Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/02/2014CN102646630B TFT-LCD (thin film transistor liquid crystal display) array substrate structure and manufacturing method thereof
04/02/2014CN102646629B Array substrate and manufacturing method thereof
04/02/2014CN102629593B Flexible electronic device and manufacturing method thereof
04/02/2014CN102629582B Method for manufacturing TFT array substrate, TFT array substrate and display device
04/02/2014CN102610635B High-density graded field limiting ring structure and manufacturing process thereof
04/02/2014CN102610629B Semiconductor structure
04/02/2014CN102610573B Method for improving readout redundancy of static random access memory
04/02/2014CN102592976B P-type heavily-doped silicon carbide film extension preparation method
04/02/2014CN102592973B Transfer method of large area graphene
04/02/2014CN102573329B Method for fabricating conductive column of circuit board, system and circuit board
04/02/2014CN102543879B Method for manufacturing gate-last one-transistor dynamic random access memory
04/02/2014CN102543846B Surface treatment method for strengthening aluminum process metal layer and light resistance adhesive force
04/02/2014CN102543776B Method for forming redistribution of welding pad
04/02/2014CN102543704B Forming method of grid oxide layer
04/02/2014CN102543699B Method for forming metal gate
04/02/2014CN102496579B Method for realizing electrical insulation on adapter plate
04/02/2014CN102487033B Method for forming standard SOI (Silicon On Insulator) structure
04/02/2014CN102484096B Selective nanotube growth inside vias using an ion beam
04/02/2014CN102479730B Method for monitoring concentrations of doped impurities of doped epitaxial layer
04/02/2014CN102479715B Forming method of semiconductor device
04/02/2014CN102479706B Transistor and manufacturing method thereof
04/02/2014CN102460126B Material or device characterisation with non-homogeneous photoexcitation
04/02/2014CN102456703B Organic light-emitting display equipment and manufacturing method thereof
04/02/2014CN102446894B High-performance metal-oxide-metal capacitor and manufacturing method thereof
04/02/2014CN102446862B Novel double-bit line SONOS (silicon oxide nitride oxide silicon) unit structure and manufacturing method thereof
04/02/2014CN102446859B Method for making floating dynamic random access memory unit capable of increasing writing speed
04/02/2014CN102446764B MOS (Metal Oxide Semiconductor) transistor and manufacturing method thereof
04/02/2014CN102437176B Process for increasing capacitance density of integrated circuit
04/02/2014CN102420139B MOS (Metal Oxide Semiconductor) transistor and production method thereof
04/02/2014CN102420124B Etching method of dielectric layer
04/02/2014CN102414821B SOI wafer inspection method
04/02/2014CN102412228B Coaxial through-silicon via interconnected structure and fabrication method thereof
04/02/2014CN102412199B Thin-film circuit device and electronic apparatus
04/02/2014CN102396057B Method for producing a connection between a semiconductor component and semiconductor module resistant to high temperatures and temperature changes by means of a temperature impinging process
04/02/2014CN102385207B Thin film transistor array substrate and making method thereof
04/02/2014CN102379029B Grounded confinement ring having large surface area
04/02/2014CN102376636B Method for forming contact hole
04/02/2014CN102365721B Method for forming a high-k gate stack with reduced effective oxide thickness
04/02/2014CN102326241B Method for manufacturing semiconductor device, and bonding apparatus
04/02/2014CN102318054B A method for fabricating thin touch sensor panels
04/02/2014CN102318039B Method for manufacturing gallium nitride compound semiconductor, and semiconductor light emitting element
04/02/2014CN102299088B Insertion piece for testing separator and device for operating the insertion piece
04/02/2014CN102299053B Semiconductor device and manufacturing method thereof
04/02/2014CN102299051B Method and device for drying micro-electronic part
04/02/2014CN102292812B Semiconductor structure, an integrated circuit including a semiconductor structure and a method for manufacturing a semiconductor structure
04/02/2014CN102290425B Method of fabricating semiconductor device having three-dimensional stacked structure
04/02/2014CN102265389B Bonding method
04/02/2014CN102254847B Plamsa processing apparatus
04/02/2014CN102224588B Shielding for integrated capacitors
04/02/2014CN102221761B Silicon-based liquid crystal device and manufacturing method thereof
04/02/2014CN102217044B 等离子体处理装置及等离子体处理方法 Plasma processing apparatus and plasma processing method
04/02/2014CN102206465B Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal
04/02/2014CN102203930B Tactile wafer lifter and methods for operating the same
04/02/2014CN102199399B Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride
04/02/2014CN102197468B Compound semiconductor device and method for manufacturing the same
04/02/2014CN102191063B Liquid composition, method of producing silicon substrate, and method of producing liquid discharge head substrate
04/02/2014CN102165542B Thin film MIM capacitors and manufacturing method therefor
04/02/2014CN102150085B Substrate treating solution and method employing the same for treating a resist substrate
04/02/2014CN102132382B Surface treated aluminum nitride baffle
04/02/2014CN102129967B Nitride semiconductor template and method of manufacturing the same
04/02/2014CN102124414B Photoresist remover composition and method for removing photoresist
04/02/2014CN102104050B Thin film transistor substrate and method for fabricating the same
04/02/2014CN102099907B Work-piece transfer systems and methods
04/02/2014CN102097440B Mother substrate for liquid crystal display and manufacturing method thereof
04/02/2014CN102089868B Improvement of organic line width roughness with H2 plasma treatment
04/02/2014CN102074506B Method for fabricating fin-like field effect transistor
04/02/2014CN102066313B Titanium complex, method for production of the complex, titanium-containing thin film, and method for production of the thin film
04/02/2014CN102047398B Bonded structure and bonding method for bonded structure
04/02/2014CN102044459B Method for detecting nitrogen content of nitrogen-doped oxidation silicon film
04/02/2014CN101981688B Method of manufacturing a semiconductor device and semiconductor device
04/02/2014CN101853812B Image sensor and method of fabricating same
04/02/2014CN101834250B Method for manufacturing light-emitting element
04/02/2014CN101807515B Multi-zone resitive heater
04/02/2014CN101802991B Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate
04/02/2014CN101789392B Semiconductor device and manufacturing method of the same
04/02/2014CN101770936B Resin covering method and resin covering device
04/02/2014CN101764095B Method for processing CMOS chip and instrument
04/02/2014CN101752326B Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
04/02/2014CN101738398B Wafer defect detection system with traveling lens multi-beam scanner
04/02/2014CN101651107B Substrate joining method and 3-d semiconductor device
04/02/2014CN101643150B Substrate floating device
04/02/2014CN101615624B Luminescence display panel and method for fabricating the same
04/02/2014CN101589462B Wafer-level interconnect for high mechanical reliability applications
04/02/2014CN101496149B Raised STI structure and superdamascene technique for NMOSFET performance enhancement with embedded silicon carbon
04/01/2014US8689152 Double-sided integrated circuit chips
04/01/2014US8688261 Transport apparatus, position teaching method, and sensor jig
04/01/2014US8687405 Phase change memory and method for fabricating phase change memory
04/01/2014US8687343 Substrate mounting table of substrate processing apparatus
04/01/2014US8687197 Method of monitoring progress of substrate polishing and polishing apparatus
04/01/2014US8687182 Surface inspection apparatus and surface inspection method
04/01/2014US8687030 Exposing device, method of manufacturing the same, and image forming apparatus
04/01/2014US8686572 Apparatus for stacking integrated circuits
04/01/2014US8686568 Semiconductor package substrates having layered circuit segments, and related methods
04/01/2014US8686566 In situ-built pin-grid arrays for coreless substrates, and methods of making same
04/01/2014US8686565 Stacked chip assembly having vertical vias
04/01/2014US8686556 Wafer level applied thermal heat sink
04/01/2014US8686545 Semiconductor device and method for manufacturing the same
04/01/2014US8686543 3D chip package with shielded structures
04/01/2014US8686541 Semiconductor device including capacitor and contact plug
04/01/2014US8686540 Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure
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