Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/18/2006US7078271 Leadframe-to-plastic lock for IC package
07/18/2006US7078270 Semiconductor device and manufacturing method of semiconductor device
07/18/2006US7078269 Substrate fabrication method and substrate
07/18/2006US7078268 Method of fabricating a vacuum sealed microdevice package with getters
07/18/2006US7078267 Methods of fabricating integrated circuitry
07/18/2006US7078266 Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts
07/18/2006US7078265 Method for fabricating a semiconductor device having a heat radiation layer including forming scribe lines and dicing
07/18/2006US7078264 Stacked semiconductor die
07/18/2006US7078263 Method and apparatus for hermetic sealing of assembled die
07/18/2006US7078262 Semiconductor wafer transport method and semiconductor wafer transport apparatus using the same
07/18/2006US7078261 Increased mobility from organic semiconducting polymers field-effect transistors
07/18/2006US7078260 CMOS image sensors and methods for fabricating the same
07/18/2006US7078259 Method for integrating thermistor
07/18/2006US7078258 Image sensor and manufacturing method of image sensor
07/18/2006US7078257 Surface emitting semiconductor laser, and method and apparatus for fabricating the same
07/18/2006US7078256 Nitride semiconductor LED improved in lighting efficiency and fabrication method thereof
07/18/2006US7078255 Thin film transistor array panel for a liquid crystal display and a method for manufacturing the same
07/18/2006US7078254 LED package die having a small footprint
07/18/2006US7078253 Radiation emitting semiconductor component with luminescent conversion element
07/18/2006US7078251 Electroluminescent devices
07/18/2006US7078250 Method and apparatus for manufacturing organic electroluminescent device, electronic apparatus and method of removing ionic impurities
07/18/2006US7078249 Process for forming sharp silicon structures
07/18/2006US7078248 Method and structure for defect monitoring of semiconductor devices using power bus wiring grids
07/18/2006US7078247 Early detection of contact liner integrity by chemical reaction
07/18/2006US7078246 Optical processing apparatus and optical processing method
07/18/2006US7078245 Method for determining a preceding wafer, method for determining a measuring wafer, and method for adjusting the number of wafers
07/18/2006US7078244 Multi-bit MRAM device with switching nucleation sites
07/18/2006US7078243 Shielding arrangement to protect a circuit from stray magnetic fields
07/18/2006US7078242 Manufacturing method of semiconducter device
07/18/2006US7078241 Methods of forming ferroelectric capacitors using separate polishing processes
07/18/2006US7078240 Reliable adhesion layer interface structure for polymer memory electrode and method of making same
07/18/2006US7078239 Integrated circuit structure formed by damascene process
07/18/2006US7078238 Method for manufacturing magnetic sensor
07/18/2006US7078161 Plasma ashing the photoresist and residues at a temperature of about room temperature to about 140 degrees C., wherein the plasma is generated from a gas mixture consisting essentially of hydrogen and an inert gas
07/18/2006US7078160 Selective surface exposure, cleans, and conditioning of the germanium film in a Ge photodetector
07/18/2006US7078156 Negative resist composition comprising base polymer having epoxy ring and Si-containing crosslinker and patterning method for semiconductor device using the same
07/18/2006US7078135 Mask can be used independently of its height tolerances and of the membrane holder to be mounted thereon for a distortion-free lithographic imaging
07/18/2006US7078094 Semiconductor chip attached to frame; die bonding; noncracking
07/18/2006US7077975 Using mixture of mineral acids
07/18/2006US7077974 Fine-dimension masks and related processes
07/18/2006US7077973 Methods for substrate orientation
07/18/2006US7077971 Methods for detecting the endpoint of a photoresist stripping process
07/18/2006US7077929 Apparatus for manufacturing a semiconductor device
07/18/2006US7077917 High-pressure processing chamber for a semiconductor wafer
07/18/2006US7077916 Supplying an ultrasonically-agitated cleaning liquid onto the substrate from a nozzle provided above the substrate while spinning the substrate
07/18/2006US7077915 Removal surface impurities from surface of mask using aqueous solution
07/18/2006US7077913 Apparatus for fabricating a semiconductor device
07/18/2006US7077912 Semiconductor manufacturing system
07/18/2006US7077911 MOCVD apparatus and MOCVD method
07/18/2006US7077903 Etch selectivity enhancement for tunable etch resistant anti-reflective layer
07/18/2006US7077902 Atomic layer deposition methods
07/18/2006US7077901 Process for producing single crystal silicon wafers
07/18/2006US7077882 Gold powders, methods for producing powders and devices fabricated from same
07/18/2006US7077880 Mixture containing stabilizer, catalyst, oxidizer; immobilization
07/18/2006US7077875 Flatness semicobductor; interface contactor; silicon substrate; controlling gas supply; forming silicon oxide; supplying infrared radiation
07/18/2006US7077730 Method and apparatus for polishing a workpiece
07/18/2006US7077727 Process for chemical-mechanical polishing of metal substrates
07/18/2006US7077726 Semiconductor wafer with improved local flatness, and method for its production
07/18/2006US7077725 Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
07/18/2006US7077721 Pad assembly for electrochemical mechanical processing
07/18/2006US7077614 Sorting/storage device for wafers and method for handling thereof
07/18/2006US7077585 Developing method and apparatus for performing development processing properly and a solution processing method enabling enhanced uniformity in the processing
07/18/2006US7077388 Bubbler for substrate processing
07/18/2006US7077305 Ball loading apparatus
07/18/2006US7077304 Bonding tool with polymer coating
07/18/2006US7077264 Methods and apparatus for transporting substrate carriers
07/18/2006US7077174 charging inert gases and silicone elastomers or polyesters into pressure vessels, then curing and depressurizing the vessels, to encase electronics
07/18/2006US7077173 Wafer carrier, wafer conveying system, stocker, and method of replacing gas
07/18/2006US7077170 Method of forming leads of a semiconductor device
07/18/2006US7077159 Processing apparatus having integrated pumping system
07/18/2006US7077120 Substrate cutting method
07/18/2006US7077019 High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
07/18/2006US7077007 Deep reactive ion etching process and microelectromechanical devices formed thereby
07/18/2006US7076969 gas apparatus comprising bulk storage vessels below a critical pressure, pressurizers, thermostats, purifiers and fluid conduits, for providing noncontaminating gases used as cleaning compounds
07/18/2006US7076920 Method of using a combination differential and absolute pressure transducer for controlling a load lock
07/18/2006US7076867 press bonding sheets including anisotropic conductive film tapes, film-like components including flexible printed circuit boards, electronic or optics against plasma display panel boards or liquid crystals; supporting
07/18/2006CA2386760C Apparatus for gripping microplates
07/18/2006CA2324135C Apparatus for testing bare-chip lsi mounting board
07/18/2006CA2221315C Semiconductor device
07/13/2006WO2006074470A1 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
07/13/2006WO2006074438A1 Device with stepped source/drain region profile
07/13/2006WO2006074352A2 Mems passivation with transition metals
07/13/2006WO2006074248A2 Engineered non-polymeric organic particles for chemical mechanical planarization
07/13/2006WO2006074197A1 Quantum well transistor using high dielectric constant dielectric layer
07/13/2006WO2006074175A2 Method and structure for forming an integrated spatial light modulator
07/13/2006WO2006073995A2 Activated iridium oxide electrodes and methods for their fabrication
07/13/2006WO2006073947A2 Apparatus for spatial and temporal control of temperature on a substrate
07/13/2006WO2006073943A2 Method for forming a one mask hyperabrupt junction varactor using a compensated cathode contact
07/13/2006WO2006073871A1 Line edge roughness reduction compatible with trimming
07/13/2006WO2006073818A2 System for and method of forming via holes by use of selective plasma etching in a continuous inline shadow mask deposition process
07/13/2006WO2006073562A2 Photoactive devices and components with enhanced efficiency
07/13/2006WO2006073437A2 Photovoltaic thin-film cell produced from metallic blend using high-temperature printing
07/13/2006WO2006073206A1 Bonding wire for semiconductor device
07/13/2006WO2006073189A1 Functional device and method for forming oxide material
07/13/2006WO2006073165A1 Semiconductor device, and method and apparatus for manufacturing same
07/13/2006WO2006073156A1 Polishing slurry
07/13/2006WO2006073155A1 Pattern defect inspection device, method thereof, and computer-readable recording medium containing program for the same
07/13/2006WO2006073152A1 Plasma processing method
07/13/2006WO2006073140A1 Substrate processing method and apparatus
07/13/2006WO2006073127A1 Method for producing magnetic multilayer film