Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/19/2006EP1681713A1 Surface-protecting sheet and semiconductor wafer lapping method
07/19/2006EP1681712A1 Method of producing substrates for optoelectronic applications
07/19/2006EP1681711A1 Semiconductor wafer with a silicon-germanium layer and process for its manufacture
07/19/2006EP1681710A1 Lighting optical device and projection aligner
07/19/2006EP1681709A1 Optical characteristics measuring device and optical characteristics measuring method, exposure system and exposure method, and device production method
07/19/2006EP1681594A1 Composition for forming underlying film containing dextrin ester compound
07/19/2006EP1681372A1 Electroless copper plating solution and method for electroless copper plating
07/19/2006EP1681307A1 Polymeric compound containing repeating unit having 2-oxatricyclo[4.2.1.04,8]nonan-3-one ring, and photoresist resin composition
07/19/2006EP1681276A1 Quartz glass excelling in plasma corrosion resistance and process for producing the same
07/19/2006EP1681262A2 Method for forming wavy nanostructures
07/19/2006EP1681130A1 Method of manufacturing parts by laser using an adhesive having an extinction coefficient of 1 or more ; adhesive sheet for laser processing parts used in such method
07/19/2006EP1681129A1 Method of manufacturing parts by laser using an adhesive having an extinction coefficient less than 1 ; adhesive sheet for laser processing parts used in such method
07/19/2006EP1680949A1 Solder stop barrier
07/19/2006EP1680814A2 Method and device for connecting chips
07/19/2006EP1680812A2 Semiconductor chip having flip-chip contacts and method for producing the same
07/19/2006EP1680811A2 Method for making a flat-top pad
07/19/2006EP1680810A2 Methods and apparatus for optimizing a substrate in a plasma processing system
07/19/2006EP1680809A2 Method for manufacturing p-type group iii nitride semiconductor, and group iii nitride semiconductor light-emitting device
07/19/2006EP1680808A1 Methods of selective deposition of heavily doped epitaxial sige
07/19/2006EP1680807A1 A device and method for inhibiting oxidation of contact plugs in ferroelectric capacitor devices
07/19/2006EP1680806A2 Cleaning solutions and etchants and methods for using same
07/19/2006EP1680805A2 Wafer carrier door
07/19/2006EP1680804A2 METHOD AND STRUCTURE FOR FORMING STRAINED Si FOR CMOS DEVICES
07/19/2006EP1680803A2 Method for integrating pre-fabricated chip structures into functional electronic systems
07/19/2006EP1680802A1 Wafer handler method and system
07/19/2006EP1680787A2 Nrom flash memory with self-aligned structural charge separation
07/19/2006EP1680535A2 Electroplating compositions and methods for electroplating
07/19/2006EP1680529A2 Substrate heater assembly
07/19/2006EP1680325A2 Front opening substrate container with bottom plate
07/19/2006EP1679997A2 Substrate container
07/19/2006EP1405341B1 Bipolar transistor with raised extrinsic base fabricated in an integrated bicmos circuit
07/19/2006EP1368711A4 Vacuum ultraviolet transmitting silicon oxyfluoride lithography glass
07/19/2006EP1256006B1 Non-invasive electrical measurement of semiconductor wafers
07/19/2006EP1189722B1 Efficient energy transfer capillary
07/19/2006EP1181134B1 Method for cleaning a chemical mechanical polishing pad
07/19/2006EP0836577A4 Load arm for load lock
07/19/2006CN2798309Y Improved structure of tool for packing image sensing device
07/19/2006CN2798062Y Automatic apparatus for LED tester table
07/19/2006CN2796944Y Polishing parts used for electrochemical machinery polishing
07/19/2006CN1806385A Low-noise amplifier
07/19/2006CN1806356A Method of producing membrane electrode assemblies
07/19/2006CN1806346A Process for producing light-emitting diode element emitting white light
07/19/2006CN1806344A Contacts fabric using heterostructure of metal/semiconductor nanorods and fabrication method thereof
07/19/2006CN1806343A Steady-state-non-equilibrium distribution of free carriers and photon energy up-conversion using same
07/19/2006CN1806342A Prevention of a parasitic channel in an integrated SOI process
07/19/2006CN1806341A Field effect transistor, especially a double diffused field effect transistor, and method for the production thereof
07/19/2006CN1806340A Finfet with dual silicon gate layer for chemical mechanical polishing planarization
07/19/2006CN1806337A Power semiconductor device and method therefor
07/19/2006CN1806335A Solid-state imaging device and its manufacturing method
07/19/2006CN1806334A Non-volatile memory device
07/19/2006CN1806333A Mixer circuit
07/19/2006CN1806332A DC amplifier and semiconductor integrated circuit therefor
07/19/2006CN1806331A Switch capacitor circuit and semiconductor integrated circuit thereof
07/19/2006CN1806330A Limiter circuit and semiconductor integrated circuit thereof
07/19/2006CN1806328A Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe
07/19/2006CN1806326A Dicing/die boding sheet
07/19/2006CN1806325A Integration of ALD tantalum nitride for copper metallization
07/19/2006CN1806324A Dipolar electrostatic chuck
07/19/2006CN1806323A Resin sealing semiconductor package and method and device for manufacturing the same
07/19/2006CN1806322A Semiconductor device, its manufacturing method, and electronic device
07/19/2006CN1806321A Plasma spraying for joining silicon parts
07/19/2006CN1806320A Mirror image memory cell transistor pairs featuring poly floating spacers
07/19/2006CN1806319A Mis transistor and cmos transistor
07/19/2006CN1806318A Multi-step chemical mechanical polishing of a gate area in a finfet
07/19/2006CN1806317A Gas processing apparatus and film-forming apparatus
07/19/2006CN1806316A Traps for particle entrapment in deposition chambers
07/19/2006CN1806315A Method for forming ti film and tin film, contact structure, computer readable storing medium and computer program
07/19/2006CN1806314A Impurity doping method, impurity doping apparatus and semiconductor device produced by using same
07/19/2006CN1806313A Silicon epitaxial wafer manufacturing method and silicon epitaxial wafer
07/19/2006CN1806312A Method and apparatus for thin-layer chemical processing of semiconductor wafers
07/19/2006CN1806294A Ferroelectric memory device
07/19/2006CN1806213A Scheduling multi-robot processing systems
07/19/2006CN1806206A Photosensitive resin composition
07/19/2006CN1806179A Scan test design method, scan test circuit, scan test circuit insertion cad program, large-scale integrated circuit, and mobile digital device
07/19/2006CN1806178A Anisotropic conductive connector and wafer inspection device
07/19/2006CN1806158A Measuring apparatus
07/19/2006CN1806084A Profiled rail and method for producing a profiled rail
07/19/2006CN1806066A Atmospheric pressure non-thermal plasma device to clean and sterilize the surface of probes, cannulas, pin tools, pipettes and spray heads
07/19/2006CN1806064A Stress reduction of SIOC low K film by addition of alkylenes to OMCTS based processes
07/19/2006CN1805911A Aluminum nitride conjugate body and method of producing the same
07/19/2006CN1805890A Wafer box with radially pivoting latch elements
07/19/2006CN1805889A Reduced movement wafer box
07/19/2006CN1805884A Non-contact protective packaging for surface-sensitive articles
07/19/2006CN1805802A Uniform cavitation for particle removal
07/19/2006CN1805657A Wired circuit board
07/19/2006CN1805153A Semiconductor device and a method of manufacturing thereof
07/19/2006CN1805152A Field effect transistor (FET) having wire channels and method of fabricating the same
07/19/2006CN1805146A Flash memory structure and its preparation method
07/19/2006CN1805145A Semiconductor device and method of manufacturing the same
07/19/2006CN1805144A Semiconductor integrated circuit and fabrication process thereof
07/19/2006CN1805141A Method and structure to wire electronic devices
07/19/2006CN1805139A Structure and method for failure analysis in a semiconductor device
07/19/2006CN1805138A Interconnection structure having wings
07/19/2006CN1805137A Interconnecting structure having aluminum core
07/19/2006CN1805135A Thin electronic encapsulation structure and its manufacturing method
07/19/2006CN1805132A Method and apparatus for chip cooling using a liquid metal thermal interface
07/19/2006CN1805129A Method of protecting cmos from electrostatic discharge effect
07/19/2006CN1805128A Wafer carrying chamber and its wafer carrier
07/19/2006CN1805127A Substrate processing apparatus and transfer positioning method thereof
07/19/2006CN1805126A Substrate treating apparatus