Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/27/2006US20060166453 Method and apparatus for forming patterned photosensitive material layer
07/27/2006US20060166452 Non-volatile nanocrystal memory and method therefor
07/27/2006US20060166451 Process for manufacturing a multilayer structure made from semiconducting materials
07/27/2006US20060166450 Method for manufacturing substrate
07/27/2006US20060166449 Nonvolatile memory device for storing multi-bit data
07/27/2006US20060166448 Apparatus for depositing seed layers
07/27/2006US20060166447 Method for making a semiconductor device having a high-k gate dielectric
07/27/2006US20060166446 Manufacturing method of semiconductor device, semiconductor manufacturing apparatus, plasma nitridation method, computer recording medium, and program
07/27/2006US20060166445 Methods of fabricating multiple sets of field effect transistors
07/27/2006US20060166444 MEMS scanning mirror with trenched surface and i-beam like cross-section for reducing inertia and deformation
07/27/2006US20060166443 Multi-state NROM device
07/27/2006US20060166442 Method for manufacturing semiconductor device
07/27/2006US20060166441 Nonvolatile memory device with a non-planar gate-insulating layer and method of fabricating the same
07/27/2006US20060166440 Semiconductor nonvolatile memory device, and manufacturing method thereof
07/27/2006US20060166439 Method for manufacturing electronic non-volatile memory devices integrated in a semiconductor substrate
07/27/2006US20060166438 Method of making a floating gate non-volatile MOS semiconductor memory device with improved capacitive coupling and device thus obtained
07/27/2006US20060166437 Isolation regions for semiconductor devices and their formation
07/27/2006US20060166436 Forming integrated circuit devices
07/27/2006US20060166435 Synthesis of GE nanocrystal memory cell and using a block layer to control oxidation kinetics
07/27/2006US20060166434 Computer implemented method for designing a semiconductor integrated circuit and a semiconductor integrated circuit
07/27/2006US20060166433 Recessed collar etch for buried strap window formation without poly2
07/27/2006US20060166432 Process for oxide cap formation in semiconductor manufacturing
07/27/2006US20060166431 Methods to form electronic devices and methods to form a material over a semiconductive substrate
07/27/2006US20060166430 Conductive memory stack with non-uniform width
07/27/2006US20060166429 Vertical replacement-gate junction field-effect transistor
07/27/2006US20060166428 Semiconductor device and method of fabricating the same
07/27/2006US20060166427 Method of manufacturing semiconductor device
07/27/2006US20060166426 Methodology for placement based on circuit function and latchup sensitivity
07/27/2006US20060166425 Novel gate dielectric and metal gate integration
07/27/2006US20060166424 Metal gate transistor CMOS process and method for making
07/27/2006US20060166423 Removal spacer formation with carbon film
07/27/2006US20060166422 Sige nickel barrier structure employed in a cmos device to prevent excess diffusion of nickel used in the silicide material
07/27/2006US20060166421 Semiconductor device fabrication method
07/27/2006US20060166420 Method of manufacturing a semiconductor device
07/27/2006US20060166419 Method for manufacturing semiconductor device
07/27/2006US20060166418 Method of fabricating semiconductor device
07/27/2006US20060166417 Transistor having high mobility channel and methods
07/27/2006US20060166416 Addition of ballast hydrocarbon gas to doped polysilicon etch masked by resist
07/27/2006US20060166415 Two-transistor tri-state inverter
07/27/2006US20060166414 Selective deposition
07/27/2006US20060166413 Thin film transistor device and method of manufacturing the same
07/27/2006US20060166412 Method for manufacturing semiconductor elemental device
07/27/2006US20060166411 Semiconductor device and manufacturing method thereof
07/27/2006US20060166410 Manufacturing method of semiconductor device
07/27/2006US20060166409 Method of preparation of a precursor oligocene
07/27/2006US20060166408 Method for encapsulating an electronic component using a foil layer
07/27/2006US20060166407 Hermetic packaging
07/27/2006US20060166406 Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line
07/27/2006US20060166405 Manufacturing method of semiconductor device
07/27/2006US20060166404 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
07/27/2006US20060166403 Fabrication of advanced silicon-based MEMS devices
07/27/2006US20060166402 Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures
07/27/2006US20060166401 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor
07/27/2006US20060166400 Electronic assembly with integrated IO and power contacts
07/27/2006US20060166399 Integrated circuit die connection methods and apparatus
07/27/2006US20060166398 Off-grid decoupling of ball grid array (BGA) devices and method
07/27/2006US20060166397 Thermal enhanced package for block mold assembly
07/27/2006US20060166396 Organic semiconductor structure, process for producing the same, and organic semiconductor device
07/27/2006US20060166395 High-density inter-die interconnect structure
07/27/2006US20060166394 Solar cell structure with solar cells having reverse-bias protection using an implanted current shunt
07/27/2006US20060166393 Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel
07/27/2006US20060166392 Semiconductor light emitting device and manufacturing method thereof
07/27/2006US20060166391 Method of production of semiconductor light emission device and method of production of light emission apparatus
07/27/2006US20060166390 Optoelectronic substrate and methods of making same
07/27/2006US20060166389 Method for producing solid-state imaging device, solid-state imaging device, and camera
07/27/2006US20060166388 LED package structure and mass production method of making the same
07/27/2006US20060166387 Optical transmission and/or receiving device
07/27/2006US20060166386 Optical semiconductor device and its manufacturing method
07/27/2006US20060166385 Method for measuring peak carrier concentration in ultra-shallow junctions
07/27/2006US20060166384 Method for manufacturing industrial products and combination of masks for manufacturing the same
07/27/2006US20060166383 Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the same
07/27/2006US20060166382 Method and apparatus for detecting backside particles during wafer processing
07/27/2006US20060166381 Mold cavity identification markings for IC packages
07/27/2006US20060166380 Method of integration testing for packaged electronic components
07/27/2006US20060166379 Method for manufacturing ferroelectric capacitor
07/27/2006US20060166378 Method of producing semiconductor device
07/27/2006US20060166218 Protective coating for array material deposition
07/27/2006US20060166145 Method providing an improved bi-layer photoresist pattern
07/27/2006US20060166142 Illuminant distribution evaluation method, optical member manufacturing method, illumination optical device, exposure apparatus, and exposure method
07/27/2006US20060166139 applying mixtures of curing agents, light absorbers, acid generators, solvents and polydimethylsiloxane on the surfaces of a layer to be etched, then baking to form films, applying photosensitive materials, exposing to a light source and developing to form patterns
07/27/2006US20060166131 sensitizer and an alkali-soluble novolak containing hydroxyalkyl ether structural units that can be substituted with 1,2-naphthoquinonediazidesulfonyl groups; excellent resolution and good suppression of crack generation during plating
07/27/2006US20060166129 copolymer of ethylenically unsaturated monomer having one or more fluorine group and a polycyclic unsaturated monomer having one or more ester groups; coating, imagewise exposing the photoresist layer, developing
07/27/2006US20060166112 Photomask for nearfield exposure, method for making pattern using the photomask, and apparatus for making pattern including the photomask
07/27/2006US20060166111 Mask, mask forming method, pattern forming method, and wiring pattern forming method
07/27/2006US20060166012 Chemical planarization performance for copper/low-k interconnect structures
07/27/2006US20060165957 Method for producing at least one small opening in a layer on a substrate and components produced according ot said method
07/27/2006US20060165911 Cu(In,Ga)(S,Se)2;
07/27/2006US20060165909 Producing solderable and bondable copper printed circuit boards by a two step displacement plating reaction: 1) depositing Ag on the substrate and 2) plating Ag on said substrate; Ag is deposited in the 1st step at a rate that is at most half the rate of plating of Ag in the 2nd step
07/27/2006US20060165894 Method for forming a ruthenium metal layer and a structure comprising the ruthenium metal layer
07/27/2006US20060165889 Depositing a silicon nitride film with a different thickness for each region of the film from ammonia and silane using a single chamber-type apparatus; first and second nitride films deposited together have a greater thickness at the upper region as compared to the side regions and the lower region
07/27/2006US20060165875 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
07/27/2006US20060165873 Plasma detection and associated systems and methods for controlling microfeature workpiece deposition processes
07/27/2006US20060165345 System and method for integrating optical layers in a PCB for inter-board communications
07/27/2006US20060164886 Nonvolatile semiconductor memory device having protection function for each memory block
07/27/2006US20060164879 Non-volatile ferromagnetic memory having sensor circuitry shared with its state change circuitry
07/27/2006US20060164878 Data reading method, data writing method, and semiconductor memory device
07/27/2006US20060164876 Multi-transistor memory cells
07/27/2006US20060164786 Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and electrode
07/27/2006US20060164785 Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means
07/27/2006US20060164655 Method for determining wavefront aberrations