H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2006
06/08/2006	US20060121731 Semiconductor manufacturing system and method for manufacturing a semiconductor device
06/08/2006	US20060121730 Method of forming damascene structures
06/08/2006	US20060121729 Methods for the optimization of ion energy control in a plasma processing system
06/08/2006	US20060121728 Method for fast filling of templates for imprint lithography using on template dispense
06/08/2006	US20060121727 Method for making a semiconductor device having a high-k gate dielectric and a titanium carbide gate electrode
06/08/2006	US20060121726 Methods of depositing silver onto a metal selenide-comprising surface, methods of depositing silver onto a selenium-comprising surface, and methods of forming a resistance variable device
06/08/2006	US20060121725 Method and system for electroprocessing conductive layers
06/08/2006	US20060121724 Contact resistance reduction by new barrier stack process
06/08/2006	US20060121723 Semiconductor process and method of fabricating inter-layer dielectric
06/08/2006	US20060121722 Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components
06/08/2006	US20060121721 Methods for forming dual damascene wiring using porogen containing sacrificial via filler material
06/08/2006	US20060121720 Low stress semiconductor device coating and method of forming thereof
06/08/2006	US20060121719 Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure
06/08/2006	US20060121718 Manufacturing method of chip integrated substrate
06/08/2006	US20060121717 Bonding structure and fabrication thereof
06/08/2006	US20060121716 Method for the production of electrodes on a type II or VI semiconductor material or on a compound of said material
06/08/2006	US20060121715 Integrated circuit having gates and active regions forming a regular grating
06/08/2006	US20060121714 Semiconductor device and method for manufacturing the same
06/08/2006	US20060121713 Method for manufacturing a silicided gate electrode using a buffer layer
06/08/2006	US20060121712 Semiconductor constructions and methods of forming semiconductor constructions
06/08/2006	US20060121711 Method for forming a semiconductor arrangement with gate sidewall spacers of specific dimensions
06/08/2006	US20060121710 Thermal conducting trench in a semiconductor structure
06/08/2006	US20060121709 Fluorine-free metallic complexes for gas-phase chemical metal deposition
06/08/2006	US20060121708 Method of forming self-aligned silicides
06/08/2006	US20060121707 Ion implantation system and method of monitoring implant energy of an ion implantation device
06/08/2006	US20060121706 Divergent charged particle implantation for improved transistor symmetry
06/08/2006	US20060121705 Devices and methods for integrated circuit manufacturing
06/08/2006	US20060121704 Plasma ion implantation system with axial electrostatic confinement
06/08/2006	US20060121703 Assembly structure of electronic element and heat sink
06/08/2006	US20060121702 III-nitride light emitting devices fabricated by substrate removal
06/08/2006	US20060121701 Technique and apparatus for depositing layers of semiconductors for solar cell and module fabrication
06/08/2006	US20060121700 Method of forming a gate insulator in group III-V nitride semiconductor devices
06/08/2006	US20060121699 Deposition methods
06/08/2006	US20060121698 Plastic film and heat-dissipating ring for chip cutting
06/08/2006	US20060121697 Substrate dividing method
06/08/2006	US20060121696 Method for manufacturing SOI wafer
06/08/2006	US20060121695 Method for manufacturing semiconductor thin film
06/08/2006	US20060121694 Manufacturing method of semiconductor device
06/08/2006	US20060121693 Method and device for wafer scale packaging of optical devices using a scribe and break process
06/08/2006	US20060121692 Method for manufacturing SOI wafer
06/08/2006	US20060121691 Method of manufacturing single crystal Si film
06/08/2006	US20060121690 Three-dimensional device fabrication method
06/08/2006	US20060121689 Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
06/08/2006	US20060121688 Transistor mobility by adjusting stress in shallow trench isolation
06/08/2006	US20060121687 Semiconductor device having a multi-bridge-channel and method for fabricating the same
06/08/2006	US20060121686 Airdome enclosure for components
06/08/2006	US20060121685 Semiconductor device and method of fabricating the same
06/08/2006	US20060121684 Method of forming a polysilicon resistor
06/08/2006	US20060121683 Point source diffusion for avalanche photodiodes
06/08/2006	US20060121682 Strain balanced nitride heterojunction transistors and methods of fabricating strain balanced nitride heterojunction transistors
06/08/2006	US20060121681 Method for forming halo/pocket implants through an L-shaped sidewall spacer
06/08/2006	US20060121680 Semiconductor device and manufacturing method thereof
06/08/2006	US20060121679 Semiconductor device and method for manufacturing the same
06/08/2006	US20060121678 Method for making a semiconductor device with a high-k gate dielectric and a metal gate electrode
06/08/2006	US20060121677 Methods of forming integrated circuitry, methods of forming memory circuitry, and methods of forming field effect transistors
06/08/2006	US20060121676 Trench MIS device with thick oxide layer in bottom of gate contact trench
06/08/2006	US20060121675 Nonvolatile memory device and method of manufacturing the same
06/08/2006	US20060121674 Method of making a scalable flash EEPROM memory cell with notched floating gate and graded source region
06/08/2006	US20060121673 Multi-bit nanocrystal memory
06/08/2006	US20060121672 Methods of forming pluralities of capacitors, and integrated circuitry
06/08/2006	US20060121671 Semiconductor device and manufacturing process therefor
06/08/2006	US20060121670 Memory device having a semiconducting polymer film
06/08/2006	US20060121669 Heterojunction bipolar transistor with dielectric assisted planarized contacts and method for fabricating
06/08/2006	US20060121668 Method for making a semiconductor device having a high-K gate dielectric and a titanium carbide gate electrode
06/08/2006	US20060121667 Method of fabricating SiGe Bi-CMOS device
06/08/2006	US20060121666 Method for fabricating a voltage-stable PMOSFET semiconductor structure
06/08/2006	US20060121665 Method for forming self-aligned dual salicide in cmos technologies
06/08/2006	US20060121664 Method for forming self-aligned dual salicide in CMOS technologies
06/08/2006	US20060121663 Method for forming self-aligned dual fully silicided gates in cmos devices
06/08/2006	US20060121662 Method for forming self-aligned dual salicide in cmos technologies
06/08/2006	US20060121661 Non-volatile memory device using mobile ionic charge and method of manufacturing the same
06/08/2006	US20060121660 Semiconductor device having carbon-containing metal silicide layer and method of fabricating the same
06/08/2006	US20060121659 Fabricating method of thin film transistor and poly-silicon layer
06/08/2006	US20060121658 Method of manufacturing field effect transistor
06/08/2006	US20060121657 Method for manufacturing a semconductor device
06/08/2006	US20060121656 Methods of manufacturing semiconductor devices
06/08/2006	US20060121655 Method of crystallizing amorphous semiconductor thin film and method of fabricating poly crystalline thin film transistor using the same
06/08/2006	US20060121654 Transistor assembly and method of its fabrication
06/08/2006	US20060121653 Method for insulating patterns formed in a thin film of oxidizable semi-conducting material
06/08/2006	US20060121652 Semiconductor Device and Method of Manufacturing the Same
06/08/2006	US20060121651 Thin film transistor and method of fabricating the same
06/08/2006	US20060121650 Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device
06/08/2006	US20060121649 Methods for fabricating stiffeners for flexible substrates
06/08/2006	US20060121648 Methods and apparatus for addition of electrical conductors to previously fabricated device
06/08/2006	US20060121647 Carrier-free semiconductor package and fabrication method thereof
06/08/2006	US20060121646 Wafer-level underfill process making use of sacrificial contact pad protective material
06/08/2006	US20060121645 Method of fabrication of stacked semiconductor devices
06/08/2006	US20060121644 Method for die attaching
06/08/2006	US20060121642 Manufacturing process of light-emitting device
06/08/2006	US20060121641 Apparatus and method for fabricating nano/micro structure
06/08/2006	US20060121640 CMOS image sensor and method for forming the same
06/08/2006	US20060121639 Microfabricated devices for wireless data and power transfer
06/08/2006	US20060121638 Method of producing nitride-based compound semiconductor light-emitting device
06/08/2006	US20060121637 MBE growth of p-type nitride semiconductor materials
06/08/2006	US20060121636 Liquid crystal display device and fabricating method thereof
06/08/2006	US20060121635 Lids for wafer-scale optoelectronic packages
06/08/2006	US20060121634 Liquid crystal display device and fabricating method thereof
06/08/2006	US20060121633 Semiconductor laser device manufacturing method and semiconductor laser device
06/08/2006	US20060121632 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
06/08/2006	US20060121631 Method of producing semiconductor elements using a test structure

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