Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/01/2006US7084476 Integrated circuit logic with self compensating block delays
08/01/2006US7084475 Lateral conduction Schottky diode with plural mesas
08/01/2006US7084470 Spin tunnel transistor
08/01/2006US7084469 Magnetic storage device comprising memory cells including magneto-resistive elements
08/01/2006US7084465 Semiconductor device having device isolation region and portable electronic device
08/01/2006US7084463 Semiconductor device and manufacturing method thereof
08/01/2006US7084461 Back gate FinFET SRAM
08/01/2006US7084460 Method for fabricating SiGe-on-insulator (SGOI) and Ge-on-insulator (GOI) substrates
08/01/2006US7084459 SOI substrate
08/01/2006US7084458 Semiconductor device having triple LDD structure and lower gate resistance formed with a single implant process
08/01/2006US7084457 DMOS device having a trenched bus structure
08/01/2006US7084456 Trench MOSFET with recessed clamping diode using graded doping
08/01/2006US7084455 Power semiconductor device having a voltage sustaining region that includes terraced trench with continuous doped columns formed in an epitaxial layer
08/01/2006US7084454 Nonvolatile integrated semiconductor memory
08/01/2006US7084453 Method of forming different oxide thickness for high voltage transistor and memory cell tunnel dielectric
08/01/2006US7084452 Semiconductor device having one-time programmable ROM and method of fabricating the same
08/01/2006US7084451 Circuits with a trench capacitor having micro-roughened semiconductor surfaces
08/01/2006US7084450 Semiconductor memory device and method of manufacturing the same
08/01/2006US7084449 Microelectronic element having trench capacitors with different capacitance values
08/01/2006US7084448 Double sided container process used during the manufacture of a semiconductor device
08/01/2006US7084441 Semiconductor devices having a hybrid channel layer, current aperture transistors and methods of fabricating same
08/01/2006US7084440 Integrated circuit layout and a semiconductor device manufactured using the same
08/01/2006US7084439 Integrated circuit with reduced analog coupling noise
08/01/2006US7084438 Metal insulator power semiconductor component (MIS) and a method for producing the same
08/01/2006US7084437 Semiconductor device
08/01/2006US7084431 High speed composite p-channel Si/SiGe heterostructure for field effect devices
08/01/2006US7084430 Pixel structure and fabricating method thereof
08/01/2006US7084429 Strained semiconductor by wafer bonding with misorientation
08/01/2006US7084428 Transistor, integrated circuit, electro-optic device, electronic instrument and method of manufacturing a transistor
08/01/2006US7084426 Organic electroluminescent device, method of manufacturing the same, and electronic apparatus
08/01/2006US7084423 Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
08/01/2006US7084411 Pattern-definition device for maskless particle-beam exposure apparatus
08/01/2006US7084376 Semiconductor production device ceramic plate
08/01/2006US7084358 Apparatus and method for balancing and for providing a compliant range to a test head
08/01/2006US7084352 Thin-film resin substrate used in a high-frequency module
08/01/2006US7084112 Activated polyethylene glycol compounds
08/01/2006US7084098 Using mixture of hydroxylamine, hydroxide, antifoam agents,cleaner, precipitation inhibitor and water; printed circuits
08/01/2006US7084097 Cleaning solution for substrates of electronic materials
08/01/2006US7084081 Display device and method of manufacturing the same
08/01/2006US7084080 Silicon source reagent compositions, and method of making and using same for microelectronic device structure
08/01/2006US7084079 Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications
08/01/2006US7084078 Atomic layer deposited lanthanide doped TiOx dielectric films
08/01/2006US7084077 Method of fabricating multilayer interconnect wiring structure having low dielectric constant insulator film with enhanced adhesivity
08/01/2006US7084076 Method for forming silicon dioxide film using siloxane
08/01/2006US7084075 Method for producing a layer on a substrate
08/01/2006US7084074 CVD gas injector and method therefor
08/01/2006US7084073 Method of forming a via hole through a glass wafer
08/01/2006US7084072 Method of manufacturing semiconductor device
08/01/2006US7084071 Use of multilayer amorphous carbon ARC stack to eliminate line warpage phenomenon
08/01/2006US7084070 Treatment for corrosion in substrate processing
08/01/2006US7084069 Method for manufacturing a semiconductor device
08/01/2006US7084068 Annealing furnace, manufacturing apparatus, annealing method and manufacturing method of electronic device
08/01/2006US7084067 Removal of copper oxides from integrated interconnects
08/01/2006US7084066 Method of uniformly etching refractory metals, refractory metal alloys and refractory metal silicides
08/01/2006US7084065 Method for fabricating a semiconductor device
08/01/2006US7084064 Full sequence metal and barrier layer electrochemical mechanical processing
08/01/2006US7084063 Fabrication method of semiconductor integrated circuit device
08/01/2006US7084062 Use of Ta-capped metal line to improve formation of memory element films
08/01/2006US7084061 Methods of fabricating a semiconductor device having MOS transistor with strained channel
08/01/2006US7084060 Forming capping layer over metal wire structure using selective atomic layer deposition
08/01/2006US7084059 CMP system for metal deposition
08/01/2006US7084058 Method of forming low-loss coplanar waveguides
08/01/2006US7084057 Bit line contact structure and fabrication method thereof
08/01/2006US7084056 Electrical interconnection, method of forming the electrical interconnection, image sensor having the electrical interconnection and method of manufacturing the image sensor
08/01/2006US7084055 Method for manufacturing semiconductor integrated circuit device
08/01/2006US7084054 Method for making an opening for electrical contact by etch back profile control
08/01/2006US7084053 Unidirectionally conductive materials for interconnection
08/01/2006US7084052 Semiconductor device, display device and method of fabricating the same
08/01/2006US7084051 Manufacturing method for semiconductor substrate and manufacturing method for semiconductor device
08/01/2006US7084050 Formation of silicon-germanium-on-insulator (SGOI) by an integral high temperature SIMOX-Ge interdiffusion anneal
08/01/2006US7084049 Manufacturing method for buried insulating layer-type semiconductor silicon carbide substrate
08/01/2006US7084048 Process for metallic contamination reduction in silicon wafers
08/01/2006US7084047 Method for the production of individual monolithically integrated semiconductor circuits
08/01/2006US7084046 Method of fabricating SOI wafer
08/01/2006US7084045 Method for manufacturing semiconductor device
08/01/2006US7084044 Optoelectronic device and method of manufacture thereof
08/01/2006US7084043 Method for forming an SOI substrate, vertical transistor and memory cell with vertical transistor
08/01/2006US7084042 Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same
08/01/2006US7084041 Bipolar device and method of manufacturing the same including pre-treatment using germane gas
08/01/2006US7084040 Method for growth of group III-V semiconductor material on a dielectric
08/01/2006US7084039 Method of fabricating MOS transistor
08/01/2006US7084038 Method for making a semiconductor device having a high-k gate dielectric
08/01/2006US7084037 Semiconductor device and method of manufacturing the same
08/01/2006US7084036 Data writing method for mask read only memory
08/01/2006US7084035 Semiconductor device placing high, medium, and low voltage transistors on the same substrate
08/01/2006US7084034 High voltage MOS-gated power device and related manufacturing process
08/01/2006US7084033 Method for fabricating a trench power MOSFET
08/01/2006US7084032 Manufacturing process of an interpoly dielectric structure for non-volatile semiconductor integrated memories
08/01/2006US7084031 Method for manufacturing flash memory device and flash memory device
08/01/2006US7084030 Method of forming a non-volatile memory device having floating trap type memory cell
08/01/2006US7084029 Method for fabricating a hole trench storage capacitor in a semiconductor substrate, and hole trench storage capacitor
08/01/2006US7084028 Semiconductor device and method of manufacturing a semiconductor device
08/01/2006US7084027 Method for producing an integrated circuit
08/01/2006US7084026 Semiconductor device and method for fabricating the same
08/01/2006US7084025 Selective oxide trimming to improve metal T-gate transistor
08/01/2006US7084024 Gate electrode forming methods using conductive hard mask
08/01/2006US7084023 Method of manufacturing semiconductor device, film-forming apparatus, and storage medium
08/01/2006US7084022 Method of manufacturing a semiconductor device including forming a pattern, an interlayer insulation film, exposing the patterning and flattening
08/01/2006US7084021 Method of forming a structure wherein an electrode comprising a refractory metal is deposited
08/01/2006US7084020 Manufacturing method of a thin-film semiconductor device