Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2006
06/20/2006US7063603 Method and apparatus for cleaning a web-based chemical mechanical planarization system
06/20/2006US7063600 Polishing apparatus
06/20/2006US7063598 Substrate delivery mechanism
06/20/2006US7063597 Polishing processes for shallow trench isolation substrates
06/20/2006US7063499 Conveyor system
06/20/2006US7063478 Crystallization apparatus and crystallization method
06/20/2006US7063455 Chemical dilution system for semiconductor device processing system
06/20/2006US7063301 Facilities connection bucket for pre-facilitation of wafer fabrication equipment
06/20/2006US7063246 Brittle material rotating and aligning mechanism for use in a brittle material scribing and/or breaking apparatus
06/20/2006US7063192 Active vibration suppression apparatus, control method therefor, and exposure apparatus having active vibration suppression apparatus
06/20/2006US7063097 In-situ gas blending and dilution system for delivery of dilute gas at a predetermined concentration
06/20/2006US7063094 Substrate processing apparatus
06/20/2006US7063091 Method for cleaning the surface of a substrate
06/20/2006US7062850 Forming a row of aligned windows in a planar surface; depositing an electromigration-inhibiting/electrically conductive material over the planar surface and through the windows to fill; removing portions
06/20/2006CA2307231C Silicon based conductive material and process for production thereof
06/20/2006CA2297058C Electrode means, with or without functional elements and an electrode device formed of said means
06/15/2006WO2006063353A2 Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step
06/15/2006WO2006063272A2 Alloyed underlayer for microelectronic interconnects
06/15/2006WO2006063269A2 A method for making a semiconductor device with a high-k gate dielectric and a metal gate electrode
06/15/2006WO2006063259A1 Wafer bonded mos decoupling capacitor
06/15/2006WO2006063170A2 Methodology for recovery of hot carrier induced degradation in bipolar devices
06/15/2006WO2006063145A2 A method for manufacturing a silicided gate electrode using a buffer layer
06/15/2006WO2006063102A2 Method of correction for wafer crystal cut error in semiconductor processing
06/15/2006WO2006063098A1 Lift-off patterning processes employing energetically-stimulated local removal of solid-condensed-gas layers
06/15/2006WO2006063070A2 All surface data for use in substrate inspection
06/15/2006WO2006063060A2 Device having enhanced stress state and related methods
06/15/2006WO2006063046A2 Charged particle implantation for transistor symmetry
06/15/2006WO2006063044A2 Method and device for wafer scale packaging of optical devices using a scribe and break process
06/15/2006WO2006063007A2 Method and system for providing a highly textured magnetoresistance element and magnetic memory
06/15/2006WO2006062869A1 Strained silicon, gate engineered fermi-fets
06/15/2006WO2006062823A2 Systems and methods for solder bonding
06/15/2006WO2006062536A2 Formation of ultra-shallow junctions by gas-cluster ion irridation
06/15/2006WO2006062534A1 Non-aqueous, non-corrosive microelectronic cleaning compositions
06/15/2006WO2006062332A1 Saddle type flash memory device and method of fabricating the same
06/15/2006WO2006062307A1 Scrap elimination apparatus
06/15/2006WO2006062303A1 Method for designing block placement and power distribution of semiconductor integrated circuit
06/15/2006WO2006062232A1 Substrate holding device and polishing apparatus
06/15/2006WO2006062195A1 Semiconductor package substrate
06/15/2006WO2006062188A1 Exposure apparatus, exposure method and device manufacturing method
06/15/2006WO2006062183A1 Transfer robot and transfer apparatus
06/15/2006WO2006062180A1 Display device
06/15/2006WO2006062158A1 Polishing pad
06/15/2006WO2006062150A1 Magnetic random access memory
06/15/2006WO2006062145A1 Image exposing method and apparatus
06/15/2006WO2006062099A1 Reflective photomask blank, reflective photomask, and method for manufacturing semiconductor device using same
06/15/2006WO2006062096A1 Exposure apparatus and method for manufacturing device
06/15/2006WO2006062091A1 Component mounting apparatus and component mounting method
06/15/2006WO2006062085A1 Dry etching method and dry etching apparatus
06/15/2006WO2006062074A1 Substrate processing method, exposure method, exposure apparatus, and method for manufacturing device
06/15/2006WO2006062065A1 Maintenance method, maintenance apparatus, exposure apparatus and device manufacturing method
06/15/2006WO2006062017A1 Division starting poin forming method in body to be divided, dividing method for body to be divided, and method of processing work by pulse laser beam
06/15/2006WO2006062005A1 Cleaning liquid for lithography and method for resist pattern formation
06/15/2006WO2006061975A1 Method for forming resist pattern
06/15/2006WO2006061942A1 Bidirectional field-effect transistor and matrix converter
06/15/2006WO2006061875A1 Semiconductor device manufacturing method
06/15/2006WO2006061871A1 Semiconductor device
06/15/2006WO2006061830A2 Automated monitoring of analog guages
06/15/2006WO2006061764A1 Method of manufacturing a semiconductor device and semiconductor device obtained by using such a method
06/15/2006WO2006061731A1 Method of producing an epitaxial layer on a semiconductor substrate and device produced with such a method
06/15/2006WO2006061673A1 Semiconductor package having at least two semiconductor chips and method of assembling the semiconductor package
06/15/2006WO2006061589A1 Electronic devices
06/15/2006WO2006061439A1 Vertical bipolar transistor
06/15/2006WO2006061371A1 Cmos transistor and method of manufacture thereof
06/15/2006WO2006061369A1 Semiconductor device and method of manufacture thereof
06/15/2006WO2006061350A1 Thermode unit for semiconductor components
06/15/2006WO2006061318A1 Integrated circuit dielectric having oriented cylindrical voids
06/15/2006WO2006061277A1 Semiconductor device and method for production thereof
06/15/2006WO2006061205A2 Method and device for etching substrates received in an etching solution
06/15/2006WO2006060981A1 Semiconductor component and method for producing a semiconductor component
06/15/2006WO2006060978A1 Wide band-gap, high relative permittivity material
06/15/2006WO2006060976A1 Method for applying an adhesive layer to thinly ground semiconductor chips of a semiconductor wafer
06/15/2006WO2006060913A1 Wire bonder for ball bonding insulated wire and method of using same
06/15/2006WO2006047326B1 Sacrificial substrate for etching
06/15/2006WO2006047215A3 Method and system for transferring a patterned material
06/15/2006WO2006028942A3 Thermally controlled self-assembly method and support
06/15/2006WO2006005317A3 Method for the production of an electric component and component
06/15/2006WO2005117125A3 Yield improvement in silicon-germanium epitaxial growth
06/15/2006WO2005117089A3 Decoupled complementary mask patterning transfer method
06/15/2006WO2005114742A3 Silicon on insulator read-write non-volatile memory comprising lateral thyristor and trapping layer
06/15/2006WO2005114720A3 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same
06/15/2006WO2005098976A3 Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same
06/15/2006WO2005024904A3 Reduction of feature critical dimensions
06/15/2006US20060129967 System, method and program for generating mask data, exposure mask and semiconductor device in consideration of optical proximity effects
06/15/2006US20060129264 Method for controlling semiconductor processing apparatus
06/15/2006US20060128914 Monomers selected from1-trifluoro-2-trifluoromethyl-2-hydroxy-(4 or 5)-pentyl (meth)acrylate or 2-{[5-(1',1',1'-trifluoro-2'-trifluoromethyl-2'-hydroxy)propyl]norbornyl]}(meth)acrylate
06/15/2006US20060128834 Microelectronic devices having underfill materials with improved fluxing agents
06/15/2006US20060128286 Polishing apparatus
06/15/2006US20060128277 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
06/15/2006US20060128276 Carrier for double side polishing
06/15/2006US20060128271 Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
06/15/2006US20060128250 Method of integrating organic light emitting diode and organic field effect transistor
06/15/2006US20060128211 Holding device for holding a tested electronic module
06/15/2006US20060128168 Atomic layer deposited lanthanum hafnium oxide dielectrics
06/15/2006US20060128167 Semiconductor device fabrication method
06/15/2006US20060128166 Semiconductor device fabrication method
06/15/2006US20060128165 Method for patterning surface modification
06/15/2006US20060128164 Chemical treatment of semiconductor substrates
06/15/2006US20060128163 Surface treatment of post-rie-damaged p-osg and other damaged materials
06/15/2006US20060128162 Process for fabricating a semiconductor device having an RTCVD layer
06/15/2006US20060128161 Film formation method and apparatus for semiconductor process