Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/02/2014CN103700682A Light-emitting diode structure and method for manufacturing the same
04/02/2014CN103700679A Protection method of lug generating and manufacture procedure
04/02/2014CN103700674A Array substrate, preparation method thereof and display device
04/02/2014CN103700673A Display device, array base plate and manufacturing methods of display device and array base plate
04/02/2014CN103700672A Flexible assembly substrate and manufacturing method thereof
04/02/2014CN103700670A Array substrate and manufacturing method thereof and display device
04/02/2014CN103700669A Array substrate and preparation method thereof as well as display device
04/02/2014CN103700668A Array substrate and preparation method thereof as well as display device
04/02/2014CN103700667A Pixel array structure and production method thereof as well as array substrate and display device
04/02/2014CN103700665A Metal oxide thin film transistor array substrate and manufacturing method and display method thereof
04/02/2014CN103700664A Array substrate as well as manufacturing method and display device thereof
04/02/2014CN103700663A Array substrate and manufacturing method thereof, and display device
04/02/2014CN103700662A Bearing substrate, and method for manufacturing flexible display device
04/02/2014CN103700660A Whole annular grid CMOS (complementary metal oxide semiconductor) field effect transistor and preparing method
04/02/2014CN103700657A Array substrate as well as manufacturing method and display device thereof
04/02/2014CN103700656A Thick film hybrid circuit structure and manufacturing method
04/02/2014CN103700650A Semiconductor component and method for producing a semiconductor component
04/02/2014CN103700649A Photoetching mark applying epitaxial technology and method thereof
04/02/2014CN103700648A Metal interconnecting structure for high-temperature circuit and preparing method of metal interconnecting structure
04/02/2014CN103700646A System and method of encapsulated multi-metal branch foot structures for advanced back-end-of-line metallization
04/02/2014CN103700645A MOM (metal-oxide-metal) capacitor and manufacturing method thereof
04/02/2014CN103700644A Adapter plate deep-groove capacitor based on TSV (Through Silicon Via) process and manufacturing method thereof
04/02/2014CN103700643A Adapter plate deep groove capacitor on basis of TSV (Through Silicon Via) process and manufacturing method thereof
04/02/2014CN103700641A Steel strip for lead frame and production method thereof
04/02/2014CN103700639A Packaging assembly and manufacturing method thereof
04/02/2014CN103700635A Chip packaging structure with cavity and packaging method thereof
04/02/2014CN103700633A 半导体封装件 Semiconductor package
04/02/2014CN103700632A CMOS (complementary metal oxide semiconductor) transistor as well as production method thereof, display panel and display device
04/02/2014CN103700631A Preparation method for non-junction MOS FET (metal oxide semiconductor field effect transistor) device
04/02/2014CN103700630A Dual work function semiconductor device and method for manufacturing the same
04/02/2014CN103700629A Array base plate and preparation method thereof as well as display device
04/02/2014CN103700628A Manufacturing method of array substrate, array substrate and display device
04/02/2014CN103700627A Production method of array substrate
04/02/2014CN103700626A Production method of array substrate, array substrate and display device
04/02/2014CN103700625A Production method of array substrate, array substrate and display device
04/02/2014CN103700624A Method for manufacturing of organic light emitting display device
04/02/2014CN103700623A Etching method of TaN and forming method of magnetic sensor
04/02/2014CN103700622A Method for forming silicon through hole
04/02/2014CN103700621A Method for etching vertical glass through holes with high depth-to-width ratios
04/02/2014CN103700620A Method for manufacturing metal and n-type semiconductor germanium source drain contact
04/02/2014CN103700619A Copper interconnection electroplating filling method
04/02/2014CN103700618A Wafer level through silicon via process base plate structural strength enhancement-based manufacturing method
04/02/2014CN103700617A High-reliability TSV (Through Silicon Via) technique based on SOI (Silicon-On-Insulator) substrate
04/02/2014CN103700616A System and method of novel MX to MX-2
04/02/2014CN103700615A Xenon difluoride gas-phase etching method for barrier layer
04/02/2014CN103700614A Horizontal fetching and placing system of two-phase solar energy wafer and a fetching and placing method thereof
04/02/2014CN103700613A Vacuum mechanical delivery system
04/02/2014CN103700612A End effector component
04/02/2014CN103700611A Blowing device for residue on surface of chip
04/02/2014CN103700610A Device and method for improving wafer etching uniformity
04/02/2014CN103700609A Wafer selection device
04/02/2014CN103700608A Method and device for generating semiconductor encapsulation unqualified product map
04/02/2014CN103700607A Tooling for reconditioning pin in ceramic column grid array (CCGA)
04/02/2014CN103700606A Substrate processing apparatus
04/02/2014CN103700605A Semiconductor processing station and method for processing semiconductor wafer
04/02/2014CN103700604A Test system for testing acoustic surface wave resonator and test method of test system
04/02/2014CN103700603A Detection method of high resistance of tungsten contact plug
04/02/2014CN103700602A Wafer aligning method for wafer-level testing of image sensor
04/02/2014CN103700601A Calibration method, measuring method and measuring device for measuring thickness of copper films on surfaces of wafers
04/02/2014CN103700600A Thickness measurement device and method for embedded metal film
04/02/2014CN103700599A Correction jig
04/02/2014CN103700598A Method for supporting multiple chip packaging modes
04/02/2014CN103700597A Preparation method for molded interconnection device
04/02/2014CN103700596A Compression mold packaging method and device for reducing bubbles in mold packaging colloid
04/02/2014CN103700595A Wafer level high-aspect-ratio TSV (through silicon via) package substrate preparation method
04/02/2014CN103700594A Method for producing specially-shaped micro-power mode copper alloy band of lead frame
04/02/2014CN103700593A Method for preparing quasi-SOI (silicon on insulator) source drain multi-gate device
04/02/2014CN103700592A Manufacturing method for two-dimensional material field effect transistor based on self-alignment embedded gate structure
04/02/2014CN103700591A Method for manufacturing high-voltage large-power thyristor by adopting sintering process
04/02/2014CN103700590A Manufacture method for realizing bipolar IC (integrated circuit) structure of Schottky diode and bipolar IC structure
04/02/2014CN103700589A Manufacturing method of field termination type insulated gate type bipolar transistor
04/02/2014CN103700588A Method for reducing energy consumption of Low VF (Variable Frequency) kenotron
04/02/2014CN103700587A Process for manufacturing semiconductor devices, such as super-barrier sbr rectifiers
04/02/2014CN103700586A Method for increasing back injection impurity activation rate
04/02/2014CN103700585A Preparation method of shallow trench isolation oxidation layer and device thereof
04/02/2014CN103700584A Surface protecting member and processing method thereof
04/02/2014CN103700583A Manufacturing method of T-shaped gate of GaN-based FET (Field Effect Transistor)
04/02/2014CN103700582A Manufacturing method of germanium nano wire laminated structure
04/02/2014CN103700581A Method for manufacturing metal and n-type semiconductor germanium source drain contact
04/02/2014CN103700580A Method for preparing SiC ohmic contact by ultraviolet pulse laser irradiation device
04/02/2014CN103700579A Method for producing a group iii nitride semiconductor
04/02/2014CN103700578A Manufacturing method of germanium-silicon nano wire laminated structure
04/02/2014CN103700577A Method for manufacturing a semiconductor substrate, and method for manufacturing semiconductor devices integrated in a semiconductor substrate
04/02/2014CN103700576A Preparing method of self-assembly forming-dimension-controllable silicon nanocrystal films
04/02/2014CN103698952A Array substrate and production method thereof
04/02/2014CN103698912A Method for positioning defect sub pixel position
04/02/2014CN103698068A Electrostatic chuck basic performance detection device and detection method thereof
04/02/2014CN103697746A Heat exchanger flow equalizer
04/02/2014CN103693343A Multi-tiered storage stand device
04/02/2014CN103692337A Silicon wafer polishing method for adopting mixed fructose to paste silicon wafers
04/02/2014CN103692293A Stress-free polishing device and polishing method
04/02/2014CN103692105A Device and method of solder cataplasm and semiconductor
04/02/2014CN103691715A Substrate cleaning equipment
04/02/2014CN102796487B Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
04/02/2014CN102738064B Method for fabricating metal redistribution layer
04/02/2014CN102683584B Metal oxide resistance memory integrating a standard complementary metal oxide semiconductor (CMOS) process and preparation method thereof
04/02/2014CN102683289B Method for improving writing redundancy of static random access memory
04/02/2014CN102652119B In-ga-o oxide sintered body, target, oxide semiconductor thin film, and manufacturing methods therefor
04/02/2014CN102650786B Thin film transistor array substrate and manufacturing method and display device thereof
04/02/2014CN102646632B Array substrate, manufacturing method thereof and display device
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