Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/26/2014CN103681420A Automatic mounting and detaching system for silicon wafers of graphite boat for tube plasma enhanced chemical vapor deposition (PECVD)
03/26/2014CN103681419A Method and system related to semiconductor processing equipment
03/26/2014CN103681418A A twelve-inch wafer framework
03/26/2014CN103681417A Semiconductor loading direct current motor drive platform
03/26/2014CN103681416A Method for monitoring thickness of polycrystalline silicon furnace tube wafers
03/26/2014CN103681415A Method of removing damaged epoxy from electrostatic chuck
03/26/2014CN103681414A Treatment apparatus, method for manufacturing treatment liquid, and method for manufacturing electronic device
03/26/2014CN103681413A Apparatus for handling an electronic device and related methodology
03/26/2014CN103681412A Semiconductor processing apparatus including a plurality of reactors, and method for providing the same with process gas
03/26/2014CN103681411A Bare die discharging device
03/26/2014CN103681410A Apparatus for treating substrate
03/26/2014CN103681409A Integrated tool for semiconductor manufacturing
03/26/2014CN103681408A Horizontal axis drive mechanism, two-axis drive mechanism, and die bonder
03/26/2014CN103681407A Die bonder and bonding method
03/26/2014CN103681406A Die bonding apparatus, die picking up apparatus and die picking up method
03/26/2014CN103681405A Semiconductor apparatus with inner wafer carrier buffer and method
03/26/2014CN103681404A Curing apparatus
03/26/2014CN103681403A Gate-oxide testing method for preventing breakdown of wired metal interlayer dielectric layers
03/26/2014CN103681402A Automatic skip-stop detection system
03/26/2014CN103681401A Die bonder detection mechanism and continuous detection method
03/26/2014CN103681400A Method and system for determining overlap process windows in semiconductors by inspection techniques
03/26/2014CN103681399A Adaptive semiconductor processing using feedback from measurement devices
03/26/2014CN103681398A Manufacturing method of semiconductor device, semiconductor device, supporting substrate, and semiconductor manufacturing apparatus
03/26/2014CN103681397A Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages
03/26/2014CN103681396A Die bonder and method of position recognition of die
03/26/2014CN103681395A Qualitative fault detection and classification system for tool condition monitoring and associated methods
03/26/2014CN103681394A Detection method
03/26/2014CN103681393A Etching method
03/26/2014CN103681392A Mechanical scratch detection method
03/26/2014CN103681391A IC chip jointing method
03/26/2014CN103681390A TSV (Through Silicon Via) technology based preparation method for wafer level silicon substrate
03/26/2014CN103681389A Method of manufacturing semiconductor device
03/26/2014CN103681388A Method of manufacturing semiconductor device
03/26/2014CN103681387A Method of manufacturing semiconductor device
03/26/2014CN103681386A Semiconductor structure and method of manufacturing the same
03/26/2014CN103681385A Semiconductor device and making method thereof
03/26/2014CN103681384A Chip sealing base plate as well as structure and manufacturing method thereof
03/26/2014CN103681383A Semiconductor device and assembly method thereof
03/26/2014CN103681382A Semiconductor device and manufacture method thereof
03/26/2014CN103681381A Circuit board system and manufacture method thereof
03/26/2014CN103681380A Sealing and scalding device
03/26/2014CN103681379A Manufacturing method of semiconductor device and semiconductor device
03/26/2014CN103681378A Method for production of sealed body, frame-shaped spacer for production of sealed body, sealed body and electronic instrument
03/26/2014CN103681377A Semiconductor device with bottom metal base and preparing method thereof
03/26/2014CN103681376A Semiconductor module manufacturing method and semiconductor module
03/26/2014CN103681375A Square planar no-guide-pin semiconductor packaging member and preparing method thereof
03/26/2014CN103681374A Method of fabricating a package
03/26/2014CN103681373A Method for encapsulating chips and support plates
03/26/2014CN103681372A Packaging method of fanout wafer level three-dimensional conductor chip
03/26/2014CN103681371A Silica-based wafer level fan-out encapsulation method and silica-based wafer level fan-out encapsulation structure
03/26/2014CN103681370A Material cutting tool for SMD diode
03/26/2014CN103681369A Semiconductor device and method of manufacturing the same
03/26/2014CN103681368A Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP
03/26/2014CN103681367A Packaging Methods and Packaged Devices
03/26/2014CN103681366A Semiconductor packaging member and preparing method thereof
03/26/2014CN103681365A Package-on-package (POP) structure and manufacturing method for POP structure
03/26/2014CN103681364A Integration method of lead-less ball pin surface mounting type high-density thick-film hybrid integrated circuit
03/26/2014CN103681363A Serial thermal linear processor arrangement
03/26/2014CN103681362A Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP
03/26/2014CN103681361A Manufacturing method for micro bump structure
03/26/2014CN103681360A Packaging Devices and Methods
03/26/2014CN103681359A Stack package structure and manufacturing method thereof
03/26/2014CN103681358A Chip package substrate and chip package structure and manufacturing methods thereof
03/26/2014CN103681357A Flexible display device, flexible display device manufacturing method and display unit
03/26/2014CN103681356A Method for manufacturing FinFET by using carbon nano tube as mask
03/26/2014CN103681355A Method for preparing quasi-SOI source-drain field effect transistor device
03/26/2014CN103681354A Method for producing a controllable semiconductor component
03/26/2014CN103681353A Method for manufacturing a transistor device comprising a germanium based channel layer and microelectronic device
03/26/2014CN103681352A Method for manufacturing a semiconductor device
03/26/2014CN103681351A Method of forming a material layer in a semiconductor structure
03/26/2014CN103681350A Method of making a thin film transistor device
03/26/2014CN103681349A Method of forming polysilicon film, thin film transistor and display device
03/26/2014CN103681348A Trench MOSFET structures and manufacturing method therof
03/26/2014CN103681347A Method of making a FinFET device
03/26/2014CN103681346A Transistors, semiconductor devices, and methods of manufacture thereof
03/26/2014CN103681345A Transistor and formation method thereof
03/26/2014CN103681344A Formation method of transistor
03/26/2014CN103681343A Method for manufacturing semiconductor structure
03/26/2014CN103681342A A method for producing a conductive channel
03/26/2014CN103681341A Method for inhibiting PMOS-device threshold-voltage drift
03/26/2014CN103681340A Semiconductor device and manufacturing method thereof
03/26/2014CN103681339A Fin field effect transistor preparation method
03/26/2014CN103681338A Semiconductor device and manufacturing method thereof
03/26/2014CN103681337A Fin type field effect transistor and forming method thereof
03/26/2014CN103681336A Method for forming semiconductor structure
03/26/2014CN103681335A Method for manufacturing semiconductor device
03/26/2014CN103681334A Method for inhibiting depletion of grid polysilicon in PMOS device technology
03/26/2014CN103681333A Method for manufacturing semiconductor device
03/26/2014CN103681332A Method for forming transistor and method for forming semiconductor device
03/26/2014CN103681331A Fin field-effect transistor (FET) and fin FET forming method
03/26/2014CN103681330A Fin and fin forming method
03/26/2014CN103681329A Semiconductor device and manufacture method thereof
03/26/2014CN103681328A Method for manufacturing field effect transistor
03/26/2014CN103681327A Semiconductor structure and formation method thereof
03/26/2014CN103681326A Formation method of fin field-effect transistor (FinFET) substrates with different threshold voltages
03/26/2014CN103681325A Preparation method for fin field effect transistor
03/26/2014CN103681324A Manufacturing method for MOS (Metal Oxide Semiconductor) transistor
03/26/2014CN103681323A Manufacturing method for high-electron mobility transistor
03/26/2014CN103681322A Power semiconductor device and method of manufacturing the same
03/26/2014CN103681321A Method for manufacturing high-voltage super-junction IGBT (Insulated Gate Bipolar Translator)
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