Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/26/2014CN103681674A Three-dimensional printed memory
03/26/2014CN103681673A Semiconductor device and semiconductor device manufacturing method
03/26/2014CN103681672A Semiconductor device and method of fabricating the same
03/26/2014CN103681671A Semiconductor device having tungsten gate electrode and method for fabricating the same
03/26/2014CN103681670A Metal gate structure of a semiconductor device
03/26/2014CN103681669A Common drain power clip for battery pack protection MOSFET
03/26/2014CN103681667A Semiconductor device and method of manufacturing the same
03/26/2014CN103681664A Power semiconductor device and method of manufacturing power semiconductor device
03/26/2014CN103681662A Semi-conductor structure, as well as manufacture method and operation method
03/26/2014CN103681661A Scribe lines in wafers
03/26/2014CN103681659A Array substrate, production method and display device
03/26/2014CN103681658A Bidirectional heterojunction compound semiconductor protection devices and methods of forming the same
03/26/2014CN103681657A Heterojunction compound semiconductor protection clamps and methods of forming the same
03/26/2014CN103681656A Diffusion resistor with reduced voltage coefficient of resistance and increased breakdown voltage using CMOS wells
03/26/2014CN103681648A Electrical circuit and method for producing electrical circuit
03/26/2014CN103681647A Packaging structure and manufacturing method thereof
03/26/2014CN103681646A Stacked semiconductor devices and method of making same
03/26/2014CN103681645A Three-dimensional semiconductor package device having enhanced security
03/26/2014CN103681640A Laminated semiconductor device and method for manufacturing same
03/26/2014CN103681639A A system-level packaging structure and a packaging method thereof
03/26/2014CN103681635A Semiconductor devices with impedance matching-circuit, and method of manufacture thereof
03/26/2014CN103681633A Magnetic core and forming method thereof, and integrated circuit, substrate, transformer and inductor including the magnetic core
03/26/2014CN103681627A Radio-frequency device package and method for fabricating same
03/26/2014CN103681625A Electronic module and manufacturing method thereof
03/26/2014CN103681623A Semiconductor apparatus and test method thereof
03/26/2014CN103681621A Semiconductor detection structure and formation method
03/26/2014CN103681619A Silicon substrate air-impermeability sealing structure and manufacturing method thereof
03/26/2014CN103681618A Functional glass handler wafer with through vias
03/26/2014CN103681617A Semiconductor device, communication device, and semiconductor package
03/26/2014CN103681616A Semiconductor device and method of manufacturing the same
03/26/2014CN103681615A Interconnection structure and method of forming same
03/26/2014CN103681614A Bump structure and method of forming same
03/26/2014CN103681613A Semiconductor device with discrete blocks
03/26/2014CN103681612A Seed layer structure and method
03/26/2014CN103681610A Chip laminated structure and manufacture method thereof
03/26/2014CN103681609A An integrated circuit, a chip package and a method for manufacturing an integrated circuit
03/26/2014CN103681608A Aluminum interconnection apparatus
03/26/2014CN103681607A Semiconductor device and method of manufacturing semiconductor device
03/26/2014CN103681606A Three dimensional (3D) fan-out packaging mechanisms
03/26/2014CN103681605A A packaging structure of a low-k chip and a manufacturing method thereof
03/26/2014CN103681604A Semi-conductor device with self-aligning contact holes and manufacture method of semi-conductor device
03/26/2014CN103681603A Metal-via fuse
03/26/2014CN103681602A Semiconductor devices using air spaces to separate conductive structures and methods of manufacturing the same
03/26/2014CN103681600A Integrated circuit device, semiconductor device, and method of manufacturing integrated circuit device and semiconductor device
03/26/2014CN103681599A Semiconductor device having buried bit lines and method for fabricating the same
03/26/2014CN103681598A 集成层积磁性器件及其制造方法 Magnetic plot device and manufacturing method integration layer
03/26/2014CN103681597A Interconnect structure and method
03/26/2014CN103681596A Semiconductor structure and manufacture method thereof
03/26/2014CN103681594A Structure for achieving perpendicular interconnection among three-dimensional layers by utilization of flexible substrate and manufacturing method thereof
03/26/2014CN103681593A Leadless ceramic chip carrier packaging structure and process for manufacturing same
03/26/2014CN103681592A Lateral element isolation device
03/26/2014CN103681590A Metal bump and method of manufacturing same
03/26/2014CN103681589A Semiconductor device, method for manufacturing semiconductor device, and electronic device
03/26/2014CN103681588A Package substrate and method of fabricating the same
03/26/2014CN103681587A Stress reduction apparatus
03/26/2014CN103681586A Coreless package substrate and manufacturing method thereof
03/26/2014CN103681585A Lead frame, QFN (Quad Flat No Lead) packaging body, and method for forming QFN packaging body
03/26/2014CN103681583A One-time eroding-before-plating metal frame subtraction embedded chip normally-arranged flat foot structure and technological method
03/26/2014CN103681582A One-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure and technological method
03/26/2014CN103681581A One-time etched-before-plated metal frame subtraction embedded chip inverted flat pin structure and technological method thereof
03/26/2014CN103681580A One-time eroding-before-plating metal frame subtraction embedded chip inversely-arranged salient point structure and technological method
03/26/2014CN103681579A Secondary first-corrosion-then-plating metal frame subtraction burying chip obverse-mounting flat foot structure and technology method
03/26/2014CN103681578A Frame based flat packaging part adopting pin optimization technology, and manufacturing process thereof
03/26/2014CN103681577A Resin-encapsulated semiconductor device and method of manufacturing the same
03/26/2014CN103681576A Semiconductor package device having passive energy components
03/26/2014CN103681575A Wireless multichip module and method for manufacturing integrated circuit to enable flip-chip to be assembled in multichip module
03/26/2014CN103681574A Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
03/26/2014CN103681573A Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure
03/26/2014CN103681571A Semiconductor memory card and method of manufacturing same
03/26/2014CN103681570A Bonding wire for packaging and preparing method of bonding wire
03/26/2014CN103681568A Silver alloy wire for bonding applications
03/26/2014CN103681565A Semiconductor package substrates having pillars and related methods
03/26/2014CN103681564A Electronic device and method of fabricating an electronic device
03/26/2014CN103681562A Ladder bump structures and methods of making same
03/26/2014CN103681561A Passive devices in package-on-package structures and methods for forming the same
03/26/2014CN103681559A Chip packaging basal plate and preparation method thereof
03/26/2014CN103681557A Semiconductor device and assembly method thereof
03/26/2014CN103681556A Bump structures, electrical connection structures, and methods of forming the same
03/26/2014CN103681555A Structure to increase resistance to electromigration
03/26/2014CN103681553A Wafer level chip scale package
03/26/2014CN103681552A Semiconductor power module and method for manufacturing the same
03/26/2014CN103681550A Semiconductor device and fabricating method thereof
03/26/2014CN103681549A Through via structure and method
03/26/2014CN103681544A Hybrid thermal interface material for IC packages with integrated heat spreader
03/26/2014CN103681543A Matrix lid heatspreader for flip chip package
03/26/2014CN103681542A Chip package and a method for manufacturing a chip package
03/26/2014CN103681541A Wafer Level Embedded Heat Spreader
03/26/2014CN103681540A Power semiconductor device and method of manufacturing the same
03/26/2014CN103681539A Packaging structure and packaging method of integrated common mode choke
03/26/2014CN103681538A Semiconductor chip, method for producing semiconductor chip and method for soldering semiconductor chip to carrier
03/26/2014CN103681537A Chip package and method for forming the same
03/26/2014CN103681536A Semiconductor device and manufacturing method thereof
03/26/2014CN103681535A Wafer level packaging element with thick bottom pedestal and making method thereof
03/26/2014CN103681534A Wafer level package structure and manufacturing method of the same
03/26/2014CN103681533A Fan-out package comprising bulk metal
03/26/2014CN103681532A Semiconductor package and fabrication method thereof
03/26/2014CN103681531A Integrated circuits and method for manufacturing integrated circuit
03/26/2014CN103681530A Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device
03/26/2014CN103681529A Semiconductor device and manufacturing method of semiconductor device
03/26/2014CN103681528A Semiconductor package, method of fabricating the semiconductor package, and interposer structure of the semiconductor package
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