Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/26/2014CN103681527A Semiconductor device and manufacturing method of semiconductor device
03/26/2014CN103681526A Circuit board incorporating semiconductor ic and manufacturing method thereof
03/26/2014CN103681524A Semiconductor package and fabrication method thereof
03/26/2014CN103681517A Thermal interface material for use in chip stacks
03/26/2014CN103681516A Method of manufacturing semiconductor device
03/26/2014CN103681515A Complementary type TFT (Thin-Film Transistor) driving back plate, preparation method thereof and display device
03/26/2014CN103681514A Array substrate, manufacturing method thereof and display device
03/26/2014CN103681513A Integrated circuit charging driver and manufacturing method thereof
03/26/2014CN103681512A Method of improving growth effect of film in small-sized trenches
03/26/2014CN103681511A Imprinted memory
03/26/2014CN103681510A Semiconductor device with buried bit line and method for fabricating the same
03/26/2014CN103681509A A method for manufacturing a semiconductor structure
03/26/2014CN103681508A Semiconductor device and manufacturing method thereof
03/26/2014CN103681507A Semiconductor device and manufacturing method thereof
03/26/2014CN103681506A Manufacturing method for semiconductor device
03/26/2014CN103681505A Source-drain double epitaxial layer forming method
03/26/2014CN103681504A Semiconductor device manufacturing method
03/26/2014CN103681503A Semiconductor device manufacturing method
03/26/2014CN103681502A Method for forming CMOS transistor
03/26/2014CN103681501A Method for manufacturing semiconductor device
03/26/2014CN103681500A Method for manufacturing semiconductor device
03/26/2014CN103681499A Method for manufacturing semiconductor device
03/26/2014CN103681498A Method for manufacturing semiconductor device
03/26/2014CN103681497A Production method for semiconductor device
03/26/2014CN103681496A Production method for semiconductor device
03/26/2014CN103681495A Semiconductor device and method of manufacturing same
03/26/2014CN103681494A A thin film transistor pixel unit and a manufacturing method thereof
03/26/2014CN103681493A Wafer cutting method
03/26/2014CN103681492A Machining method
03/26/2014CN103681491A Processing method
03/26/2014CN103681490A Processing method
03/26/2014CN103681489A Array substrate, manufacturing method and display device thereof
03/26/2014CN103681488A Array substrate, manufacturing method thereof and display device
03/26/2014CN103681487A Thin film transistor substrate and manufacturing method thereof
03/26/2014CN103681486A Method for manufacturing flexible display substrate
03/26/2014CN103681485A System and method for integrated circuit having transistor segments
03/26/2014CN103681484A Flexible display device manufacturing method and carrier substrate for manufacturing same
03/26/2014CN103681483A Method for alleviating line breakage of transparent conducting layer and structure thereof
03/26/2014CN103681482A An OLED display device and a packaging method thereof
03/26/2014CN103681481A Array substrate and manufacture method thereof, display device
03/26/2014CN103681480A Method and application for preparing ultra-thin copper seed layer by processing surfaces of hydrogen plasmas
03/26/2014CN103681479A Method for improving tolerance of multilayer wiring through hole photoetching technology
03/26/2014CN103681478A Copper-connection structure and manufacturing method of copper-connection structure
03/26/2014CN103681477A Method for etching contact holes
03/26/2014CN103681476A Preparation method of copper wire insulation material blocking body
03/26/2014CN103681475A Slot preference copper-connection manufacturing method
03/26/2014CN103681474A Semiconductor structure and method for manufacturing same, hardware description language design structure
03/26/2014CN103681473A Microelectronic packages having trench vias and methods for the manufacture thereof
03/26/2014CN103681472A Bit cell with triple patterned metal layer structures
03/26/2014CN103681471A Bit cell with double patterned metal layer structures
03/26/2014CN103681470A Semiconductor device and method of manufacturing the same
03/26/2014CN103681469A Semiconductor device and method for forming the same
03/26/2014CN103681468A Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP
03/26/2014CN103681467A Manufacturing method for semiconductor device
03/26/2014CN103681466A Method for making interconnected structure
03/26/2014CN103681465A Method for forming semiconductor device
03/26/2014CN103681464A Through hole and trench forming method
03/26/2014CN103681463A Method for preparing dual damascene structure
03/26/2014CN103681462A Method for manufacturing semiconductor device
03/26/2014CN103681461A Semiconductor device structure and manufacture method thereof
03/26/2014CN103681460A Manufacture method of electronic element
03/26/2014CN103681459A Method for improving gap filling capability of pre-metal dielectric
03/26/2014CN103681458A Method for manufacturing three-dimensional flexible stacked encapsulating structure of embedded ultrathin chip
03/26/2014CN103681457A Forming method of shallow trench isolation structure
03/26/2014CN103681456A Method for reducing critical dimension loss in HARP (High Aspect Ratio Process) film annealing
03/26/2014CN103681455A Die underfill structure and method
03/26/2014CN103681454A Isolation for semiconductor devices
03/26/2014CN103681453A Semiconductor memory array structure
03/26/2014CN103681452A Method for forming trench isolation
03/26/2014CN103681451A Manufacturing method of trench structure
03/26/2014CN103681450A Method for forming semiconductor device
03/26/2014CN103681449A Method for forming shallow trench isolation region
03/26/2014CN103681448A Method for forming shallow trench isolation region
03/26/2014CN103681447A SOI (silicon-on-insulator) substrate manufacture method and SOI substrate
03/26/2014CN103681446A Shallow groove isolation structure and manufacturing method thereof
03/26/2014CN103681445A Groove isolation structure and preparation method thereof
03/26/2014CN103681444A Shallow groove isolation structure and manufacturing method thereof
03/26/2014CN103681443A Ejector pin seat and ejector pin mounting method
03/26/2014CN103681442A Upwards-protruding needle magnetic fixing mechanism
03/26/2014CN103681441A Thimble fixture mechanism for packaging of semiconductor chips
03/26/2014CN103681440A A graphite technology nail
03/26/2014CN103681439A Semiconductor bonding equipment having improved fixture and packaging method thereof
03/26/2014CN103681438A Processing method
03/26/2014CN103681437A Electrostatic chuck
03/26/2014CN103681436A Adsorption platform
03/26/2014CN103681435A Protective tape stripping method and protective tape stripping device
03/26/2014CN103681434A Protective belt stripping method, protective belt stripping device and stripping belt for the protective strip stripping device
03/26/2014CN103681433A Electrostatic chuck
03/26/2014CN103681432A Electrostatic chuck
03/26/2014CN103681431A Substrate fixing device utilizing air pressure
03/26/2014CN103681430A Grain suction nozzle with buffer function
03/26/2014CN103681429A Method and system for controlling chip die bonder
03/26/2014CN103681428A Clamping pre-pressing device
03/26/2014CN103681427A Vision-based wafer rotation correction and centralized positioning method
03/26/2014CN103681426A Large warp silicon wafer pre-alignment device and method
03/26/2014CN103681425A Transfer device for solar cell piece group
03/26/2014CN103681424A Rotating mechanism for steering silicon chip basket
03/26/2014CN103681423A 90-degree rotating mechanism for transmitting silicon wafer baskets
03/26/2014CN103681422A Turnover mechanism used for transmission line
03/26/2014CN103681421A Quartz boat lifter for semiconductor diffusion equipment
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