Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2007
01/09/2007US7160742 Methods for integrated implant monitoring
01/09/2007US7160741 Planar voltage contrast test structure and method
01/09/2007US7160740 Methods of controlling properties and characteristics of a gate insulation layer based upon electrical test data, and system for performing same
01/09/2007US7160739 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
01/09/2007US7160738 Magnetic annealing sequences for patterned MRAM synthetic antiferromagnetic pinned layers
01/09/2007US7160737 Method for fabricating semiconductor device
01/09/2007US7160672 Forming a thin ceramic protective coating applied at relatively low temperature by selective coating of ceramic on an electrical or magnetic biocompatible implant; metallization; photolithographic polyamide coating; scribing and dissolving away polymerized polyamide and a ceramic mask; batch processing
01/09/2007US7160665 up diffusion of photoacid generated by patternwise imaging of an underlayer and overcoated with a polymer containing acid labile functionality; forming images in positive- or negative-tone chemically amplified photoresists
01/09/2007US7160629 A bright tin or bright lead-free tin-alloy having no whiskers after 4 months storage at 52 degrees C. and 98% relative humidity; preferred alloying elements are nickel, copper, bismuth, zinc, silver or indium; prepared from a solution of acidic electrolytes and carboxylated polyalkyleneimines
01/09/2007US7160625 Dielectric layers comprising silicon compounds such as tert-butyltrimethoxysilane, formed by chemical vapor deposition, used in electrical and electronic apparatus
01/09/2007US7160613 Stabilized semiconductor nanocrystals
01/09/2007US7160482 Composition comprising an oxidizing and complexing compound
01/09/2007US7160475 Fabrication of three dimensional structures
01/09/2007US7160432 Method and composition for polishing a substrate
01/09/2007US7160428 Plating tank for wire patterns on film carrier; prevent bubble adhesion
01/09/2007US7160417 Cassette for a load-lock
01/09/2007US7160416 Substrate treating apparatus
01/09/2007US7160410 Method of transferring a substantially disc-shaped workpiece, and device for carrying out this method
01/09/2007US7160406 Sintering a stack of layers containing an unsintered ceramic material and a sintering agent with a forcing layer on the top layer; one of the layers contains an increased proportion of sintering agent relative to an adjacent layer; after sintering the forcing layer is removed
01/09/2007US7160393 Vacuum chamber assembly
01/09/2007US7160392 Method for dechucking a substrate
01/09/2007US7160385 Silicon wafer and method for manufacturing the same
01/09/2007US7160267 Blood drawing device with flash detection
01/09/2007US7160181 Polishing pad of CMP equipment for polishing a semiconductor wafer
01/09/2007US7160180 Substrate delivery mechanism
01/09/2007US7160176 Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
01/09/2007US7160105 Temperature controlled vacuum chuck
01/09/2007US7159969 Composite ink jet printhead and relative manufacturing process
01/09/2007US7159752 Continuous mode solder jet apparatus
01/09/2007US7159751 Wire bonder
01/09/2007US7159719 Thermophoretic protection of reticles
01/09/2007US7159599 Method and apparatus for processing a wafer
01/09/2007US7159537 Device for fixing a gas showerhead or target plate to an electrode in plasma processing systems
01/09/2007US7159459 Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor
01/09/2007US7159418 Method of producing synthetic quartz glass
01/09/2007US7159311 Method of making an interposer with contact structures
01/09/2007US7159310 Electronic part mounting substrate and method for producing same
01/09/2007US7159309 Method of mounting electronic component on substrate without generation of voids in bonding material
01/09/2007CA2421641C Method of retrofitting a probe station
01/09/2007CA2385468C Integrated circuit plating using highly-complexed copper plating baths
01/09/2007CA2368320C Instrument for measuring physical property of sample
01/04/2007WO2007002956A1 Composite metal layer formed using metal nanocrystalline particles in an electroplating bath
01/04/2007WO2007002925A1 Fabrication of aligned nanowire lattices
01/04/2007WO2007002915A2 Slurry for chemical mechanical polishing of aluminum
01/04/2007WO2007002870A1 Method of forming through-silicon vias with stress buffer collars and resulting devices
01/04/2007WO2007002860A1 Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
01/04/2007WO2007002858A2 High voltage depletion fet employing a channel stopping implant
01/04/2007WO2007002857A2 Structures and methods for forming shielded gate field effect transistors
01/04/2007WO2007002856A2 Software sequencer to dynamically adjust wafer transfer decision
01/04/2007WO2007002760A2 Top-surface-mount power light emitter with integral heat sink
01/04/2007WO2007002695A2 Layout modification to eliminate line bending caused by line material shrinkage
01/04/2007WO2007002674A2 Unsymmetrical ligand sources, reduced symmetry metal-containing compounds, and systems and methods including same
01/04/2007WO2007002672A2 Atomic layer deposition using alkaline earth metal beta-diketiminate precursors
01/04/2007WO2007002547A2 Through-wafer vias and surface metallization for coupling thereto
01/04/2007WO2007002539A2 Nanoparticles and method of making thereof
01/04/2007WO2007002427A1 Complementary metal oxide semiconductor integrated circuit using raised source drain and replacement metal gate
01/04/2007WO2007002426A2 Semiconductor device structures and methods of forming semiconductor structures
01/04/2007WO2007002376A2 Method of preparing electrode
01/04/2007WO2007002244A2 High temperature packaging for electronic components, modules and assemblies
01/04/2007WO2007002215A2 Methods for forming a transistor and modulating channel stress
01/04/2007WO2007002140A2 A cold-walled vessel process for compounding, homogenizing and consolidating semiconductor compounds
01/04/2007WO2007002130A2 Replacement gate field effect transistor with germanium or sige channel and manufacturing method for same using gas-cluster ion irradiation
01/04/2007WO2007002117A2 Trench isolation transistor with grounded gate for a 4.5f2 dram cell and manufacturing method thereof
01/04/2007WO2007002043A1 Semiconductor device including shallow trench isolation (sti) regions with a superlattice therebetween and associated methods
01/04/2007WO2007002040A2 Method for forming silicon-containing materials during a photoexcitation deposition process
01/04/2007WO2007002028A2 Layer growth using metal film and/or islands
01/04/2007WO2007002024A2 Algainn-based lasers produced using etched facet technology
01/04/2007WO2007001988A2 Structure and method for forming laterally extending dielectric layer in a trench-gate fet
01/04/2007WO2007001878A2 Gapfill using deposition-etch sequence
01/04/2007WO2007001874A2 Pore reducing technology for concrete
01/04/2007WO2007001865A2 Plasma confinement rings including rf absorbing material for reducing polymer deposition
01/04/2007WO2007001856A2 Substrate contact for a capped mems and method of making the substrate contact at the wafer level
01/04/2007WO2007001854A2 Chemical die singulation technique
01/04/2007WO2007001853A2 Method of forming stacked capacitor dram cells
01/04/2007WO2007001838A2 Methods and apparatus for igniting a low pressure plasma
01/04/2007WO2007001832A1 Plasma treatment of dielectric material
01/04/2007WO2007001783A2 Mim capacitor in a semiconductor device and method therefor
01/04/2007WO2007001782A2 Tunable antifuse element and method of manufacture
01/04/2007WO2007001722A1 Semiconductor processing methods, and semiconductor constructions
01/04/2007WO2007001713A2 Ultra dense non-volatile memory array
01/04/2007WO2007001712A1 Ion implanting methods
01/04/2007WO2007001709A2 Improved manufacturing method for two-step post nitridation annealing of plasma nitrided gate dielectric
01/04/2007WO2007001699A1 Tranparent microporous materials for cmp
01/04/2007WO2007001672A2 Growth of heterojunction bipolar trasistor stacks by remote injection
01/04/2007WO2007001647A1 Multiple mask process with etch mask stack
01/04/2007WO2007001617A2 Method of making a substrate con tact for a capped mems
01/04/2007WO2007001598A2 Lead-free semiconductor package
01/04/2007WO2007001347A2 Apparatus and method for nano-scale electric discharge machining
01/04/2007WO2007001313A1 A method and apparatus for process control in time division multiplexed (tdm) etch processes
01/04/2007WO2007001299A1 Method for producing dislocation-free strained crystalline films
01/04/2007WO2007001297A1 Method for fabricating shallow trenches
01/04/2007WO2007001296A2 Method for chemical vapor deposition in high aspect ratio spaces
01/04/2007WO2007001281A1 Apparatus and process for treating dielectric materials
01/04/2007WO2007001260A1 Test cells for semiconductor yield improvement
01/04/2007WO2007001179A2 Method and device for supplying and discharging carriers with electronic components
01/04/2007WO2007001163A1 Lower electrode assembly of plasma processing apparatus
01/04/2007WO2007001162A1 Door assembly adapted to the reversed atmospheric pressure
01/04/2007WO2007001100A1 Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system
01/04/2007WO2007001045A1 Exposure apparatus, substrate processing method, and device producing method
01/04/2007WO2007001022A1 Method and apparatus for forming metal film