Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/27/2006WO2006077705A1 Positive resist composition and method for forming resist pattern
07/27/2006WO2006077684A1 Silylphenylene polymer composition for the formation of interlayers and process for the formation of patterns by using the same
07/27/2006WO2006077650A1 Semiconductor device and method for manufacturing the same
07/27/2006WO2006077630A1 Semiconductor device manufacturing method
07/27/2006WO2006077502A1 Bipolar transistor and method of fabricating the same
07/27/2006WO2006077390A1 Improved method and apparatus for monitoring a microstructure etching process
07/27/2006WO2006077210A1 Semiconductor sensor component comprising protected feeders, and method for the production thereof
07/27/2006WO2006076991A2 Method for producing a field-effect transistor, field-effect transistor and integrated circuit arrangement
07/27/2006WO2006076987A1 Method for the self-limited deposition of one or more monolayers and corresponding suitable starting material
07/27/2006WO2006076857A1 Cmp polishing system and abrasive solution
07/27/2006WO2006063272A3 Alloyed underlayer for microelectronic interconnects
07/27/2006WO2006056557A3 Electrostatic holding device having a number of supply sources
07/27/2006WO2006055639A3 Systems and methods for voltage distribution via multiple epitaxial layers
07/27/2006WO2006055486A3 Systems and methods for voltage distribution via epitaxial layers
07/27/2006WO2006047410A8 Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
07/27/2006WO2006039029A3 A method for forming a thin complete high-permittivity dielectric layer
07/27/2006WO2006037317A3 Two-step oxidation process for semiconductor wafers
07/27/2006WO2006033836A3 Treating agent materials
07/27/2006WO2006031975A3 Improved systems and methods for wafer translation
07/27/2006WO2006031641A3 Method of manufacturing carrier wafer and resulting carrier wafer structures
07/27/2006WO2006028858A3 Methods of removing photoresist on substrates
07/27/2006WO2006025969A3 Organic solvents having ozone dissolved therein for semiconductor processing utilizing sacrificial materials
07/27/2006WO2006016136A3 Shear test device
07/27/2006WO2006015822A3 High-voltage nmos-transistor and associated production method
07/27/2006WO2005119753A3 Systems and methods for nanowire growth and harvesting
07/27/2006WO2005094240A3 Reconfigurable processor module with stacked die elements
07/27/2006WO2005079476B1 Method of dry plasma etching semiconductor materials
07/27/2006WO2005065425A3 Localized synthesis and self-assembly of nanostructures
07/27/2006US20060168484 System and method for process degradation problematic tool identification
07/27/2006US20060167653 Testing system, a computer implemented testing method and a method for manufacturing electronic devices
07/27/2006US20060167650 Interconnection pattern inspection method, manufacturing method of semiconductor device and inspection apparatus
07/27/2006US20060167197 Photosensitive compositions based on polycyclic polymers
07/27/2006US20060167174 Electronic device manufacture
07/27/2006US20060166846 Remover solution
07/27/2006US20060166606 Polishing state monitoring apparatus and polishing apparatus and method
07/27/2006US20060166518 Subtractive-Additive Edge Defined Lithography
07/27/2006US20060166517 Phase-shifting mask and semiconductor device
07/27/2006US20060166516 Nitride film forming method, semiconductor device fabrication method, capacitor fabrication method and nitride film forming apparatus
07/27/2006US20060166515 In-situ-etch-assisted HDP deposition
07/27/2006US20060166514 TEOS deposition method
07/27/2006US20060166513 Method and apparatus for forming thin film of semiconductor device
07/27/2006US20060166512 Methods of forming a thin film and methods of manufacturing a capacitor and a gate structure using the same
07/27/2006US20060166511 Method for treatment of film or sheet
07/27/2006US20060166510 Semiconductor manufacturing method for die bonding
07/27/2006US20060166509 Method to avoid alpha-Si damage during wet stripping processes in the manufacture of MEMS devices
07/27/2006US20060166508 Topography transfer method with aspect ratio scaling
07/27/2006US20060166507 Integrated circuits having low resistivity contacts and the formation thereof using an in situ plasma doping and clean
07/27/2006US20060166506 Mask material for reactive ion etching, mask and dry etching method
07/27/2006US20060166505 Integrated process for thin film resistors with silicides
07/27/2006US20060166504 Profiled standoff structure and method for optical display package
07/27/2006US20060166503 Polishing apparatus and polishing method
07/27/2006US20060166502 Semiconductor constructions
07/27/2006US20060166501 Method and apparatus for monolayer deposition
07/27/2006US20060166500 Electroprocessing profile control
07/27/2006US20060166499 Method for fabricating semiconductor device
07/27/2006US20060166498 Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
07/27/2006US20060166497 Method of fabricating conductive lines
07/27/2006US20060166496 Incorporating dopants to enhance the dielectric properties of metal silicates
07/27/2006US20060166495 Contact structure formed using supercritical cleaning fluid and ALCVD
07/27/2006US20060166494 Method of manufacturing a semiconductor device that includes a contact plug
07/27/2006US20060166493 Semiconductor device having nitridated oxide layer and method therefor
07/27/2006US20060166492 Semiconductor fabrication process employing stress inducing source drain structures with graded impurity concentration
07/27/2006US20060166491 Dual damascene interconnection having low k layer and cap layer formed in a common PECVD process
07/27/2006US20060166490 Forming buried via hole substrates
07/27/2006US20060166489 Semiconductor constructions
07/27/2006US20060166488 Semiconductor device and method for manufacturing the same
07/27/2006US20060166487 Method and apparatus for chemical mechanical polishing of semiconductor substrates
07/27/2006US20060166486 Method of forming a semiconductor device having air gaps and the structure so formed
07/27/2006US20060166485 Methods for making dual-damascene dielectric structures
07/27/2006US20060166484 Method for Cu metallization of highly reliable dual damascene structures
07/27/2006US20060166483 Method of manufacturing a semiconductor device and semiconductor device obtained by using such a method
07/27/2006US20060166482 Semiconductor device manufacturing device
07/27/2006US20060166481 Method of forming metal layer pattern and method of manufacturing image sensor using the same
07/27/2006US20060166480 Interconnection of through-wafer vias using bridge structures
07/27/2006US20060166479 Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
07/27/2006US20060166478 Nitride semiconductor device and its manufacturing method
07/27/2006US20060166477 Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same
07/27/2006US20060166476 Method of forming a dielectric structure having a high dielectric constant and method of manufacturing a semiconductor device having the dielectric structure
07/27/2006US20060166475 Method for the production of stree-relaxed layer structure on a non-lattice adapted substrate and utilization of said layer system in electronic and/or optoelectronic components
07/27/2006US20060166474 Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow
07/27/2006US20060166473 Method of forming schottky diode with charge balance structure
07/27/2006US20060166472 Cleaving process to fabricate multilayered substrates using low implantation doses
07/27/2006US20060166471 Memory apparatus and production method
07/27/2006US20060166470 Method of irradiating a laser beam, apparatus for irradiating a laser beam and method of fabricating semiconductor devices
07/27/2006US20060166469 Method of laser beam maching and laser beam machining apparatus
07/27/2006US20060166468 Semiconductor substrate, semiconductor device, light emitting diode and producing method therefor
07/27/2006US20060166467 Method of producing microcrystalline silicon germanium suitable for micromachining
07/27/2006US20060166466 Semiconductor manufacturing method of die-pick-up from wafer
07/27/2006US20060166465 Method of dividing wafer
07/27/2006US20060166464 Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
07/27/2006US20060166463 Method of producing a device with a movable portion
07/27/2006US20060166462 Method for manufacturing semiconductor wafer
07/27/2006US20060166461 Method of producing mixed substrates and structure thus obtained
07/27/2006US20060166460 Use of selective oxidation to form asymmetrical oxide features during the manufacture of a semiconductor device
07/27/2006US20060166459 Semiconductor apparatus and method of producing the same
07/27/2006US20060166458 Method for forming shallow trench isolation structures
07/27/2006US20060166457 Method of making transistors and non-silicided polysilicon resistors for mixed signal circuits
07/27/2006US20060166456 Semiconductor device and manufacturing method thereof
07/27/2006US20060166455 Multilevel programming of phase change memory cells
07/27/2006US20060166454 Low tolerance polysilicon resistor for low temperature silicide processing