| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/08/2006 | US20060118803 Semiconductor light emitting diode having high efficiency and method of manufacturing the same |
| 06/08/2006 | US20060118802 Semiconductor light emitting device having textured structure and method of manufacturing the same |
| 06/08/2006 | US20060118796 Micro device and manufacturing method thereof |
| 06/08/2006 | US20060118794 Semiconductor light-emitting device and method of manufacturing the same |
| 06/08/2006 | US20060118793 Thin film transistor array panel and method for manufacturing the same |
| 06/08/2006 | US20060118786 Thin film transistor, method of manufacturing the same, display apparatus having the same and method of manufacturing the display apparatus |
| 06/08/2006 | US20060118785 Techniques for patterning features in semiconductor devices |
| 06/08/2006 | US20060118777 Electroric device, integrated circuit, and method of manufacturing the same |
| 06/08/2006 | US20060118776 Field effect transistor |
| 06/08/2006 | US20060118759 Etching pastes for titanium oxide surfaces |
| 06/08/2006 | US20060118597 Roller wire brake for wire bonding machine |
| 06/08/2006 | US20060118525 Apparatus and method for reducing removal forces for CMP pads |
| 06/08/2006 | US20060118524 Cerium oxide abrasive and method of polishing substrates |
| 06/08/2006 | US20060118523 Planarization with reduced dishing |
| 06/08/2006 | US20060118522 Etching composition and use thereof with feedback control of HF in BEOL clean |
| 06/08/2006 | US20060118520 Plasma etching method |
| 06/08/2006 | US20060118519 Dielectric etch method with high source and low bombardment plasma providing high etch rates |
| 06/08/2006 | US20060118518 High aspect ratio etch using modulation of RF powers of various frequencies |
| 06/08/2006 | US20060118517 Etching method |
| 06/08/2006 | US20060118515 Process For Thinning A Semiconductor Workpiece |
| 06/08/2006 | US20060118510 Process for producing light-emitting diode element emitting white light |
| 06/08/2006 | US20060118457 Film carrier tape for mounting electronic component |
| 06/08/2006 | US20060118422 Electro chemical plating addictives for improving stress and leveling effect |
| 06/08/2006 | US20060118243 Wafer support having cooling passageway for cooling a focus ring in plasma processing equipment |
| 06/08/2006 | US20060118241 Plasma processing apparatus |
| 06/08/2006 | US20060118240 Methods and apparatus for downstream dissociation of gases |
| 06/08/2006 | US20060118233 System and method for forming high resolution electronic circuits on a substrate |
| 06/08/2006 | US20060118164 Plastic film supported single crystal silicon photovoltaic cell structure and method of fabrication |
| 06/08/2006 | US20060118138 Method for the removal of airborne molecular contaminants using oxygen and/or water gas mixtures |
| 06/08/2006 | US20060118049 Vacuum-generating apparatus and thin film processing apparatus having the same |
| 06/08/2006 | US20060118048 Susceptor system |
| 06/08/2006 | US20060118046 Metal film vapor phase deposition method and vapor phase deposition apparatus |
| 06/08/2006 | US20060118043 Method for producing coated workpieces, uses and installation for the method |
| 06/08/2006 | US20060118036 Semiconductor thin film and process for production thereof |
| 06/08/2006 | US20060118034 Hydrodynamic cavitation crystallization device and process |
| 06/08/2006 | US20060117666 Polishing composition |
| 06/08/2006 | DE19941363B4 Verfahren zur Herstellung eines Mikroaktorbauteils A method for producing a Mikroaktorbauteils |
| 06/08/2006 | DE112004001442T5 Variieren der Ladungsträgerbeweglichkeit in Halb-Leiterbauelementen, um Gesamtentwurfsziele zu erreichen Varying the charge carrier mobility in Semi-conductor devices, to achieve overall design goals |
| 06/08/2006 | DE112004001441T5 Verfahren zur Herstellung Asymmetrischer Seitenwand-Abstandshalter A process for the preparation of asymmetric sidewall spacers |
| 06/08/2006 | DE112004001324T5 Filme mit niedriger Dielektrizitätskonstante und Herstellungsverfahren für diese Filme sowie elektronische Bauteile, die diese Filme verwenden Low dielectric constant films and manufacturing methods for these films, and electronic components using these films |
| 06/08/2006 | DE112004001210T5 Transportvorrichtung und Transportsteuerverfahren für eine dünne Platte Transport means and transport control method for a thin plate |
| 06/08/2006 | DE112004000745T5 Aufbau und Verfahren zum Bilden eines Feldeffekttransistors mit gekerbtem Gate Construction and method of forming a field effect transistor notched gate |
| 06/08/2006 | DE10344388B4 Verfahren zur Beseitigung der Auswirkungen von Defekten auf Wafern Method to remove the effects of defects on wafers |
| 06/08/2006 | DE10335099B4 Verfahren zum Verbessern der Dickengleichförmigkeit von Siliziumnitridschichten für mehrere Halbleiterscheiben A method for improving the thickness uniformity of silicon nitride layers for multiple semiconductor wafers |
| 06/08/2006 | DE10237283B4 Vorrichtung und Verfahren zum Reinigen von Sondennadeln einer Testsondenvorrichtung Apparatus and method for cleaning probe needles of a test probe device |
| 06/08/2006 | DE10217535B4 Sensorvorrichtung und Verfahren zur Bestimmung der Schichtdicke einer dünnen Schicht sowie Verwendung eines induktiven Näherungssensors Sensor apparatus and method for determining the thickness of a thin layer and use an inductive proximity sensor |
| 06/08/2006 | DE10213545B4 Verfahren zum Herstellen eines SOI-Feldeffekttransistors und SOI-Feldeffekttransistor A method for producing an SOI field effect transistor and SOI field effect transistor |
| 06/08/2006 | DE10211738B4 Verfahren und Anordnung zur Erzeugung einer ultrareinem Mischung aus Wasserdampf und Sauerstoff Method and apparatus for generating an ultra-pure mixture of water vapor and oxygen |
| 06/08/2006 | DE102005058139A1 Metallschichtanordnung, Halbleiterbauelement und Herstellungsverfahren Metal layer assembly, semiconductor device and manufacturing method |
| 06/08/2006 | DE102005057648A1 Verfahren für die Montage eines Halbleiterchips auf einem Substrat A method for mounting a semiconductor chip on a substrate |
| 06/08/2006 | DE102005057173A1 Teilungseinrichtung für ein rechteckförmiges Substrat Dividing means for a rectangular substrate |
| 06/08/2006 | DE102005055853A1 Transistor-Feld für Halbleiterspeicherbauelemente und Verfahren zum Herstellen eines Feldes von Transistoren mit vertikalem Kanal Transistor field for semiconductor memory devices and methods of manufacturing an array of transistors with a vertical channel |
| 06/08/2006 | DE102005053322A1 Fabricating capacitor for e.g. DRAM device, by forming storage node, forming multi-layered dielectric structure including zirconium oxide layer and aluminum oxide layer, and forming plate electrode on the multi-layered dielectric structure |
| 06/08/2006 | DE102005050330A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 06/08/2006 | DE102005041793A1 Top Drain MOSgated Einrichtung und Herstellungsprozess dafür Top MOSgated drain device and manufacturing process for |
| 06/08/2006 | DE102005038087A1 New high antireflection-coating polymers useful for forming samples for semiconductor devices and in immersion lithography |
| 06/08/2006 | DE102005036978A1 Überführungsvorrichtung eines Handlers zum Testen einer Halbleitervorrichtung Transferring device of a handler for testing a semiconductor device |
| 06/08/2006 | DE102005025667A1 Sensoranordnung mit einem umgossenen Signalausgabeabschnitt Sensor assembly having a overmolded signal output section |
| 06/08/2006 | DE102005009553B3 Trough capacitor plate is formed by preparing a semiconductor wafer, etching a trough for each storage cell, and precipitating a layer containing a dopant on the wafer |
| 06/08/2006 | DE102005006978B3 Method for joining semiconductor components with a flexible support band comprises moving an endless band parallel to the running direction of the support band between heating elements and the components |
| 06/08/2006 | DE102005001893B3 Ferroelectric RAM memory has ferroelectric memory capacitors above select transistors on a substrate with air gaps to decouple the capacitors |
| 06/08/2006 | DE102004063949A1 Verfahren zum Herstellen eines Kondensators A method for manufacturing a capacitor |
| 06/08/2006 | DE102004062592B3 Disk-shaped substrate testing system, has suction unit arranged at side of housing and spaced from mounting plate, and opening provided in suction unit, where opening has width that corresponds to distance of plate to wall of housing |
| 06/08/2006 | DE102004058765A1 Electronic nano-component, with a tunnel structure, is in an integrated multi-layer assembly on a substrate with vertical nano-passage holes for the nano-electrodes |
| 06/08/2006 | DE102004058456A1 Thinly ground wafer form correction method for manufacturing semiconductor, involves heating thinly ground wafer and films upto temperature within range between room and fusing temperatures of tapes, for compensating deformation of wafer |
| 06/08/2006 | DE102004058412A1 Mehrfachmaske und Verfahren zur Herstellung unterschiedlich dotierter Gebiete Multiple mask and method for producing differently doped areas |
| 06/08/2006 | DE102004058395A1 Stackable semiconductor chip wiring method, involves applying filling material into semiconductor chip adjacent region, and applying conductive layer on chip front side, and connecting chip contacting region with contacting surfaces |
| 06/08/2006 | DE102004058133A1 Method for monitoring chemical-mechanical polishing process |
| 06/08/2006 | DE102004058128A1 System zur Inspektion eines scheibenförmigen Objekts System for inspecting a disk-shaped object |
| 06/08/2006 | DE102004058126A1 Vorrichtung zur Inspektion der Vorder- und Rückseite eines scheibenförmigen Objekts Apparatus for inspecting the front and back of a disc-shaped object |
| 06/08/2006 | DE102004058065A1 Vertical compensation semiconductor component with buffer zone has compensation and drift sections with spaced memory regions |
| 06/08/2006 | DE102004057764A1 Technik zur Herstellung eines Substrats mit kristallinen Halbleitergebieten mit unterschiedlichen Eigenschaften, die über einem kristallinen Vollsubstrat angeordnet sind Technology for producing a substrate having crystalline semiconductor regions with different properties, which are disposed over a crystalline substrate full |
| 06/08/2006 | DE102004057762A1 Verfahren zum Ausbilden eines Feldeffekttransistors mit einem verspannten Kanalgebiet A method of forming a field effect transistor with a strained channel region |
| 06/08/2006 | DE102004057494A1 Metallisierte Folie zur flächigen Kontaktierung Metallized film for dimensional contacting |
| 06/08/2006 | DE102004057489A1 Verfahren und System zum Durchführen eines Prozesses an einem integrierten Schaltkreis Method and system for performing a process on an integrated circuit |
| 06/08/2006 | DE102004057234A1 Substrate holder, has substrate holding plate and spring catching unit engaged at counter plate for attaching holder at counter plate such that upper surface of substrate holding plate rests upon lower surface of counter plate |
| 06/08/2006 | DE102004057215A1 Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer Sondenkarte Method and apparatus for testing semiconductor wafers by means of a probe card |
| 06/08/2006 | DE102004054063B3 Process to produce a crack free connection between two components of different thermal coefficients of expansion such a power semiconductor and heat sink uses hot gas spray |
| 06/08/2006 | DE102004024649A1 Justiereinrichtung und Vorrichtung zum Justieren eines Wafers And adjusting device for adjusting a wafer |
| 06/08/2006 | DE102004023462B4 Verfahren zur Ausbildung von Leiterbahnstrukturen auf Halbleiterbauelementen A process for the formation of conductor track structures on semiconductor devices |
| 06/08/2006 | DE102004022604B4 Sublithographic contact structure is formed by producing primary and secondary contacts and providing sublithographic dimensions by chemical reaction |
| 06/08/2006 | DE10164879B4 Verdrahtungssubstrat Wiring substrate |
| 06/08/2006 | DE10156470B4 RF-ID-Etikett mit einer Halbleiteranordnung mit Transistoren auf Basis organischer Halbleiter und nichtflüchtiger Schreib-Lese-Speicherzellen RF-ID tag having a semiconductor arrangement with transistors based on organic semiconductors, and non-volatile write-read memory cells |
| 06/08/2006 | DE10147375B4 Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zur Herstellung desselben The same electronic component having a semiconductor chip and method for producing |
| 06/08/2006 | DE10061628B4 Vorrichtung und Verfahren zum Ergreifen und Transportieren von Wafern Apparatus and method for grasping and transporting wafers |
| 06/08/2006 | DE10053742C5 Vorrichtung zum Sintern, Abtragen und/oder Beschriften mittels elektromagnetischer gebündelter Strahlung sowie Verfahren zum Betrieb der Vorrichtung Device for sintering, ablating and / or inscribing by means of electromagnetic focused radiation, and methods for operating the apparatus |
| 06/08/2006 | DE10034850B4 System zum Test integrierter digitaler Halbleiterbauelemente A system for testing integrated digital semiconductor devices |
| 06/08/2006 | CA2793244A1 Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making |
| 06/08/2006 | CA2793067A1 Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making |
| 06/08/2006 | CA2589028A1 Lateral trench field-effect transistors in wide bandgap semiconductor materials, methods of making, and integrated circuits incorporating the transistors |
| 06/07/2006 | WO2006070863A1 Semiconductor chip mounting structure and method for manufacturing same |
| 06/07/2006 | EP1667503A1 Metal pattern and process for producing the same |
| 06/07/2006 | EP1667325A1 Programmable logic device with unified cell structure including signal interface bumps |
| 06/07/2006 | EP1667242A2 Structure for optical device and method of fabricating the same |
| 06/07/2006 | EP1667241A1 Semiconductor device |
| 06/07/2006 | EP1667223A1 Method for manufacturing compound material wafers |
| 06/07/2006 | EP1667222A1 Object-to-be-treated carrying system and object-to-be-treated carrying method |
| 06/07/2006 | EP1667221A1 Rfid tag and method of manufacturing the same |
| 06/07/2006 | EP1667220A1 RFID tag and method of manufacturing the same |
| 06/07/2006 | EP1667219A1 Silicon wafer reclamation method and reclaimed wafer |