Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/25/2006US7081376 Kinetically sprayed aluminum metal matrix composites for thermal management
07/25/2006US7081374 Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it
07/25/2006US7081373 CSP chip stack with flex circuit
07/25/2006US7081372 Aluminum cap with electroless nickel/immersion gold
07/25/2006US7081371 Fabrication of stable, wide-bandgap thin films of Mg, Zn and O
07/25/2006US7081370 Silicon substrate apparatus and method of manufacturing the silicon substrate apparatus
07/25/2006US7081369 Forming a semiconductor device feature using acquired parameters
07/25/2006US7081368 Method for detecting gas with the use of photocurrent amplification and the like and gas sensor
07/25/2006US7081367 Manufacturing method of thin-film magnetic head with magnetoresistive effect element and manufacturing method of head gimbal assembly with the thin-film magnetic head
07/25/2006US7081325 Photoresist polymer and photoresist composition including the same
07/25/2006US7081306 Compressive alpha-tantalum thin film stack
07/25/2006US7081296 Method for growing thin films
07/25/2006US7081271 Cyclical deposition of refractory metal silicon nitride
07/25/2006US7081269 Filling particles in a pattern provided to a polymer mold, to prepare an embossed stamp; coating a polymer impregnation-prevention layer on the pattern; placing the embossed stamp on a polymer film; allowing to stand at temperatures higher than a glass transfer temperature of the polymer film; removing
07/25/2006US7081210 Organic semiconductor composition
07/25/2006US7081182 Method and apparatus for automatically measuring the concentration of TOC in a fluid used in a semiconductor manufacturing process
07/25/2006US7081166 Planetary system workpiece support and method for surface treatment of workpieces
07/25/2006US7081148 Sheet resistance uniformity
07/25/2006US7081045 Apparatus for polishing a semiconductor wafer
07/25/2006US7081044 Polishing apparatus and polishing pad
07/25/2006US7081038 Polishing method and apparatus
07/25/2006US7081005 Electric-connection testing device
07/25/2006US7080988 Flexible contact-connection device
07/25/2006US7080771 Method for checking the quality of a wedge bond
07/25/2006US7080675 Method and apparatus for joining adhesive tape to back face of semiconductor wafer
07/25/2006US7080652 Automated semiconductor processing systems
07/25/2006US7080651 High pressure processing apparatus and method
07/25/2006US7080596 Micro-casted silicon carbide nano-imprinting stamp
07/25/2006US7080440 Very low moisture o-ring and method for preparing the same
07/24/2006WO2006077674A1 Junction field-effect transistor
07/20/2006WO2006076614A1 A process for manufacturing application specific printable circuits (aspc's) and other custom electronic devices
07/20/2006WO2006076555A1 Heater for wafer processing and methods of operating and manufacturing the same
07/20/2006WO2006076438A1 Methods of inserting or removing a species from a semiconductor substrate
07/20/2006WO2006076392A2 Polishing slurries and methods for chemical mechanical polishing
07/20/2006WO2006076377A2 Wiring patterns formed by selective metal plating
07/20/2006WO2006076373A1 Self-forming metal silicide gate for cmos devices
07/20/2006WO2006076354A2 Diamond medical devices
07/20/2006WO2006076298A2 Trench schottky barrier diode with differential oxide thickness
07/20/2006WO2006076272A2 Topographically indexed support substrates
07/20/2006WO2006076256A1 Method of making a vertical light emitting diode
07/20/2006WO2006076253A2 Plasma processing system and baffle assembly for use in plasma processing system
07/20/2006WO2006076210A2 Systems and methods for producing white-light light emitting diodes
07/20/2006WO2006076209A2 System and methods for producing light emitting diode array
07/20/2006WO2006076208A2 Systems and methods for removing operating heat from a light emitting diode
07/20/2006WO2006076207A2 Light emitting diodes (leds) with improved light extraction by roughening
07/20/2006WO2006076085A2 Low-pressure removal of photoresist and etch residue
07/20/2006WO2006076083A2 Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
07/20/2006WO2006076082A2 Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
07/20/2006WO2006076044A2 Nanostructure-based transistor
07/20/2006WO2006076027A2 Biofabrication of transistors including field effect transistors
07/20/2006WO2006075855A1 A bga-type test and burn-in socket for integrated circuits(ics)
07/20/2006WO2006075830A1 Method of processing an object having a passivation layer
07/20/2006WO2006075731A1 Solid electrolytic switching element, method for manufacturing such solid electrolytic switching element and integrated circuit
07/20/2006WO2006075720A1 Exposure method and apparatus, and electronic device manufacturing method
07/20/2006WO2006075709A1 Vaporizer and processor
07/20/2006WO2006075687A1 Pattern defect inspection method and semiconductor device manufacturing method
07/20/2006WO2006075674A1 Image exposing apparatus and microlens array unit
07/20/2006WO2006075625A1 Negative resist composition and method of forming resist pattern
07/20/2006WO2006075578A1 Film forming material and method of film forming
07/20/2006WO2006075575A1 Stage apparatus and exposure apparatus
07/20/2006WO2006075570A1 Plasma generating apparatus
07/20/2006WO2006075569A1 Semiconductor thin film manufacturing method and semiconductor thin film manufacturing apparatus
07/20/2006WO2006075568A1 Production method and production device for polycrystalline semiconductor thin film
07/20/2006WO2006075535A1 Laser plasma euv light source, target member, production method for target member, target supplying method, and euv exposure system
07/20/2006WO2006075527A1 METHOD FOR ABRASING GaN SUBSTRATE
07/20/2006WO2006075525A1 Light exposure apparatus and manufacturing method of semiconductor device using the same
07/20/2006WO2006075444A1 Semiconductor device manufacturing method and semiconductor device
07/20/2006WO2006075436A1 Contact structure for inspection, and probe card
07/20/2006WO2006075425A1 Semiconductor device
07/20/2006WO2006075361A1 Method for manufacturing semiconductor integrated circuit device
07/20/2006WO2006075197A1 Flip-chip semiconductor packages and methods for their production
07/20/2006WO2006074933A1 Method of producing a substrate for an optoelectronic application
07/20/2006WO2006074865A1 Method and device for cleaning discoid substrates that comprise an inner hole
07/20/2006WO2006074579A1 Oil immersion exposure method in chip photolithographic process
07/20/2006WO2006074543A1 Thin array plastic package without die attach pad and process for fabricating the same
07/20/2006WO2006060574A3 Method for forming self-aligned dual fully silicided gates in cmos devices
07/20/2006WO2006060208A3 Double hbt structure
07/20/2006WO2006039436A3 Pad design for electrochemical mechanical polishing
07/20/2006WO2006010091A3 Copper metallization analysis system and method using x-ray fluorescence
07/20/2006WO2005114708A3 Carbon nanotube-silicon composite structures and methods for making same
07/20/2006WO2005104212A3 Wiring structure for integrated circuit with reduced intralevel capacitance
07/20/2006WO2005096351A3 Fabrication and use of superlattice
07/20/2006WO2005091345A8 Carbon nanotube-containing metal thin film
07/20/2006WO2005072489A3 Spin-on protective coatings for wet-etch processing of microelectronic substrates
07/20/2006WO2005072377A3 Non-volatile dram and a method of making thereof
07/20/2006WO2005065424A3 Micro pin grid array with wiping action
07/20/2006US20060161385 Testing system, a computer implemented testing method and a method for manufacturing electronic devices
07/20/2006US20060161299 Method and apparatus to correct static deflection in a handling robot
07/20/2006US20060161288 Method for manufacturing semiconductor device
07/20/2006US20060161286 Substrate transfer controlling apparatus and substrate transferring method
07/20/2006US20060161271 Two-wire field-mounted process device
07/20/2006US20060161254 Method and apparatus for personalization of semiconductor
07/20/2006US20060160520 Radio frequency switch
07/20/2006US20060160475 Chemical mechanical polishing compositions for metal and associated materials and method of using same
07/20/2006US20060160376 Interface engineering to improve adhesion between low k stacks
07/20/2006US20060160375 Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry, methods of forming trench isolation in the fabrication of integrated circuitry, Method of depositing silicon dioxide-comprising layers in the fabrication of integrated circuitry, and methods of forming bit line over capacitor arrays of memory cells
07/20/2006US20060160374 Formation of low K material utilizing process having readily cleaned by-products
07/20/2006US20060160373 Processes for planarizing substrates and encapsulating printable electronic features
07/20/2006US20060160372 Method and apparatus for fabricating low-k dielectrics, conducting films, and strain-controlling conformable silica-carbon materials
07/20/2006US20060160371 Inhibiting growth under high dielectric constant films