Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2006
06/13/2006US7060555 Semiconductor device and method of manufacturing the same
06/13/2006US7060554 PECVD silicon-rich oxide layer for reduced UV charging
06/13/2006US7060553 Formation of capacitor having a Fin structure
06/13/2006US7060552 Memory device with hydrogen-blocked ferroelectric capacitor
06/13/2006US7060551 Method of fabricating read only memory and memory cell array
06/13/2006US7060550 Method of fabricating a bipolar junction transistor
06/13/2006US7060549 SRAM devices utilizing tensile-stressed strain films and methods for fabricating the same
06/13/2006US7060547 Method for forming a junction region of a semiconductor device
06/13/2006US7060546 Ultra-thin SOI MOSFET method and structure
06/13/2006US7060545 Method of making truncated power enhanced drift lateral DMOS device with ground strap
06/13/2006US7060544 Fabricating method of thin film transistor
06/13/2006US7060543 Method of forming a conductive line for a semiconductor device using a carbon nanotube and semiconductor device manufactured using the method
06/13/2006US7060542 Display system and method of producing the same
06/13/2006US7060541 Method of fabricating thin film transistor TFT array
06/13/2006US7060540 Method of fabricating thin film transistor array
06/13/2006US7060539 Method of manufacture of FinFET devices with T-shaped fins and devices manufactured thereby
06/13/2006US7060538 Versatile system for electrostatic discharge protection utilizing silicon controlled rectifier
06/13/2006US7060537 Microchip controller board manufacturing method
06/13/2006US7060536 Dual row leadframe and fabrication method
06/13/2006US7060535 Flat no-lead semiconductor die package including stud terminals
06/13/2006US7060534 Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins
06/13/2006US7060533 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
06/13/2006US7060532 Manufacturing method of semiconductor device
06/13/2006US7060531 Method of cutting semiconductor wafer and protective sheet used in the cutting method
06/13/2006US7060530 wiring board or a lead frame, a wall member fixed onto the base member to define a cavity, and a cured-resin cap member for encapsulating a semiconductor chip in the cavity
06/13/2006US7060529 Multiple chip semiconductor arrangement having electrical components in separating regions
06/13/2006US7060528 Method for mounting a semiconductor element to an interposer by compression bonding
06/13/2006US7060527 Semiconductor package having grooves formed at side flash, groove forming method, and deflashing method using semiconductor package formed with grooves
06/13/2006US7060526 Wafer level methods for fabricating multi-dice chip scale semiconductor components
06/13/2006US7060525 Semiconductive chip having a bond pad located on an active device
06/13/2006US7060524 Methods of testing/stressing a charge trapping device
06/13/2006US7060523 Lithium-drifted silicon detector with segmented contacts
06/13/2006US7060522 Membrane structures for micro-devices, micro-devices including same and methods for making same
06/13/2006US7060521 Bonding method
06/13/2006US7060520 Piezoelectric device and cover sealing method and apparatus therefor, cellular phone apparatus using piezoelectric device and electronic apparatus using piezoelectric device
06/13/2006US7060519 Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server
06/13/2006US7060518 Semiconductor optical device and the fabrication method
06/13/2006US7060517 Method of reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region
06/13/2006US7060516 Method for integrating optical devices in a single epitaxial growth step
06/13/2006US7060515 Method of manufacturing a laser diode package
06/13/2006US7060514 Process for fabricating films of uniform properties on semiconductor devices
06/13/2006US7060513 Method of testing FPC bonding yield and FPC having testing pads thereon
06/13/2006US7060512 Patching methods and apparatus for fabricating memory modules
06/13/2006US7060510 Electronic and optoelectronic devices and methods for preparing same
06/13/2006US7060509 Method for defining reference magnetizations in layer systems
06/13/2006US7060454 Method for sorting antifungal molecules acting on the glucanosyltransferase activity
06/13/2006US7060422 Method of supercritical processing of a workpiece
06/13/2006US7060414 2,4,6-trimethylphenyldiphenylsulfonium 2,4-difluorobenzenesulfonate; a photoacid generator, sensitive to far ultraviolet radiation; excellant resolution
06/13/2006US7060403 In-situ pellicle monitor
06/13/2006US7060402 rotating a template about a first and a second axis to with respect to the substrate, maintaining the orientation in response to a force being exerted upon said template; photolithograghy for semiconductor wafers
06/13/2006US7060397 Using a charged particle beam to eliminate attached particles from the result of splashing, correcting defects; semiconductor wafer
06/13/2006US7060395 Light shield zones; chromium film and phase shifting mask on radiation transparent substrate; design masking pattern
06/13/2006US7060361 Filling spacings between wires; baking organosilicon compound in oxygen
06/13/2006US7060339 Dicing/die-bonding film, method of fixing chipped work and semiconductor device
06/13/2006US7060330 Chemical vapor deposition; low dielectric constant (k)
06/13/2006US7060324 Moving a liquid between a substrate and a template, forming an oblique angle in a plane reducing the distance between substrate and plane and forming a dispersion
06/13/2006US7060323 Method of forming interlayer insulating film
06/13/2006US7060224 Methods for the electronic, homogeneous assembly and fabrication of devices
06/13/2006US7060216 Tire pressure sensors and methods of making the same
06/13/2006US7060204 Dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent
06/13/2006US7060196 supplying charge particle beams; using oxidizer; removal of copper
06/13/2006US7060194 Dry etching method for magnetic material
06/13/2006US7060193 Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits
06/13/2006US7060154 Method and apparatus for removing unwanted substance from semiconductor wafer
06/13/2006US7060153 Display device and method of manufacturing the same
06/13/2006US7060138 Methods for cleaning wafer containers
06/13/2006US7060115 Substrate processing method, substrate processing apparatus and substrate carrying method
06/13/2006US7059944 Integrated system for processing semiconductor wafers
06/13/2006US7059942 Method of backgrinding wafers while leaving backgrinding tape on a chuck
06/13/2006US7059941 Using amine; polishing ratio of dielectric to stopper film; removing sedimentation from silicon
06/13/2006US7059940 Jet singulation
06/13/2006US7059937 Systems including differential pressure application apparatus
06/13/2006US7059859 Manufacturing method of semiconductor device
06/13/2006US7059849 Heat treatment system and a method for cooling a loading chamber
06/13/2006US7059817 Wafer handling apparatus and method
06/13/2006US7059607 Positioning apparatus
06/13/2006US7059583 Unitary slot valve actuator with dual valves
06/13/2006US7059512 Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device
06/13/2006US7059476 Tray for electronic parts
06/13/2006US7059475 System for cushioning wafer in wafer carrier
06/13/2006US7059363 Method of supplying divided gas to a chamber from a gas supply apparatus equipped with a flow-rate control system
06/13/2006US7059268 Method, apparatus and magnet assembly for enhancing and localizing a capacitively coupled plasma
06/13/2006US7059267 Use of pulsed grounding source in a plasma reactor
06/13/2006US7059049 Electronic package with optimized lamination process
06/13/2006US7059048 Wafer-level underfill process making use of sacrificial contact pad protective material
06/13/2006US7059045 Method for handling integrated circuit die
06/13/2006US7059043 Method for mounting an electronic part by solder position detection
06/13/2006US7059042 Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink
06/13/2006US7059041 Methods for producing passive components on a semiconductor substrate
06/13/2006CA2334862C An integrated inorganic/organic complementary thin-film transistor circuit and a method for its production
06/08/2006WO2006060758A2 Methods of exposure for the purpose of thermal management for imprint lithography processes
06/08/2006WO2006060752A2 Wet etching of the edge and bevel of a silicon wafer
06/08/2006WO2006060599A2 Semiconductor devices based on coalesced nano-rod arrays
06/08/2006WO2006060592A2 Device comprising low outgassing photo or electron beam cured rubbery polymer material
06/08/2006WO2006060590A2 Reduced circuit area and improved gate length control in semiconductor device
06/08/2006WO2006060575A2 Method for forming self-aligned dual salicide in cmos technologies
06/08/2006WO2006060574A2 Method for forming self-aligned dual fully silicided gates in cmos devices
06/08/2006WO2006060562A2 Method for designing an overlay mark
06/08/2006WO2006060554A2 A micro-fluid ejection head containing reentrant fluid feed slots
06/08/2006WO2006060543A2 Use of cl2 and/or hcl during silicon epitaxial film formation