| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 04/27/2006 | DE10394239T5 Integriertes Schaltungsgehäuse Integrated circuit package |
| 04/27/2006 | DE10344454B4 Klebstoffauftragevorrichtung für flexible bandartige Trägersubstrate Adhesive applicator for flexible ribbon-like substrates |
| 04/27/2006 | DE10344275B4 Verfahren zur gesteuerten Strukturierung einer ARC-Schicht in einer Halbleitereinrichtung A method of controlling the texture of an ARC layer in a semiconductor device |
| 04/27/2006 | DE10248481B4 Verfahren und Vorrichtung zur nasschemischen Behandlung von Silicium Method and apparatus for wet-chemical treatment of silicon |
| 04/27/2006 | DE102005051492A1 Non-volatile memory device used in portable electronic system, has charge-trapping structure with recess between gate electrode and portion of source and drain regions |
| 04/27/2006 | DE102005047475A1 Mehrbelichtungs-Halbleiterherstellungsmaskensätze und Verfahren zum Herstellen von solchen Mehrbelichtungsmaskensätzen More exposure semiconductor manufacturing mask sets and processes for preparing such multi-exposure mask sets |
| 04/27/2006 | DE102005047110A1 Waferteilungsverfahren und -teilungsvorrichtung Wafer dividing method and -teilungsvorrichtung |
| 04/27/2006 | DE102005046135A1 Substrat für Maskenrohling, Maskenrohling, Belichtungsmaske, Herstellungsverfahren für Maskenrohlingssubstrat und Herstellungsverfahren für Halbleiter Substrate for mask blank, mask blank exposure mask manufacturing method of mask blank substrate and manufacturing method of semiconductor |
| 04/27/2006 | DE102005022372A1 Method for formation of source contact of flash memory element involves formation of first intermediate isolation layer on semiconductor substrate and structuring of first isolation layer and formation of layer on entire surface |
| 04/27/2006 | DE102005022371A1 Metal line formation method of NAND flash memory, involves etching nitride film exposed through trench, to expose drain contact plug, and forming metal line, to bury trench |
| 04/27/2006 | DE102005020939A1 Organic electro luminescence device as flat panel display device, includes two substrates, array element with thin film transistor, organic electro luminescent diode, and spacer connecting drain electrode of transistor and first electrode |
| 04/27/2006 | DE102004060689A1 Fabrication of flash memory device involves performing trench formation process and wall oxide film formation process separately depending on pattern density, and forming wall oxide films with different thicknesses |
| 04/27/2006 | DE102004060668A1 Semiconductor device, e.g. flash memory device, comprises barrier metal layer formed between metal layer and interlayer insulating film and including tungsten nitride or titanium silicon nitride |
| 04/27/2006 | DE102004060448A1 Fabrication of element isolation film of semiconductor device is fabricated by using aluminum oxide film of high wet etch rate as pad oxide film, and making edges of trench rounded while removing some of the oxide film by cleaning |
| 04/27/2006 | DE102004058413A1 Chip-size package manufacture involves patterning dielectric layer to form openings exposing conductive lines |
| 04/27/2006 | DE102004052153A1 Vertical power semiconductor element with gate connection for single step compressors has gate electrode whereby gate electrode is placed on edge of back of element by horizontal transverse guide and vertical gate |
| 04/27/2006 | DE102004052141A1 Verfahren zum Herstellen einer Halbleiterstruktur A method of fabricating a semiconductor structure |
| 04/27/2006 | DE102004051468A1 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system |
| 04/27/2006 | DE102004051081A1 JFET und Herstellungsverfahren JFET and manufacturing processes |
| 04/27/2006 | DE102004050051A1 Drilling of through holes in silicon wafer in semiconductor production involves forming first recess in one side of wafer and second recess in other side, so that the recesses together form a through hole between the two sides of wafer |
| 04/27/2006 | DE102004048096A1 Verfahren zur Herstellung einer verspannten Schicht auf einem Substrat und Schichtstruktur A method for producing a strained layer on a substrate and layered structure |
| 04/27/2006 | DE102004034223B3 Dry etching method for producing deep trenches in capacitor manufacture comprises adjusting and controlling the volume and pressure of the gases to obtain the required selectivity of the etching method for anisotropic etching |
| 04/27/2006 | DE10127580B4 In-situ-Maskentechnik zur Produktion von III-V Halbleiter-Bauelementen In-situ mask technology for the production of III-V semiconductor devices |
| 04/27/2006 | DE10119490B4 Verfahren und Vorrichtung zum Prozessieren von Substraten Method and apparatus for processing substrates |
| 04/27/2006 | DE10039927B4 Oberflächenmontierbares Gehäuse für ein elektronisches Bauelement Surface-mountable housing for an electronic component |
| 04/27/2006 | CA2584420A1 Compounds for myocardial perfusion imaging |
| 04/26/2006 | EP1650809A1 Thin film transistor and method for manufacturing same |
| 04/26/2006 | EP1650808A1 Electronic element, integrated circuit and process for fabricating the same |
| 04/26/2006 | EP1650807A2 Thin film transistor, electro-optical device and electronic apparatus |
| 04/26/2006 | EP1650800A2 Power semiconductor module with pressure contact device |
| 04/26/2006 | EP1650796A2 Process for a contact plug on a region of an integrated circuit, in particular on the electrodes of a transistor |
| 04/26/2006 | EP1650795A1 Process of making a multilayer structure on a substrate |
| 04/26/2006 | EP1650794A1 A method for fabricating a wafer structure with a strained silicon layer and an intermediate product of this method |
| 04/26/2006 | EP1650793A1 Semiconductor device and method of manufacturing the same |
| 04/26/2006 | EP1650792A1 Apparatus and method for cooling of platelike substrates |
| 04/26/2006 | EP1650791A1 Laminating method and laminating device |
| 04/26/2006 | EP1650790A1 Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device |
| 04/26/2006 | EP1650789A1 Heat treatment apparatus and method of calibrating the apparatus |
| 04/26/2006 | EP1650788A1 Vapor deposition apparatus and vapor deposition method |
| 04/26/2006 | EP1650786A1 Focusing optical system, light source unit, illumination optical apparatus, and exposure apparatus |
| 04/26/2006 | EP1650769A1 Liquid composition for ferroelectric thin film formation and process for producing ferroelectric thin film |
| 04/26/2006 | EP1650604A2 Apparatus and method for supporting and thermally conditioning a substrate, a support table, a chuck and a lithographic apparatus comprising said support table |
| 04/26/2006 | EP1650573A2 Counter balanced vertical docking motion in a driven vertical test head manipulator |
| 04/26/2006 | EP1650326A2 Plasma processing apparatus |
| 04/26/2006 | EP1650278A2 Composition for selectively polishing silicon nitride layer and polishing method employing it |
| 04/26/2006 | EP1650250A1 Silicon-containing polymer, process for rpoducing the same, heat-resistant resin composition, and heat-resistant film |
| 04/26/2006 | EP1649965A1 Laser beam machining method, laser beam machining apparatus, and laser machined product |
| 04/26/2006 | EP1649926A1 Process for the recovery of surfactants |
| 04/26/2006 | EP1649557A2 Method of forming a scribe line on a passive electronic component substrate |
| 04/26/2006 | EP1649526A2 High-temperature attachment of organic molecules to substrates |
| 04/26/2006 | EP1649518A2 Improved integrated circuit substrate material and method |
| 04/26/2006 | EP1649513A2 SEMI-INSULATING GaN AND METHOD OF MAKING THE SAME |
| 04/26/2006 | EP1649511A2 Array of nanoscopic mosfet transistors and fabrication |
| 04/26/2006 | EP1649510A2 Dual damascene interconnect structures having different materials for line and via conductors |
| 04/26/2006 | EP1649509A2 Production of a structure comprising a protective layer against chemical treatment |
| 04/26/2006 | EP1649508A2 Methods of forming conductive structures including titanium-tungsten base layers and related structures |
| 04/26/2006 | EP1649507A2 Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump |
| 04/26/2006 | EP1649506A1 Field effect transistor having a doped gate electrode with reduced gate depletion and method of forming the transistor |
| 04/26/2006 | EP1649505A1 Method for producing a contact and electronic component comprising said type of contact |
| 04/26/2006 | EP1649504A2 Ultaviolet curing processes for advanced low-k materials |
| 04/26/2006 | EP1649503A2 Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing |
| 04/26/2006 | EP1649502A1 Multiple-step electrodeposition process for direct copper plating on barrier metals |
| 04/26/2006 | EP1649501A1 High-k dielectric film, method of forming the same and related semiconductor device |
| 04/26/2006 | EP1649500A2 Method and structure of strain control of sige based photodetectors and modulators |
| 04/26/2006 | EP1649499A2 Silicon crystallization using self-assembled monolayers |
| 04/26/2006 | EP1649498A2 Method for the production of a plurality of opto-electronic semiconductor chips and opto-electronic semiconductor chip |
| 04/26/2006 | EP1649497A2 Method for the production of a plurality of opto-electronic semiconductor chips and opto-electronic semiconductor chip |
| 04/26/2006 | EP1649495A2 Epitaxial growth of relaxed silicon germanium layers |
| 04/26/2006 | EP1649469A1 Programming of a memory with discrete charge storage elements |
| 04/26/2006 | EP1649412A1 Chip card, chip card module and method for the production of a chip card module |
| 04/26/2006 | EP1648991A1 Semiconductor cleaning solution |
| 04/26/2006 | EP1648974A2 Slurries and methods for chemical-mechanical planarization of copper |
| 04/26/2006 | EP1648691A2 Surface-covering article and methods of installing the same |
| 04/26/2006 | EP1648658A2 Cell, system and article for electrochemical mechanical processing (ecmp) |
| 04/26/2006 | EP1648242A1 Emulsions |
| 04/26/2006 | EP1599904A4 Lateral lubistor structure and method |
| 04/26/2006 | EP1554753B1 Method for producing a stepped edge profile out of a layered construction |
| 04/26/2006 | EP1493175B1 Gas driven planetary rotation apparatus and methods for forming silicon carbide layers |
| 04/26/2006 | EP1430536A4 Vertical dual gate field effect transistor |
| 04/26/2006 | EP1402567B1 Film or layer made of semi-conductive material and method for producing said film or layer |
| 04/26/2006 | EP1330333A4 Method of retrofitting a probe station |
| 04/26/2006 | EP1325386A4 Silica-based light-weight euv lithography stages |
| 04/26/2006 | EP1303449B1 Dual degas/cool loadlock cluster tool |
| 04/26/2006 | EP1299932A4 Multi-finger current ballasting esd protection circuit and interleaved ballasting for esd-sensitive circuits |
| 04/26/2006 | EP1188492B1 Cleaning sponge roller |
| 04/26/2006 | EP1138075B1 Device for improved salicide resistance on polysilicon gates |
| 04/26/2006 | EP1113491B1 Transfer arm |
| 04/26/2006 | EP1012865A4 Method and apparatus for controlling a workpiece in a vacuum chamber |
| 04/26/2006 | EP0953206B1 Device for precise location of a microchip |
| 04/26/2006 | EP0891630B1 Laser diode array packaging |
| 04/26/2006 | CN2775844Y Image detector with holes |
| 04/26/2006 | CN2775843Y Chip packaging sructure with power regulating element |
| 04/26/2006 | CN2775842Y 半导体电路 Semiconductor circuit |
| 04/26/2006 | CN2775841Y Metal conductive wire structure |
| 04/26/2006 | CN2775834Y Adaptive base of detecting sample sheet |
| 04/26/2006 | CN2775833Y Top cover machien of shaping table free calibration |
| 04/26/2006 | CN2775832Y Air inlet nozzle and its inductive coupling plasma device |
| 04/26/2006 | CN2774712Y Static chuck device |
| 04/26/2006 | CN2774706Y Grinder |
| 04/26/2006 | CN1765159A Electric connecting part |