrate surface
05/02/2006US7037837 Method of fabricating robust nucleation/seed layers for subsequent deposition/fill of metallization layers
05/02/2006US7037836 Method of manufacturing a semiconductor device without oxidized copper layer
05/02/2006US7037835 Interconnections having double capping layer and method for forming the same
05/02/2006US7037834 Constant emissivity deposition member
05/02/2006US7037833 Pattern forming method, film structure, electro-optical apparatus, and electronic device
05/02/2006US7037832 Method of forming a conductive pattern by removing a compound with heat in a substantially inert atmosphere
05/02/2006US7037831 Method of production of multilayer ceramic electronic device
05/02/2006US7037830 PVD deposition process for enhanced properties of metal films
05/02/2006US7037829 Compound structure for reduced contact resistance
05/02/2006US7037828 Semiconductor device having a capping layer including cobalt and method of fabricating the same
05/02/2006US7037827 Semiconductor device with epitaxial C49-titanium silicide (TiSi2) layer and method for fabricating the same
05/02/2006US7037826 Method for forming semiconductor device bonding pads
05/02/2006US7037825 Damascene method capable of avoiding copper extrusion
05/02/2006US7037824 Copper to aluminum interlayer interconnect using stud and via liner
05/02/2006US7037823 Method to reduce silanol and improve barrier properties in low k dielectric ic interconnects
05/02/2006US7037822 Method of forming metal line in semiconductor device
05/02/2006US7037821 Method for forming contact of semiconductor device
05/02/2006US7037820 Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding
05/02/2006US7037819 Method of making a circuitized substrate
05/02/2006US7037818 Apparatus and method for staircase raised source/drain structure
05/02/2006US7037817 Semiconductor device and method for fabricating the same
05/02/2006US7037816 System and method for integration of HfO2 and RTCVD poly-silicon
05/02/2006US7037815 Method for forming an ultra-shallow junction in a semiconductor substrate using a nuclear stopping layer
05/02/2006US7037814 Single mask control of doping levels
05/02/2006US7037813 Plasma immersion ion implantation process using a capacitively coupled plasma source having low dissociation and low minimum plasma voltage
05/02/2006US7037812 Manufacturing method of circuit substrate, circuit substrate and manufacturing device of circuit substrate
05/02/2006US7037811 Method for fabricating a semiconductor device
05/02/2006US7037810 Method of replacing atmosphere of chamber apparatus, chamber apparatus, electro-optic apparatus, and organic EL device
05/02/2006US7037809 Method of manufacturing semiconductor device using a laser irradiation process