| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/14/2006 | EP1670045A2 Gate of a memory transistor with a ferroelectric layer and method of manufacturing the same |
| 06/14/2006 | EP1670044A1 Production method for silicon epitaxial wafer, and silicon epitaxial wafer |
| 06/14/2006 | EP1670043A2 Exposure apparatus, exposure method, and device manufacturing method |
| 06/14/2006 | EP1670041A1 Exposure method and apparatus, and device manufacturing method |
| 06/14/2006 | EP1670040A1 Projection exposure device, projection exposure method, and device manufacturing method |
| 06/14/2006 | EP1670039A1 Exposure apparatus and device producing method |
| 06/14/2006 | EP1670038A1 Optical element and exposure device |
| 06/14/2006 | EP1669808A2 Substrate placement in immersion lithography |
| 06/14/2006 | EP1669803A2 Novel copolymers and photoresist compositions comprising copolymer resin binder component |
| 06/14/2006 | EP1669389A1 Crosslinkable fluoroaromatic prepolymer and use thereof |
| 06/14/2006 | EP1668710A1 Light emitting diode with porous sic substrate and method for fabricating |
| 06/14/2006 | EP1668706A2 Structure and method for metal replacement gate of high performance device |
| 06/14/2006 | EP1668705A1 Heterojunction bipolar transistor with tunnelling mis emitter junction |
| 06/14/2006 | EP1668703A1 Dynamic control of capacitance elements in field effect semiconductor devices |
| 06/14/2006 | EP1668699A2 Method of forming a semiconductor package and structure thereof |
| 06/14/2006 | EP1668696A1 Method for separately optimizing thin gate dielectric of pmos and nmos transistors within the same semiconductor chip and device manufactured thereby |
| 06/14/2006 | EP1668695A1 Method and apparatus for fabricating cmos field effect transistors |
| 06/14/2006 | EP1668694A1 Semiconductor device, method of manufacturing same, identification label and information carrier |
| 06/14/2006 | EP1668693A1 Indirect bonding with disappearance of the bonding layer |
| 06/14/2006 | EP1668692A2 Adjustable self-aligned air gap dielectric for low capacitance wiring |
| 06/14/2006 | EP1668691A2 Method for forming a semiconductor device having isolation regions |
| 06/14/2006 | EP1668690A2 Electric ultimate defects analyzer detecting all defects in pcb/mcm |
| 06/14/2006 | EP1668689A2 Process and integration scheme for fabricating conductive components through-vias and semiconductor components including conductive through-wafer vias |
| 06/14/2006 | EP1668687A1 Fabrication of conductive metal layer on semiconductor devices |
| 06/14/2006 | EP1668686A2 Reversible leadless package and methods of making and using same |
| 06/14/2006 | EP1668685A1 Integrated electronic chip and interconnect device and process for making the same |
| 06/14/2006 | EP1668684A1 Transparent amorphous carbon structure in semiconductor devices |
| 06/14/2006 | EP1668683A1 Method of forming dielectric layers with low dielectric constants |
| 06/14/2006 | EP1668682A2 Growth of high-k dielectrics by atomic layer deposition |
| 06/14/2006 | EP1668681A1 A semiconductor device having a nickel/cobalt silicide region formed in a silicon region |
| 06/14/2006 | EP1668680A1 Method for the production of a hard mask and hard mask arrangement |
| 06/14/2006 | EP1668679A1 Illumination optical system and exposure apparatus using the same |
| 06/14/2006 | EP1668678A1 Capacitor constructions, rugged silicon-containing surfaces, and methods of forming rugged silicon-containing surfaces |
| 06/14/2006 | EP1668677A1 A device and a method for forming a capacitor device |
| 06/14/2006 | EP1668676A1 Method for forming ferrocapacitors and feram devices |
| 06/14/2006 | EP1668675A1 Method for forming vertical ferroelectric capacitors |
| 06/14/2006 | EP1668673A2 Semiconductor device and making thereof |
| 06/14/2006 | EP1668672A2 Structure and method of making strained channel cmos transistors having lattice-mismatched epitaxial extension and source and drain regions |
| 06/14/2006 | EP1668668A2 Deposition of silicon-containing films from hexachlorodisilane |
| 06/14/2006 | EP1668416A2 Method and apparatus for protecting a reticle used in chip production from contamination |
| 06/14/2006 | EP1668174A2 Plating method and apparatus |
| 06/14/2006 | EP1668168A2 Control system for a sputtering system |
| 06/14/2006 | EP1625409A4 Planarizing and testing of bga packages |
| 06/14/2006 | EP1622819A4 Tray carrier with ultraphobic surfaces |
| 06/14/2006 | EP1618035A4 Microfluidic device with ultraphobic surfaces |
| 06/14/2006 | EP1613866A4 Fluid handling component with ultraphobic surfaces |
| 06/14/2006 | EP1613541A4 Carrier with ultraphobic surfaces |
| 06/14/2006 | EP1590836A4 Mram cells having magnetic write lines with a stable magnetic state at the end regions |
| 06/14/2006 | EP1535290A4 Nanoporous materials and methods of formation thereof |
| 06/14/2006 | EP1459354B1 Retaining device, especially for fixing a semiconductor wafer in a plasma etching device, and method for supplying heat to or discharging heat from a substrate |
| 06/14/2006 | EP1446805B8 Electrodes, method and apparatus for memory structure |
| 06/14/2006 | EP1438447B1 Method and conveyorized system for electrolytically processing work pieces |
| 06/14/2006 | EP1381663B1 Cleaning compositions |
| 06/14/2006 | EP1240672B1 Production of single-pole components |
| 06/14/2006 | EP1234327A4 Reactor for processing a semiconductor wafer |
| 06/14/2006 | EP1206399A4 Protective system for integrated circuit (ic) wafers |
| 06/14/2006 | EP1142011B1 Method of forming devices with graded top oxide and graded drift region |
| 06/14/2006 | EP1141444B1 Novel composition for selective etching of oxides over metals |
| 06/14/2006 | EP1125328B1 Method for producing a dram cell arrangement |
| 06/14/2006 | EP1103071A4 Detection of nontransient processing anomalies in vacuum manufacturing process |
| 06/14/2006 | EP1042818B1 Coulomb blockade multilevel memory device and corresponding methods of making and operating the same |
| 06/14/2006 | EP1025583B1 Improved gapfill of semiconductor structure using doped silicate glasses with multi-step deposition/anneal process |
| 06/14/2006 | EP1024965B1 Process for removing residues from a semiconductor substrate |
| 06/14/2006 | EP0988116A4 High efficiency photoresist coating |
| 06/14/2006 | EP0966761B1 Vertical igbt with an soi structure |
| 06/14/2006 | EP0956142B1 Liquid cooled trap |
| 06/14/2006 | EP0871979B1 Method of manufacturing a silicon photovoltaic cell and cell obtained by this method |
| 06/14/2006 | DE20221268U1 Chamber for use with gas delivery apparatus for atomic layer deposition, includes chamber lid having bottom surface that is shaped and sized to cover receiving surface of substrate support |
| 06/14/2006 | DE19948455B4 Vorrichtung und Verfahren zum Positionieren und Bestücken eines Bauelements in Oberflächen-Montagetechnik Apparatus and method for positioning and loading a component in surface mount technology |
| 06/14/2006 | DE19943385B4 Verfahren zur Herstellung einer elektrischen Verbindung zwischen der Vorder- und Rückseite von Halbleiterchips A method for making an electrical connection between the front and back of the semiconductor chip |
| 06/14/2006 | DE19921259B4 Nichtflüchtiger ferroelektrischer Speicher Non-volatile ferroelectric memory |
| 06/14/2006 | DE19781956B4 Verfahren zum Aufbringen einer planarisierten dielektrischen Schicht auf einem Halbleitersubstrat A method of applying a planarized dielectric layer on a semiconductor substrate |
| 06/14/2006 | DE112004000877T5 Verfahren zur Herstellung von Widerstandsstrukturen A method of manufacturing resistive structures |
| 06/14/2006 | DE112004000060T5 Schaltelement, Verfahren zum Ansteuern des Schaltelements, überschreibbare integrierte Logikschaltung und Speicherelement Switching element, method of driving the switching element, rewritable logic integrated circuit memory element, and |
| 06/14/2006 | DE10358325B4 Verfahren zum Herstellen einer integrierten Halbleiterschaltungsanordnung A method of manufacturing a semiconductor integrated circuit arrangement |
| 06/14/2006 | DE10350510B4 Integrierte Schaltungsvorrichtungen mit Sicherungsstrukturen, die Pufferschichten enthalten, und Verfahren zur Herstellung derselben Integrated circuit devices with fuse structures comprising buffer layers and methods for making the same |
| 06/14/2006 | DE10317268B4 Verfahren zur fehlerfreien Medieneingabe in Halbleiterherstellungsprozessen A method for error-free media input in semiconductor manufacturing processes |
| 06/14/2006 | DE10309998B4 Halbleiterbauelement mit einer verstärkten Substruktur einer Kontaktstelle und zugehöriges Herstellungsverfahren A semiconductor device with a reinforced substructure of a contact point and associated production method |
| 06/14/2006 | DE10260344B4 Magnetische Dünnfilmspeichervorrichtung, die Daten mit bidirektionalem Strom schreibt Thin film magnetic memory device which writes data with bidirectional current |
| 06/14/2006 | DE10255849B4 Verbesserte Drain/Source-Erweiterungsstruktur eines Feldeffekttransistors mit dotierten Seitenwandabstandselementen mit hoher Permittivität und Verfahren zu deren Herstellung Improved drain / source extension structure of a field effect transistor having the doped sidewall spacers with high permittivity and processes for their preparation |
| 06/14/2006 | DE10231965B4 Verfahren zur Herstellung einer T-Gate-Struktur sowie eines zugehörigen Feldeffekttransistors A method for preparing a T-gate structure as well as of an associated field effect transistor |
| 06/14/2006 | DE10230088B4 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device |
| 06/14/2006 | DE10220921B4 Verfahren zur Herstellung eines Halbleiterelements A process for producing a semiconductor element |
| 06/14/2006 | DE102005052504A1 Verfahren zum Laserbearbeiten eines Wafers Method of laser processing a wafer |
| 06/14/2006 | DE102005029313A1 Manufacture of semiconductor device by forming polysilicon layer on buried oxide film, and implanting impurity into second silicon epitaxial layer and polysilicon layer to form source/drain region |
| 06/14/2006 | DE102005012396B3 Semiconductor chip e.g. flip-chip, mounting method for use on substrate, involves taking chips from sprinkler station and feeding to mounting station, where chips are again taken from initialization station and placed in sprinkler station |
| 06/14/2006 | DE102005007423B3 Integration of electronic component (8) into substrate by formation of dielectric insulating layers on substrate front side useful in structural element modelling in semiconductor flip-chip technology with photoresistive layer in cavity |
| 06/14/2006 | DE102005003127B3 Lateral semiconductor component, such as IGBT-transistors and MOSFET and JFET, has drift regions of drift zone extending in lateral direction |
| 06/14/2006 | DE102004061327A1 Vertikaler Bipolartransistor A vertical bipolar transistor |
| 06/14/2006 | DE102004060171A1 Charge-trapping-Speicherzelle und Herstellungsverfahren Charge-trapping memory cell, and manufacturing method |
| 06/14/2006 | DE102004059651A1 Crystalline layer on a Si substrate, is formed by epitaxial precipitation on a porous region of the substrate |
| 06/14/2006 | DE102004059505A1 Anordnung zum Test von eingebetteten Schaltungen mit Hilfe von Testinseln Arrangement for testing embedded circuits using test Islands |
| 06/14/2006 | DE102004059123A1 Substrate e.g. glass substrate, thinning device, has determining unit finding thinning period value based on sensor unit`s output value, thickness target value and auxiliary value specified based on difference in output and target values |
| 06/14/2006 | DE102004058958A1 Material mit hoher Bandlücke und Dielektrizitätskonstante Material with a high dielectric constant and band gap |
| 06/14/2006 | DE102004058878A1 Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device |
| 06/14/2006 | DE102004004846B4 Verfahren zum Abscheiden einer Schicht aus einem Material auf einem Substrat A method of depositing a layer of a material on a substrate |
| 06/14/2006 | DE10131625B4 Verfahren zum Herstellen eines FeRAM-Speichers A method of manufacturing a FeRAM memory |
| 06/14/2006 | DE10116875B4 Verfahren zur Herstellung eines integrierten ferroelektrischen Speichers A process for producing an integrated ferroelectric memory |
| 06/14/2006 | DE10050050B4 Verfahren zur Verringerung des Belastungseffekts beim Ätzen tiefer Gräben Process for reducing the loading effect during etching deep trenches |
| 06/14/2006 | DE10004436B4 Greifer für eine Aufnahmevorrichtung einer Handhabungsvorrichtung für IC-Module Gripper for a receiving device of a handling device for IC modules |