Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/01/2014US8685796 Electronic device and method of manufacturing the same
04/01/2014US8685794 Lead frame land grid array with routing connector trace under unit
04/01/2014US8685791 Ribbon bonding in an electronic package
04/01/2014US8685790 Semiconductor device package having backside contact and method for manufacturing
04/01/2014US8685789 Ribbon bonding in an electronic package
04/01/2014US8685788 Nanowire tunneling field effect transistor with vertical structure and a manufacturing method thereof
04/01/2014US8685787 Manufacturing method of semiconductor device
04/01/2014US8685785 Planar phase-change memory cell with parallel electrical paths
04/01/2014US8685783 Phase change memory cell
04/01/2014US8685781 Secondary treatment of films of colloidal quantum dots for optoelectronics and devices produced thereby
04/01/2014US8685780 Method for manufacturing flexible organic thin film solar cell by ion beam treatment and solar cell manufactured by the same
04/01/2014US8685777 Method for fabricating a fixed structure defining a volume receiving a movable element in particular of a MEMS
04/01/2014US8685774 Method for fabricating three-dimensional gallium nitride structures with planar surfaces
04/01/2014US8685773 Method for making semiconductor epitaxial structure
04/01/2014US8685771 Optimized process for fabricating light-emitting devices using artificial materials
04/01/2014US8685770 Thin film transistor array panel and method for manufacturing the same
04/01/2014US8685769 Microchip charge patterning
04/01/2014US8685768 Organic light emitting diodes and methods of manufacturing the same
04/01/2014US8685766 Solid element device and method for manufacturing the same
04/01/2014US8685763 Method of manufacturing nozzle plate
04/01/2014US8685762 Light emitting device and display
04/01/2014US8685761 Method for making a redistributed electronic device using a transferrable redistribution layer
04/01/2014US8685759 E-chuck with automated clamped force adjustment and calibration
04/01/2014US8685758 Thermoelectric conversion module and method of restoring the same
04/01/2014US8685757 Method for fabricating magnetic tunnel junction
04/01/2014US8685756 Method for manufacturing and magnetic devices having double tunnel barriers
04/01/2014US8685627 Method for manufacturing a semiconductor device
04/01/2014US8685347 Penetrable cap
04/01/2014US8685306 Molding apparatus and molding method
04/01/2014US8685291 Variable resistance materials with superior data retention characteristics
04/01/2014US8685272 Composition for etching silicon oxide layer, method for etching semiconductor device using the same, and composition for etching semiconductor device
04/01/2014US8685270 Method for producing a semiconductor wafer
04/01/2014US8685266 Monocyclic high aspect ratio titanium inductively coupled plasma deep etching processes and products so produced
04/01/2014US8685265 Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
04/01/2014US8685221 Enhanced electrochemical deposition filling
04/01/2014US8684749 LED with improved injection efficiency
04/01/2014US8684718 Compression molding method for electronic component and compression molding apparatus employed therefor
04/01/2014US8684650 Methods for introduction of a reactive material into a vacuum chamber
04/01/2014US8683943 Plasma process apparatus and plasma process method
04/01/2014US8683847 Microelectromechanical systems type semiconductor gas sensor using microheater having many holes and method for manufacturing the same
04/01/2014CA2554645C Method and device for thermally treating substrates
03/2014
03/27/2014WO2014047590A1 Electrode structure for a non-volatile memory device and method
03/27/2014WO2014047471A1 Extremely thin package
03/27/2014WO2014047258A1 Semiconductor device and method with greater epitaxial growth on 110 crystal plane
03/27/2014WO2014047203A1 Pulse width controller
03/27/2014WO2014046981A1 Micro device stabilization post
03/27/2014WO2014046896A1 Chemical control features in wafer process equipment
03/27/2014WO2014046864A1 Radical chemistry modulation and control using multiple flow pathways
03/27/2014WO2014046858A1 Silicon-carbon-nitride selective etch
03/27/2014WO2014046856A1 Gate contact structure over active gate and method to fabricate same
03/27/2014WO2014046845A1 Radical-component oxide etch
03/27/2014WO2014046840A1 Methods for bonding substrates
03/27/2014WO2014046774A1 System and method for 2d workpiece alignment
03/27/2014WO2014046755A1 Precision resistor for non-planar semiconductor device architecture
03/27/2014WO2014046661A1 Nozzle arrays
03/27/2014WO2014046476A1 Fume removal device and substrate treatment device
03/27/2014WO2014046455A1 Effusion cell having source residue discharge type shutter and evaporation equipment comprising same
03/27/2014WO2014046448A1 Apparatus for treating wafer, comprising wafer purging cassette for removing process gas remaining on wafer
03/27/2014WO2014046407A1 Method of manufacturing horizontally aligned single crystalline inorganic nanowire patterns
03/27/2014WO2014046361A1 Magnetic memory element using in-plane current and electric field
03/27/2014WO2014046360A1 Horizontal magnetic memory element using in-plane current and electric field
03/27/2014WO2014046323A1 Package module and manufacturing method thereof
03/27/2014WO2014046304A1 Photocurable composition and method of manufacturing film using the composition
03/27/2014WO2014046242A1 Temperature gauge, substrate treatment device, temperature control method, and method for manufacturing semiconductor device
03/27/2014WO2014046241A1 Substrate treatment system
03/27/2014WO2014046229A1 Cleaning method and cleaning device
03/27/2014WO2014046222A1 Display device
03/27/2014WO2014046220A1 Semiconductor device
03/27/2014WO2014046210A1 Partial hydrolysis-condensation product and ink repellent agent using same
03/27/2014WO2014046209A1 Ink-repellent composition, negative photosensitive resin composition, hardened film, partition wall, and optical element
03/27/2014WO2014046193A1 Organocopper complex, organocopper complex solution, copper oxide thin film, method for producing copper oxide thin film, and compound
03/27/2014WO2014046150A1 Photocurable composition and method of manufacturing film using the composition
03/27/2014WO2014046128A1 Adhesive for electronic components and method for producing semiconductor chip mounter
03/27/2014WO2014046121A1 Laser dicing sheet / peeling sheet laminate, laser dicing sheet, and chip manufacturing method
03/27/2014WO2014046097A1 Photoresist composition, method for forming resist pattern, and acid generator
03/27/2014WO2014046096A1 Back grinding sheet
03/27/2014WO2014046093A1 Anisotropic conductive adhesive
03/27/2014WO2014046089A1 Method for producing connection structure and anisotropic conductive adhesive
03/27/2014WO2014046088A1 Anisotropic conductive adhesive and connection structure
03/27/2014WO2014046083A1 Plasma etching method and plasma etching device
03/27/2014WO2014046081A1 Substrate processing device and manufacturing method for semiconductor device
03/27/2014WO2014046073A1 Silicon carbide semiconductor device and fabrication method for same
03/27/2014WO2014046068A1 Active matrix substrate, display device, and production method therefor
03/27/2014WO2014046061A1 Semiconductor device and power conversion apparatus using same
03/27/2014WO2014046055A1 Silicon-containing resist underlayer film-forming composition which contains cyclic organic group having heteroatom
03/27/2014WO2014046052A1 Chip support substrate, method for supporting chip, three-dimensional integrated circuit, assembly device, and method for manufacturing three-dimensional integrated circuit
03/27/2014WO2014046044A1 Substrate-case cleaning device
03/27/2014WO2014046043A1 Substrate-case cleaning device
03/27/2014WO2014046042A1 Substrate-case cleaning device
03/27/2014WO2014046041A1 Substrate-case cleaning device
03/27/2014WO2014046031A1 Semiconductor device and display device
03/27/2014WO2014045993A1 Semiconductor device, semiconductor wafer, and semiconductor-wafer testing method
03/27/2014WO2014045989A1 Semiconductor wafer, semiconductor device, and method for manufacturing semiconductor device
03/27/2014WO2014045939A1 Method for producing polishing material particles
03/27/2014WO2014045938A1 Gas supply method and plasma processing device
03/27/2014WO2014045937A1 Polishing composition
03/27/2014WO2014045885A1 Dust removal device and dust removal method for exposure device
03/27/2014WO2014045828A1 Method for producing semiconductor device and device for producing semiconductor
03/27/2014WO2014045803A1 Bonding system, bonding method, and computer storage medium
03/27/2014WO2014045779A1 Vapor phase growth device and method for manufacturing epitaxial wafer
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