Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2007
01/04/2007WO2007001017A1 Reflective member, optical member, interferometer system, stage device, exposure device, and device manufacturing method
01/04/2007WO2007000995A1 Exposure apparatus and method, and device manufacturing method
01/04/2007WO2007000984A1 Exposure method, exposure device, and device manufacturing method
01/04/2007WO2007000916A1 Semiconductor integrated circuit device
01/04/2007WO2007000914A1 Conveying equipment of article to be processed
01/04/2007WO2007000885A1 Permanent patterning method
01/04/2007WO2007000852A1 Abrasive and process for producing semiconductor integrated-circuit unit
01/04/2007WO2007000838A1 Semiconductor device having lifetime control region
01/04/2007WO2007000824A1 Reaction chamber for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus
01/04/2007WO2007000823A1 Semiconductor device and production method therefor
01/04/2007WO2007000808A1 Semiconductor device and fabrication method thereof
01/04/2007WO2007000799A1 Contactor, contact structure with the contactor, probe card, testing device, contact structure producing method, and contact structure producing apparatus
01/04/2007WO2007000718A2 Doping profile improvement of in-situ doped n-type emitters
01/04/2007WO2007000704A1 Apparatus and method for maintaining a near-atmospheric pressure inside a process chamber
01/04/2007WO2007000695A2 Package, subassembly and methods of manufacturing thereof
01/04/2007WO2007000693A2 Semiconductor device and method of manufacturing such a device
01/04/2007WO2007000683A2 Bipolar transistor and method op manufacturing the same
01/04/2007WO2007000407A2 Method and device for producing self-adhesive rfid transponders
01/04/2007WO2006121600A3 Process and composition for conductive material removal by electrochemical mechanical polishing
01/04/2007WO2006101638A3 Printed circuit patterned embedded capacitance layer
01/04/2007WO2006093707A3 Single step, high temperature nucleation process for a lattice mismatched substrate
01/04/2007WO2006084028A3 Interdiffusion bonded stacked die device
01/04/2007WO2006060758A3 Methods of exposure for the purpose of thermal management for imprint lithography processes
01/04/2007WO2006004989A3 Methof for etching microchannel networks within liquid crystal polymer substrates
01/04/2007WO2005106958A3 Integrated getter for vacuum or inert gas packaged leds
01/04/2007WO2005105356A3 Electrochemical mechanical planarization process and apparatus
01/04/2007US20070006110 Net list conversion method, net list conversion device, still-state leak current detection method, and still-state leak current detection device
01/04/2007US20070005280 Such as (6,7-dimethoxyquinazolin-4-yl)-(3-ethynylphenyl)-amine for treatment of hyperproliferative diseases
01/04/2007US20070004931 Precursors for depositing silicon containing films
01/04/2007US20070004324 Polishing apparatus
01/04/2007US20070004316 Integrated system for processing semiconductor wafers
01/04/2007US20070004234 Fluids for immersion lithography systems
01/04/2007US20070004233 Manufacturing method of semiconductor device
01/04/2007US20070004231 Method for controlling structure of nano-scale substance, and method for preparing low dimensional quantum structure having nano-scale using the method for controlling structure
01/04/2007US20070004230 Post polish anneal of atomic layer deposition barrier layers
01/04/2007US20070004229 Lamination of organic semiconductors
01/04/2007US20070004228 Polyamide acid-containing composition for forming antireflective film
01/04/2007US20070004227 Semiconductor processing methods
01/04/2007US20070004226 Strain control of epitaxial oxide films using virtual substrates
01/04/2007US20070004225 Low-temperature catalyzed formation of segmented nanowire of dielectric material
01/04/2007US20070004224 Methods for forming dielectrics and metal electrodes
01/04/2007US20070004223 In-line processing for forming a silicon nitride film
01/04/2007US20070004222 Fabrication of aligned nanowire lattices
01/04/2007US20070004221 Methods for forming material layers with substantially planar surfaces on semiconductor device structures
01/04/2007US20070004220 Method for manufacturing flat substrates
01/04/2007US20070004219 Semiconductor device fabrication methods employing substantially planar buffer material layers to improve the planarity of subsequent planarazation processes
01/04/2007US20070004218 Method of cleaning a semiconductor device and method of manufacturing a semiconductor device using the same
01/04/2007US20070004217 System and method for critical dimension reduction and pitch reduction
01/04/2007US20070004216 Formation of assemblies with a diamond heat spreader
01/04/2007US20070004215 Dry etching methods
01/04/2007US20070004214 Technique for reducing etch damage during the formation of vias and trenches in interlayer dielectrics
01/04/2007US20070004213 Method for fabricating semiconductor device with gate
01/04/2007US20070004212 Method for manufacturing a semiconductor substrate and method for manufacturing a semiconductor device
01/04/2007US20070004211 Methods of fabricating a semiconductor substrate for reducing wafer warpage
01/04/2007US20070004210 Polishing composition and polishing method
01/04/2007US20070004209 Slurry for chemical mechanical polishing of aluminum
01/04/2007US20070004208 Plasma etching apparatus and plasma etching method
01/04/2007US20070004207 Full backside etching for pressure sensing silicon
01/04/2007US20070004206 Improved hdp-based ild capping layer
01/04/2007US20070004205 Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure
01/04/2007US20070004204 Method for forming insulation film
01/04/2007US20070004203 Technique for forming nickel silicide by depositing nickel from a gaseous precursor
01/04/2007US20070004202 Semiconductor device and manufacturing method of the same
01/04/2007US20070004201 Process for electroless copper deposition
01/04/2007US20070004200 Selective activation of aluminum, copper, and tungsten structures
01/04/2007US20070004199 Method of making a contact structure
01/04/2007US20070004198 Shielded capacitor structure
01/04/2007US20070004197 Methods for creating electrophoretically insulated vias in semiconductive substrates
01/04/2007US20070004196 Method for forming storage node contact in semiconductor device using nitride-based hard mask
01/04/2007US20070004195 Plate-type fluorescent lamp and display device having the same
01/04/2007US20070004194 Method for fabricating semiconductor device with deep opening
01/04/2007US20070004193 Method for reworking low-k dual damascene photo resist
01/04/2007US20070004192 Metal interconnection of a semiconductor device and method of fabricating the same
01/04/2007US20070004191 Novel techniques for precision pattern transfer of carbon nanotubes from photo mask to wafers
01/04/2007US20070004190 Multi-step etch for metal bump formation
01/04/2007US20070004189 Manufacturing method of semiconductor device
01/04/2007US20070004188 Method for fabricating semiconductor device
01/04/2007US20070004187 Method of forming self-aligned contacts and local interconnects
01/04/2007US20070004186 Film forming method
01/04/2007US20070004185 Methods of Fabricating Crystalline Silicon Film and Thin Film Transistors
01/04/2007US20070004184 Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same
01/04/2007US20070004183 Two-phase thermal method for preparation of cadmium sulfide quantum dots
01/04/2007US20070004182 Methods and system for inhibiting immersion lithography defect formation
01/04/2007US20070004181 Method for fabricating semiconductor device
01/04/2007US20070004180 Manufacturing method of semiconductor integrated circuit device
01/04/2007US20070004179 Wafer dividing method
01/04/2007US20070004178 Manufacturing method of semiconductor device
01/04/2007US20070004177 Wafer processing method
01/04/2007US20070004176 Thin film splitting method
01/04/2007US20070004175 Semiconductor wafer cutting blade and method
01/04/2007US20070004174 Semiconductor wafer sawing system and method
01/04/2007US20070004173 Semiconductor wafers including one or more reinforcement structures and methods of forming the same
01/04/2007US20070004172 Method of thinning a wafer
01/04/2007US20070004171 Method of supporting microelectronic wafer during backside processing using carrier having radiation absorbing film thereon
01/04/2007US20070004170 Method of manufacturing semiconductor device
01/04/2007US20070004169 Method for manufacturing semiconductor substrate
01/04/2007US20070004168 Device for the transmission of data and portable electronic unit and field unit for such a device
01/04/2007US20070004167 Method of manufacturing semiconductor device
01/04/2007US20070004166 Method for fabricating capacitor of semiconductor device
01/04/2007US20070004165 Embedded thin layer capacitor, layered structure, and fabrication method of the same