Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/01/2006US7084019 Method of fabricating semiconductor device comprising pixel having numerical aperture
08/01/2006US7084018 Sacrificial oxide for minimizing box undercut in damascene FinFET
08/01/2006US7084017 Liquid crystal display
08/01/2006US7084016 Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same
08/01/2006US7084015 Semiconductor constructions
08/01/2006US7084014 Method of making circuitized substrate
08/01/2006US7084013 Methods for forming protective layers on semiconductor device substrates
08/01/2006US7084012 Programmed material consolidation processes for protecting intermediate conductive structures
08/01/2006US7084011 Forming a chip package having a no-flow underfill
08/01/2006US7084010 Integrated package design and method for a radiation sensing device
08/01/2006US7084009 Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate
08/01/2006US7084008 Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product
08/01/2006US7084007 Fabrication and assembly structures and methods for memory devices
08/01/2006US7084006 Electronic parts packaging structure and method of manufacturing the same
08/01/2006US7084005 Semiconductor device and method of manufacturing the same
08/01/2006US7084004 MEMS heat pumps for integrated circuit heat dissipation
08/01/2006US7084003 Method for manufacturing semiconductor device packages
08/01/2006US7084002 Method for manufacturing a nano-structured electrode of metal oxide
08/01/2006US7084001 Method of forming film including a comb tooth patterning film
08/01/2006US7084000 Solid-state imaging device and method for manufacturing the same
08/01/2006US7083999 Optical device, method of manufacturing the same, optical module, circuit board and electronic instrument
08/01/2006US7083998 Si/SiGe optoelectronic integrated circuits
08/01/2006US7083997 Bonded wafer optical MEMS process
08/01/2006US7083996 Nitride semiconductor device and manufacturing method thereof
08/01/2006US7083994 Method of manufacturing a semiconductor device with outline of cleave marking regions and alignment or registration features
08/01/2006US7083993 Methods of making multi-layer light emitting devices
08/01/2006US7083992 Method of observation by transmission electron microscopy
08/01/2006US7083991 Method of in-situ treatment of low-k films with a silylating agent after exposure to oxidizing environments
08/01/2006US7083990 Method of fabricating MRAM cells
08/01/2006US7083989 Thin-film magnetic head and method of forming the same
08/01/2006US7083988 Magnetic annealing sequences for patterned MRAM synthetic antiferromagnetic pinned layers
08/01/2006US7083903 Methods of etching photoresist on substrates
08/01/2006US7083899 Method for manufacturing a semiconductor device
08/01/2006US7083898 Method for performing chemical shrink process over BARC (bottom anti-reflective coating)
08/01/2006US7083879 Phase conflict resolution for photolithographic masks
08/01/2006US7083869 Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutions
08/01/2006US7083846 Ceramic member
08/01/2006US7083759 Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
08/01/2006US7083747 Ultrasonic aerosol generators; transducers; fluid flow; supplying carrier gas; pyrolysis
08/01/2006US7083741 Process and device for the wet-chemical treatment of silicon
08/01/2006US7083738 Method for creating inductive write head with steep shoulder at notch
08/01/2006US7083737 Method for manufacturing a micro-actuator
08/01/2006US7083706 For filling copper in interconnection recesses of a semiconductor
08/01/2006US7083702 RF current return path for a large area substrate plasma reactor
08/01/2006US7083701 Device and method for plasma processing, and slow-wave plate
08/01/2006US7083700 Methods and apparatuses for planarizing microelectronic substrate assemblies
08/01/2006US7083694 applying a flowable mixture of a silicon powder and a bridging agent, then annealing; wafer towers for semiconductors manufacturing
08/01/2006US7083684 dissolving liquid of tetraalkyl ammonium hydroxide or halide; removing elastomer gel only
08/01/2006US7083679 Nitride semiconductor growth method, nitride semiconductor substrate, and nitride semiconductor device
08/01/2006US7083507 Substrate holding apparatus
08/01/2006US7083506 Polishing apparatus
08/01/2006US7083501 Methods and apparatus for the chemical mechanical planarization of electronic devices
08/01/2006US7083497 Polishing pad with built-in optical sensor
08/01/2006US7083495 Advanced process control approach for Cu interconnect wiring sheet resistance control
08/01/2006US7083436 Particle distribution interposer and method of manufacture thereof
08/01/2006US7083338 Lithography equipment
08/01/2006US7083290 Adjustment method and apparatus of optical system, and exposure apparatus
08/01/2006US7083077 Method and contact point for establishing an electrical connection
08/01/2006US7082693 Adjusting apparatus for devices and for setting adjustments
08/01/2006US7082682 Contact structures and methods for making same
08/01/2006CA2250504C Multibit single cell memory having tapered contact
08/01/2006CA2241684C Short channel fermi-threshold field effect transistors including drain field termination region and methods of fabricating same
08/01/2006CA2224878C Method for overall regulation of the headbox and/or the former of a paper machine or equivalent
08/01/2006CA2178232C Lcd with bus lines overlapped by pixel electrodes and photo-imageable insulating layer therebetween
07/2006
07/27/2006WO2006079104A2 Encapsulation of circuit components to reduce thermal cycling stress
07/27/2006WO2006079005A2 Metal-free silicon-molecule-nanotube testbed and memory device
07/27/2006WO2006078985A2 Optoelectronic architecture having compound conducting substrate
07/27/2006WO2006078918A2 Replication tools and related fabrication methods and apparatus
07/27/2006WO2006078851A2 End point detection method for plasma etching of semiconductor wafers with low exposed area
07/27/2006WO2006078815A2 Single mask mim capacitor and resistor with in trench copper drift barrier
07/27/2006WO2006078779A2 Methods for depositing tungsten layers employing atomic layer deposition techniques
07/27/2006WO2006078740A2 Structure and method to optimize strain in cmosfets
07/27/2006WO2006078585A2 Wafer support pin assembly
07/27/2006WO2006078505A2 A non-volatile memory cell comprising a dielectric layer and a phase change material in series
07/27/2006WO2006078469A1 Non-planar mos structure with a strained channel region
07/27/2006WO2006078408A2 Method and control system for treating a hafnium-based dielectric processing system
07/27/2006WO2006078382A2 Passivating metal etch structures
07/27/2006WO2006078374A1 Methods and apparatus having wafer level chip scale package for sensing elements
07/27/2006WO2006078354A2 Micro-feature fill process and apparatus using hexachlorodisilane or other chlorine-containing silicon precursor
07/27/2006WO2006078281A2 Systems and methods for harvesting and integrating nanowires
07/27/2006WO2006078076A1 Gold wire for semiconductor device connection
07/27/2006WO2006078074A2 Polishing composition and polishing method
07/27/2006WO2006078065A1 Semiconductor device
07/27/2006WO2006078025A1 Measurement method, measurement system, inspection method, inspection system, exposure method, and exposure system
07/27/2006WO2006077986A1 Transparent conductive film forming apparatus, multilayer transparent conductive film continuously forming apparatus and method of film forming therewith
07/27/2006WO2006077958A1 Linear motor, stage apparatus, and exposure apparatus
07/27/2006WO2006077905A1 Stage apparatus and application processing apparatus
07/27/2006WO2006077891A1 Film-forming apparatus, film-forming method, manufacturing method, and titanium film
07/27/2006WO2006077859A1 Liquid removing apparatus, exposure apparatus and device manufacturing method
07/27/2006WO2006077849A1 Method of adjusting lighting optical device, lighting optical device, exposure system, and exposure method
07/27/2006WO2006077847A1 Fluorinated carbon film and method for producing same
07/27/2006WO2006077843A1 Substrate convey processing device, trouble countermeasure method in substrate convey processing device, and trouble countermeasures program in substrate convey processing device
07/27/2006WO2006077840A1 Trench filling method
07/27/2006WO2006077837A1 Sputtering system and film-forming method
07/27/2006WO2006077802A1 Semiconductor device
07/27/2006WO2006077771A1 Curable resin composition and interlayer insulating film
07/27/2006WO2006077748A1 Composition for forming of underlayer film for lithography that contains compound having protected carboxyl
07/27/2006WO2006077735A1 Substrate processing apparatus
07/27/2006WO2006077730A1 Cmp polishing method, cmp polishing apparatus, and process for producing semiconductor device
07/27/2006WO2006077722A1 Die heating apparatus