Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/13/2006US20060151839 Gate structure of semiconductor device and method for forming the same
07/13/2006US20060151835 Semiconductor device and method of fabricating same
07/13/2006US20060151834 High mobility plane finfet with equal drive strength
07/13/2006US20060151833 Transistor structure having stressed regions of opposite types underlying channel and source/drain regions
07/13/2006US20060151832 Semiconductor transistor having a stressed channel
07/13/2006US20060151830 Electrical devices with multi-walled recesses
07/13/2006US20060151829 Semiconductor device and a method for manufacturing therefor
07/13/2006US20060151825 Gate structure in flash memory cell and method of forming the same, and method of forming dielectric film
07/13/2006US20060151824 Flash memory devices having self aligned shallow trench isolation structures
07/13/2006US20060151823 High dielectric constant materials
07/13/2006US20060151820 Large-area nanoenabled macroelectronic substrates and uses therefor
07/13/2006US20060151819 Self-aligned V0-contact for cell size reduction
07/13/2006US20060151818 Solid state imaging device and production method therefor
07/13/2006US20060151817 CMOS image sensor having test pattern therein and method for manufacturing the same
07/13/2006US20060151816 Semiconductor device
07/13/2006US20060151811 Floating gate memory device and method of manufacturing the same
07/13/2006US20060151808 MOSFET device with localized stressor
07/13/2006US20060151806 Semiconductor device and power converter, driving inverter, general-purpose inverter and high-power high-frequency communication device using same
07/13/2006US20060151802 Gallium nitride compound semiconductor device
07/13/2006US20060151801 Light emitting diode with thermo-electric cooler
07/13/2006US20060151797 Wafer structure and epitaxial growth method for growing the same
07/13/2006US20060151796 Photo-detection device and manufacturing method thereof
07/13/2006US20060151791 Semiconductor device and method of fabricating the same
07/13/2006US20060151789 Light Emitting Device and Method of Manufacturing the Same
07/13/2006US20060151788 Tft substrate for liquid crystal display apparatus and method of manufacturing the same
07/13/2006US20060151787 LOW CONCENTRATION SiGe BUFFER DURING STRAINED Si GROWTH OF SSGOI MATERIAL FOR DOPANT DIFFUSION CONTROL AND DEFECT REDUCTION
07/13/2006US20060151786 Ion doping system, ion doping method and semiconductor device
07/13/2006US20060151783 Semiconductor integrated circuit device
07/13/2006US20060151780 Hybrid silicon-molecular memory cell with high storage density
07/13/2006US20060151774 Field emitter array and method for manufacturing the same
07/13/2006US20060151710 Exposure device, exposure method, and semiconductor device manufacturing method
07/13/2006US20060151699 Method and an apparatus of an inspection system using an electron beam
07/13/2006US20060151620 Semiconductor devices and manufacturing method therefor and electric commerce method and transponder reader
07/13/2006US20060151606 Wireless substrate-like sensor
07/13/2006US20060151435 Surface processing method
07/13/2006US20060151432 Surface treatment of concrete
07/13/2006US20060151430 Method and system for processing multi-layer films
07/13/2006US20060151428 Method for roughening a surface of a body, and optoelectronic component
07/13/2006US20060151404 Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components
07/13/2006US20060151336 Pad for electrochemical processing
07/13/2006US20060151331 Anionic surfactant, dodecyl sodium sulfate, added to electrolysis bath solution to promote the incorporation of gallium in the CIGS (copper-indium-gallium selenium) films; electrodeposition ofsulfates of copper, indium and gallium and selenous acid onto calcium electrode; smooth surface; solar cells
07/13/2006US20060151328 Method of electroplating a workpiece having high-aspect ratio holes
07/13/2006US20060151317 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
07/13/2006US20060151297 Clean room guided conveyor
07/13/2006US20060151117 Semiconductor producing device and semiconductor producing method
07/13/2006US20060151114 Plasma processing system and baffle assembly for use in plasma processing system
07/13/2006US20060151113 Apparatus for controlling flow rate of gases used in semiconductor deivce by differential pressure
07/13/2006US20060151112 Substrate treating system, substrate treating device, program, and recording medium
07/13/2006US20060151111 In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
07/13/2006US20060151110 Method and apparatus for controlled slurry distribution
07/13/2006US20060151025 Active layer for solar cell and the manufacturing method making the same
07/13/2006US20060151014 Device and method for wet treating disc-like substrates
07/13/2006US20060151008 Cleaning method, method for removing foreign particle, cleaning apparatus, and cleaning liquid
07/13/2006US20060151003 Brush for cleaning wafer
07/13/2006US20060150914 Plasma process device
07/13/2006US20060150905 Substrate processing apparatus
07/13/2006US20060150904 Substrate-processing apparatus and method of producing a semiconductor device
07/13/2006US20060150895 Apparatus for fabricating a III-V nitride film and a method for fabricating the same
07/13/2006US20060150892 Processes Involving the Use of Antisolvent Crystallisation
07/13/2006US20060150891 ß-Ga2o3 single crystal growing method, thin-film single crystal growing method, Ga2o3 light-emitting device, and its manufacturing method
07/13/2006US20060150860 Alkali-resistant cocoon-shaped colloidal silica particle and process for producing the same
07/13/2006US20060150435 Methods and systems for processing a substrate using a dynamic liquid meniscus
07/13/2006DE4327133B4 Verfahren zum Aufbringen eines optischen Koppelmediums A method of applying an optical coupling medium
07/13/2006DE4220497B4 Halbleiterspeicherbauelement und Verfahren zu dessen Herstellung The semiconductor memory device and method for its production
07/13/2006DE202006005284U1 Solar cell storage container of firm shape with rectangular or square bottom and side walls, with slot-shaped aperture on two side walls over specified height
07/13/2006DE19929618B4 Verfahren zur Herstellung einer nichtflüchtigen Halbleiter-Speicherzelle mit separatem Tunnelfenster A method of manufacturing a nonvolatile semiconductor memory cell with a separate tunnel window
07/13/2006DE19920593B4 Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls A chip carrier for a chip module and method of manufacturing the chip module
07/13/2006DE19838847B4 Verfahren zum Vermindern der Intensität von während des Prozesses der Photolithographie auftretenden reflektierten Strahlen A method of reducing the intensity of occurring during the process of photolithography reflected rays
07/13/2006DE19746408B4 Verfahren zum Anbringen eines Bauelements an einem plattenförmigen Träger A method for attaching a component to a plate-shaped carrier
07/13/2006DE112004001678T5 Verfahren und Vorrichtung für ein Paket mit zwei Substraten Method and apparatus for a package with two substrates
07/13/2006DE10350460B4 Verfahren zur Herstellung von mikromechanische und/ oder mikroelektronische Strukturen aufweisenden Halbleiterbauelementen, die durch das feste Verbinden von mindestens zwei Halbleiterscheiben entstehen, und entsprechende Anordnung A process for preparing micromechanical and / or microelectronic structures having semiconductor devices caused by the solid connecting at least two semiconductor wafers, and corresponding arrangement
07/13/2006DE10347543B4 Ablösevorrichtung zum Ablösen elektronischer Bauteile von einem Träger Release device for releasing electronic components of a carrier
07/13/2006DE10340129B4 Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben The same electronic module with plug contacts and methods for preparing
07/13/2006DE10339702B4 Verfahren zur gemeinsamen Herstellung von unterschiedlichen Gatebereichen für eine Transistorstruktur A process for the co-production of various gate regions for a transistor structure
07/13/2006DE10302527B4 Teilspeisespannungserzeugungsschaltung und Halbleiterspeicherbauelement Part supply voltage generation circuit and semiconductor memory device
07/13/2006DE10214208B4 Gußform für ein elektronisches Bauelement und elektronisches Bauelement Mold for an electronic component and electronic component
07/13/2006DE10202139B4 Speicherzelle mit einem dünnen Isolationskragen und Speicherbaustein Memory cell having a thin insulation collar and memory module
07/13/2006DE102005062937A1 Halbleitereinrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
07/13/2006DE102005061199A1 Speicherbaustein und Verfahren zu seiner Herstellung Memory device and method for its preparation
07/13/2006DE102005059547A1 CMP Polierkissen, das Rillen angeordnet aufweist, um eine Verwendung eines Poliermediums zu verbessern CMP polishing pad having arranged the grooves in order to improve a use of a polishing medium
07/13/2006DE102005059455A1 Semiconductor appliance with active layer formed by biased silicon layer, in which is formed insulating layer under source/drain zones for improvement of operational characteristics of semiconductor appliance
07/13/2006DE102005058680A1 Thin film transistor (TFT) array substrate for liquid crystal display (LCD) device, has gate pad with lower electrode that extends from gate line, while data pad has bottom electrode that separates from data line
07/13/2006DE102005058272A1 Mehrstufige Verfahren zum chemisch-mechanischen Polieren von Siliziumdioxid und Siliziumnitrid Multi-stage method for chemical mechanical polishing of silicon dioxide and silicon nitride,
07/13/2006DE102005058271A1 Selektive Aufschlämmung zum chemisch-mechanischen Polieren Selective slurry for chemical mechanical polishing,
07/13/2006DE102005058259A1 Verfahren zur thermischen Freisetzung eines haftenden Körpers und Vorrichung zur thermischen Freisetzung des haftenden Körpers Process for the thermal release of an adhesive body and Vorrichung for thermal release of the liable body
07/13/2006DE102005057256A1 Verfahren zum Herstellen eines Moduls mit einer integrierten Schaltung auf einem Substrat und ein dadurch hergestelltes Modul A method of manufacturing a module having an integrated circuit on a substrate and a module produced thereby
07/13/2006DE102005056916A1 Verfahren zum Gestalten einer Überlagerungs-Markierung A method of designing an overlay mark
07/13/2006DE102005054414A1 Dram auf Silizium-auf-Isolator DRAM on a silicon-on-insulator
07/13/2006DE102005028630A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
07/13/2006DE102005026565A1 Mulden-Gate und Verfahren zur Herstellung eines Halbleiterbauelements mit demselben Wells gate and method of manufacturing a semiconductor device using the same
07/13/2006DE102005025933B3 Doping mixture for preparing and doping semiconductor surfaces, comprises a p- or n-dopant, for doping the semiconductor surfaces, water and mixture of two or more surfactants, where one of the surfactant is a non-ionic surfactant
07/13/2006DE102005024798A1 Halbleiterbauelement mit dielektrischer Multigateschicht und Verfahren zur Herstellung desselben Of the same semiconductor device with dielectric multi-gate layer and processes for preparing
07/13/2006DE102005021653A1 Surface mounted semiconductor component with plastics housing and solder balls as outer contacts, as used for ball grid array (BGA) and large ball grid array (LBGA)
07/13/2006DE102005020969A1 Füllplattierungsstruktur eines inneren Vialochs und Herstellungsverfahren hierfür Füllplattierungsstruktur an inner via hole and manufacturing method thereof
07/13/2006DE102004063851A1 Verfahren zur Herstellung einer elektronischen Schaltung A process for producing an electronic circuit
07/13/2006DE102004063544A1 Strukturieter Trägerstreifen Strukturieter carrier strip
07/13/2006DE102004063264A1 Verfahren zum Ausbilden elektrischer Verbindungen in einer Halbleiterstruktur A method of forming electrical interconnections in a semiconductor structure
07/13/2006DE102004063180A1 Verfahren zum Herstellen von Halbleiterchips aus einem Wafer A method for fabricating semiconductor chips from a wafer
07/13/2006DE102004062288B3 Verfahren zur Herstellung von Charge-trapping-Speicherbauelementen A process for the preparation of charge-trapping memory devices
07/13/2006DE102004062212A1 Elektronische Vorrichtung, Chipkontaktierungsverfahren und Kontaktierungsvorrichtung An electronic device Chipkontaktierungsverfahren and contacting