Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2006
05/02/2006US7036216 Method and apparatus for connecting at least one chip to an external wiring configuration
05/02/2006CA2285067C Silicon carbide field controlled bipolar switch
04/2006
04/27/2006WO2006044804A2 Multi chip leadframe package
04/27/2006WO2006044745A2 Methods of optimization of implant conditions to minimize channeling and structures formed thereby
04/27/2006WO2006044731A2 Improved recessed drain extensions in transistor device
04/27/2006WO2006044688A1 Wide bandgap material and method of making it
04/27/2006WO2006044417A2 Cmp composition with a polymer additive for polishing noble metals
04/27/2006WO2006044399A1 Die-level traceability mechanism for semiconductor assembly and test facility
04/27/2006WO2006044349A2 Planar substrate devices integrated with finfets and method of manufacture
04/27/2006WO2006044219A2 Wafer level microelectronic packaging with double isolation
04/27/2006WO2006044184A2 Hermetically sealed glass package and method of fabrication
04/27/2006WO2006044127A2 System and method for planarizing a substrate
04/27/2006WO2006044112A2 Integration of multiple gate dielectrics by surface protection
04/27/2006WO2006044061A2 Die attach paddle for mounting integrated circuit die
04/27/2006WO2006044037A1 A method to form a passivation layer
04/27/2006WO2006044021A1 Substrate carrier for parallel wafer processing reactor
04/27/2006WO2006043991A2 Fine-pitch electronic socket for temporary or permanent attachments
04/27/2006WO2006043690A1 Laser irradiation method, laser irradiation apparatus and method for manufacturing semiconductor device
04/27/2006WO2006043685A1 Semiconductor device having antenna and method for manufacturing thereof
04/27/2006WO2006043656A1 Apparatus and method for depositing fine particles
04/27/2006WO2006043640A1 Mesoporous thin-membrane and process for producing the same
04/27/2006WO2006043561A1 Liquid quantity monitor, semiconductor manufacturing equipment provided with liquid quantity monitor and method for monitoring liquid material and liquid quantity
04/27/2006WO2006043554A1 Plasma sputtering film deposition method and equipment
04/27/2006WO2006043551A1 Plasma sputtering film deposition method and equipment
04/27/2006WO2006043531A1 Substrate supporting/transferring tray
04/27/2006WO2006043530A1 Substrate heat treatment apparatus and substrate transfer tray used in substrate heat treatment
04/27/2006WO2006043509A1 Vertical heat treatment apparatus and method for operating same
04/27/2006WO2006043471A1 Semiconductor wafer manufacturing method
04/27/2006WO2006043458A1 Lighting optical device, exposure system, and exposure method
04/27/2006WO2006043439A1 Coating liquid for formation of protective film for semiconductor processing, method for preparation thereof, and protective film for semiconductor processing provided therefrom
04/27/2006WO2006043438A1 Coating liquid for forming low dielectric constant amorphous silica coating film, method for preparing same, and low dielectric constant amorphous silica coating film obtained from same
04/27/2006WO2006043434A1 Bearing device and stage device, and exposure device
04/27/2006WO2006043433A1 Plasma cvd apparatus
04/27/2006WO2006043432A1 Process for film production and semiconductor device utilizing film produced by the process
04/27/2006WO2006043418A1 Alkoxide compound, thin film-forming material and method for forming thin film
04/27/2006WO2006043377A1 Sheet for forming solder bump and method for manufacture thereof
04/27/2006WO2006043243A1 Metal-oxide-semiconductor device with a doped titanate body
04/27/2006WO2006043235A1 Substrate with electric contacts and method of manufacturing the same
04/27/2006WO2006043224A1 Electromigration control
04/27/2006WO2006043105A1 Electro-optical device
04/27/2006WO2006042669A1 Jfet and production method
04/27/2006WO2006042519A1 Method for producing submicron structures
04/27/2006WO2006042498A1 Method for the creation of a layer system and layer system
04/27/2006WO2006029091A3 Thermally controlled fluidic self-assembly method and support
04/27/2006WO2006028775A3 Dram transistor with a gate buried in the substrate and method of forming thereof
04/27/2006WO2006023197A3 Semiconductor transistor having structural elements of differing materials and method of formation
04/27/2006WO2006018267A3 Power dissipation-optimized high-frequency coupling capacitor and rectifier circuit
04/27/2006WO2006000180A3 Bonding film, semiconductor component comprising a bonding film, and method for the production thereof
04/27/2006WO2005112099A3 Method of semiconductor fabrication in corporating disposable spacer into elevated source/drain processing
04/27/2006WO2005110057A3 Crystallographic alignment of high-density nanowire arrays
04/27/2006WO2005109472A3 Mobile pvd/cvd coating center
04/27/2006WO2005109437A3 Pfet nonvolatile memory
04/27/2006WO2005091862A3 Phosphor and blends thereof for use in leds
04/27/2006WO2005078508A3 Method and apparatus for scanning a beam of light
04/27/2006WO2005078506A3 High performance mems scanner
04/27/2006WO2005065179A3 Method of manufacturing a superjunction device
04/27/2006WO2005065072A3 Electrospray systems and methods
04/27/2006WO2004049399A3 Laterally difussed mos transistor (ldmos) and method of making same
04/27/2006US20060089740 Methods of and apparatuses for controlling process profiles
04/27/2006US20060089464 Resin composition for optical use
04/27/2006US20060089280 Semiconductor cleaning solution
04/27/2006US20060089008 Methods of manufacturing silicon oxide isolation layers and semiconductor devices that include such isolation layers
04/27/2006US20060089007 In situ deposition of a low K dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application
04/27/2006US20060089006 Metal oxide layer formed on substrates and its fabrication methods
04/27/2006US20060089005 Photoresist conditioning with hydrogen ramping
04/27/2006US20060089004 Adhering and releasing method for protective tape
04/27/2006US20060089003 Method for removing polymer as etching residue
04/27/2006US20060089002 Method to form etch and/or CMP stop layers
04/27/2006US20060089001 Localized use of high-K dielectric for high performance capacitor structures
04/27/2006US20060089000 Material and process for etched structure filling and planarizing
04/27/2006US20060088999 Methods and compositions for chemical mechanical polishing substrates
04/27/2006US20060088998 Wiring pattern forming method, film pattern forming method, semiconductor device, electro-optical device, and electronic equipment
04/27/2006US20060088997 Method to produce low strength temporary solder joints
04/27/2006US20060088996 Buffer zone for the prevention of metal migration
04/27/2006US20060088995 Metal barrier cap fabrication by polymer lift-off
04/27/2006US20060088994 Manufacturing method to construct semiconductor-on-insulator with conductor layer sandwiched between buried dielectric layer and semiconductor layers
04/27/2006US20060088993 Iridium oxide nanostructure patterning
04/27/2006US20060088992 Bumping process and structure thereof
04/27/2006US20060088991 Method of forming metal line in semiconductor memory device
04/27/2006US20060088990 Local interconnect manufacturing process
04/27/2006US20060088989 Method of introducing impurity, device and element
04/27/2006US20060088988 Method for forming silicon-germanium in the upper portion of a silicon substrate
04/27/2006US20060088987 Method of manufacturing a semiconductor device
04/27/2006US20060088986 Method of enhancing laser crystallization for polycrystalline silicon fabrication
04/27/2006US20060088985 Low temperature silicon compound deposition
04/27/2006US20060088984 Laser ablation method
04/27/2006US20060088983 Method of dividing wafer
04/27/2006US20060088982 System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
04/27/2006US20060088981 Wafer packaging and singulation method
04/27/2006US20060088980 Method of singulating electronic devices
04/27/2006US20060088979 Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same
04/27/2006US20060088978 Method of making a semiconductor structure for high power semiconductor devices
04/27/2006US20060088977 Method of forming an isolation layer in a semiconductor device
04/27/2006US20060088976 Methods and compositions for chemical mechanical polishing substrates
04/27/2006US20060088975 Method for fabricating semiconductor device and semiconductor device
04/27/2006US20060088974 Method of affecting rram characteristics by doping pcmo thin films
04/27/2006US20060088973 Methods of fabricating integrated circuit devices having resistors with different resistivities and devices formed thereby
04/27/2006US20060088972 Electrode for electrolytic capacitor, electrolytic capacitor, and manufacturing method therefor
04/27/2006US20060088971 Integrated inductor and method of fabrication
04/27/2006US20060088970 Apparatus and method for the low-contamination, automatic crushing of silicon fragments