Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/20/2006US20060157789 Semiconductor device with a cavity therein and a method of manufacturing the same
07/20/2006US20060157787 Thin film transistor having double-layered gate electrode and method of manufacturing the thin film transistor
07/20/2006US20060157786 Semiconductor device and manufacturing method thereof
07/20/2006US20060157782 Trench fet with self aligned source and contact
07/20/2006US20060157775 Byte-operational nonvolatile semiconductor memory device
07/20/2006US20060157772 Nonvolatile memory device
07/20/2006US20060157771 Integrated circuit memory devices and capacitors having carbon nanotube electrodes and methods of forming same
07/20/2006US20060157767 Dynamic random assess memory circuitry and integrated circuitry
07/20/2006US20060157764 Methods and apparatuses for producing a polymer memory device
07/20/2006US20060157763 FeRAM device and method for manufacturing the same
07/20/2006US20060157756 Solid-state imaging device and manufacturing method thereof
07/20/2006US20060157755 Transistor of volatile memory device with gate dielectric structure capable of trapping charges and method for fabricating the same
07/20/2006US20060157754 Semiconductor device including high-K insulating layer and method of manufacturing the same
07/20/2006US20060157753 Multi-bit nonvolatile memory devices and methods of manufacturing the same
07/20/2006US20060157752 Method of manufacturing semiconductor device having side wall spacers
07/20/2006US20060157751 Metal oxide semiconductor field effect transistor and method of fabricating the same
07/20/2006US20060157750 Semiconductor device having etch-resistant L-shaped spacer and fabrication method thereof
07/20/2006US20060157749 Fin-type semiconductor device with low contact resistance and its manufacture method
07/20/2006US20060157742 Semiconductor device with epitaxial C49-titanium silicide (TiSi2) layer and method for fabricating the same
07/20/2006US20060157741 Semiconductor device including gate insulation film that is formed of pyroceramics, and method of manufacturing the same
07/20/2006US20060157738 Semiconductor memory device and its manufacturing method
07/20/2006US20060157736 Radiation hardened bipolar junction transistor
07/20/2006US20060157733 Complex oxides for use in semiconductor devices and related methods
07/20/2006US20060157730 Nitride-based semiconductor device of reduced voltage drop
07/20/2006US20060157721 Systems and methods for producing white-light light emitting diodes
07/20/2006US20060157715 Semiconductor device and method of manufacturing the same
07/20/2006US20060157714 Nitride semiconductor light emitting device
07/20/2006US20060157713 Structures formed in diamond
07/20/2006US20060157712 Thin film transistor array panel and methods for manufacturing the same
07/20/2006US20060157709 Thin film transistor
07/20/2006US20060157702 Kerf with improved fill routine
07/20/2006US20060157700 Semiconductor wafer with test structure
07/20/2006US20060157698 Semiconductor manufacturing system, semiconductor device and method of manufacture
07/20/2006US20060157697 System and method for adjusting a manufacturing condition of an electronic device and method for manufacturing an electronic device
07/20/2006US20060157696 Photonic devices formed on substrates and their fabrication methods
07/20/2006US20060157694 Metal oxide alloy layer, method of forming the metal oxide alloy layer, and methods of manufacturing a gate structure and a capacitor including the metal oxide alloy layer
07/20/2006US20060157692 Organic transistor and manufacturing method thereof
07/20/2006US20060157689 Forming a carbon layer between phase change layers of a phase change memory
07/20/2006US20060157688 Methods of forming semiconductor constructions and integrated circuits
07/20/2006US20060157677 Compositions and methods for forming a semiconducting and/or silicon-containing film, and structures formed therefrom
07/20/2006US20060157671 Slurry for use in metal-chemical mechanical polishing and preparation method thereof
07/20/2006US20060157532 Apparatus of clamping semiconductor devices using sliding finger supports
07/20/2006US20060157472 Metal heater
07/20/2006US20060157450 Method for improving hss cmp performance
07/20/2006US20060157449 Plasma processing apparatus and a plasma processing method
07/20/2006US20060157447 Method and apparatus for forming surface, magnetic head and method of manufacturing the same
07/20/2006US20060157446 End point detection method for plasma etching of semiconductor wafers with low exposed area
07/20/2006US20060157341 Thin piece specimen preparing method and composite charged particle beam device
07/20/2006US20060157340 Transfer chamber for vacuum processing system
07/20/2006US20060157274 Wafer-level hermetic micro-device packages
07/20/2006US20060157199 Substrate processing system for performing exposure process in gas atmosphere
07/20/2006US20060157198 Member for plasma processing apparatus and plasma processing apparatus
07/20/2006US20060157197 Substrate processing apparatus
07/20/2006US20060157191 Manufacturing method of laser processed parts and adhesive sheet for laser processing
07/20/2006US20060157079 Method for cleaning substrate surface
07/20/2006US20060156984 Plasma processing apparatus and plasma processing method
07/20/2006US20060156982 Apparatus for fabricating semiconductor device
07/20/2006US20060156981 Wafer support pin assembly
07/20/2006US20060156980 Apparatus including 4-way valve for fabricating semiconductor device, method of controlling valve, and method of fabricating semiconductor device using the apparatus
07/20/2006US20060156979 Substrate processing apparatus using a batch processing chamber
07/20/2006US20060156978 Modular fabrication systems and methods
07/20/2006US20060156836 Apparatus and method for balancing and for providing a compliant range to a test head
07/20/2006US20060156812 Rotation sensing apparatus and method for manufacturing the same
07/20/2006US20060156528 comprising two pieces of aluminum nitride sintered body plates joined together without using adhesive, and a metal layer formed on a portion of the junction interface; plate heater or an electrostatic chuck for treating a semiconductor wafer
07/20/2006US20060156521 Capacitor and method for making the same
07/20/2006DE19939597B4 Verfahren zur Herstellung einer mikroelektronischen Struktur mit verbesserter Gatedielektrikahomogenität A method for fabricating a microelectronic structure with improved Gatedielektrikahomogenität
07/20/2006DE19709246B4 Phasenverschiebungsmaske und Verfahren zum Herstellen derselben Phase shift mask and method for manufacturing the same
07/20/2006DE112004001788T5 Ein Verfahren zum Herstellen eines ferroelektrischen Kondensators und ein ferroelektrisches Kondensatorbauelement A method of manufacturing a ferroelectric capacitor and a ferroelectric capacitor device
07/20/2006DE112004001601T5 Silizidierungsabstandshalter in der integrierten Schaltungstechnologie Silizidierungsabstandshalter in the integrated circuit technology
07/20/2006DE112004001530T5 Versiegelte Poren in Damascene-Strukturen mit Low-k-Material Sealed pores in damascene structures with low-k material
07/20/2006DE112004001438T5 Herstellungsverfahren für einen FeRAM-Kondensator und ein durch das Verfahren ausgebildeter FeRAM-Kondensator Manufacturing method of a FeRAM capacitor and a trained by the method FeRAM capacitor
07/20/2006DE10348006B4 Feldeffekttransistor, insbesondere vertikaler Feldeffekttransistor, Speicherzelle und Herstellungsverfahren Field effect transistor, in particular a vertical field effect transistor memory cell, and manufacturing method
07/20/2006DE10330006B4 Vorrichtung zur Inspektion eines Wafers Apparatus for inspecting a wafer
07/20/2006DE10254160B4 Transistorarray und damit hergestellte Halbleiterspeicheranordnung Transistor array and thus produced semiconductor memory device
07/20/2006DE10227854B4 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
07/20/2006DE102006001000A1 Halbleiterchippackungsvorrichtung und zugehöriges Endbehandlungsverfahren Semiconductor chip package device and associated finishing processes
07/20/2006DE102006000614A1 Verfahren zur Steuerung von Grenzflächeneigenschaften für Kondensatoren unter Verwendung einer Metall-Flash-Schicht A method for the control of interfacial properties for capacitors using a metal flash layer
07/20/2006DE102005061594A1 Vorrichtung zum Herstellen einer Halbleitereinrichtung An apparatus for manufacturing a semiconductor device
07/20/2006DE102005019553A1 Füllmassenstruktur und Verfahren für WL-CSP Füllmassenstruktur and procedures for WL-CSP
07/20/2006DE102005007743A1 Druckfähiges Medium zur Ätzung von Siliziumdioxid- und Siliziumnitridschichten Printable medium for etching silicon dioxide and silicon nitride layers
07/20/2006DE102005001651A1 Etching system, especially plasma-etching system, has process chamber which on internal wall side is lined with at least one annular chamber component of ceramic material
07/20/2006DE102005001449B3 Verfahren zum Erzeugen eines vorgegebenen Innendrucks in einem Hohlraum eines Halbleiterbauelements A method of creating a predefined internal pressure within a cavity of a semiconductor device
07/20/2006DE102005000891A1 Structured wafer for development and manufacturing of micro-fluid structures has one of first surfaces which is not hydrophobic and which adjoins one of second surface which is not hydrophobic
07/20/2006DE102005000688A1 Method for determining surface of recesses arranged in carrier substrate involves baking carrier substrate in chamber and evacuating chamber, in order to produce and make around an essentially degassed total surface of carrier substrate
07/20/2006DE102004063560A1 Capacitive structure for semiconductor technology in e.g. consumer electronics, industries and automobile electronics has trench which adjoins trough zone, which forms second electrode of capacitive structure, formed in semiconductor body
07/20/2006DE102004063311A1 Gyroscopic table system for isolation of mechanical oscillations in micro and nano-manufacturing has cuboid shaped housing, which interrupts the transmission of destructive oscillations
07/20/2006DE102004060346A1 Herstellungsverfahren für eine Halbleiterstruktur Manufacturing method of a semiconductor structure
07/20/2006DE102004055616A1 Verfahren zum Verbinden einer Modulbrücke mit einem Substrat und mehrschichtiger Transponder Method for connecting a bridge module comprising a substrate and multilayered transponder
07/20/2006DE102004052910B4 Verfahren zur Herstellung von Charge-Trapping-Speicherzellen A process for the preparation of charge-trapping memory cells
07/20/2006DE102004052647A1 Methode zur Verbesserung der thermischen Eigenschaften von Halbleiter-Speicherzellen Method for improving the thermal characteristics of semiconductor memory cells
07/20/2006DE102004042169A1 Technik zur Erhöhung des Füllvermögens in einem elektrochemischen Abscheideprozess durch Verrundung der Kanten und Gräben Technique for increasing the filling capacity in an electrochemical deposition process by rounding of the edges and grooves
07/20/2006DE10065525B4 Verfahren zur Herstellung einer Halbleiteranordnung mit einem PN-Übergang A method of manufacturing a semiconductor device having a PN junction
07/20/2006CA2593581A1 System and method for creating a surface pattern
07/20/2006CA2567156A1 Biofabrication of transistors including field effect transistors
07/19/2006EP1681727A1 Semiconductor light-emitting device and method for manufacturing same
07/19/2006EP1681720A2 Multichip module containing an integrated passive device
07/19/2006EP1681717A1 Electronic device and process for manufacturing same
07/19/2006EP1681716A1 Jig for heat treating semiconductor substrate and method for heat treating semiconductor substrate
07/19/2006EP1681715A1 Plasma processing apparatus
07/19/2006EP1681714A1 Vertical heat treatment device