Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/03/2014US20140090982 Edgeless pulse plating and metal cleaning methods for solar cells
04/03/2014US20140090975 Stress-induced bandgap-shifted semiconductor photoelectrolytic/photocatalytic/photovoltaic surface and method for making same
04/03/2014US20140090668 In-Situ Cleaning Assembly
04/03/2014US20140090199 Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipment
04/03/2014US20140090196 Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipment
04/03/2014DE19964481B4 MOS-Halbleiteranordnung mit Schutzeinrichtung unter Verwendung von Zenerdioden MOS semiconductor device with protection device using Zener diodes
04/03/2014DE112012003068T5 Ozongas erzeugendes Verarbeitungsgerät, Verfahren zum Bilden eines Siliziumoxidfilms und Verfahren zum Auswerten eines Silizium-Einkristallwafers Generating ozone gas processing device, method of forming a silicon oxide film and methods for evaluating a silicon single crystal wafer
04/03/2014DE112012002891T5 Verfahren zur Bewertung von Defekten in einem Wafer Procedures for the assessment of defects in a wafer
04/03/2014DE112012002603T5 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
04/03/2014DE112011105448T5 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
04/03/2014DE102013219901A1 Spanntisch Clamping table
04/03/2014DE102013217454A1 XY-Begrenzungseinheit und Tischvorrichtung und Unterdrucktischvorrichtung, die diese enthalten XY-limiting unit and table apparatus and the vacuum table apparatus which contain these
04/03/2014DE102013200684A1 Nicht-flüchtige Speichervorrichtung und Verfahren zur Herstellung derselben Non-volatile memory device and method of manufacturing the same
04/03/2014DE102013110695A1 Bildsensor, Verfahren zum Betreiben desselben und Bildverarbeitungssystem mit demselben Image sensor, and image processing method of the same system with the same to operate
04/03/2014DE102013109590A1 Verfahren zum Bearbeiten eines Wafers und Verfahren zum Zertrennen eines Wafers A method for processing a wafer and method of dicing a wafer
04/03/2014DE102012217957A1 Verfahren zur Herstellung einer Mikro-LED-Matrix, Mikro-LED-Matrix und Verwendung einer Mikro-LED-Matrix A process for producing a micro-LED matrix, micro-LED array and using a micro-LED matrix
04/03/2014DE102012217922A1 Verfahren zum Herstellen einer Lötverbindung und Schaltungsbauteil A method for forming a solder connection and circuit component
04/03/2014DE102012217793A1 Herstellungsverfahren Manufacturing process
04/03/2014DE102012113003A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil A method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
04/03/2014DE102012109236A1 Method for producing optoelectronic component e.g. solar cell, involves editing optical characteristic of functional layer, so that optoelectronic property of optoelectronic component unit is changed to target property
04/03/2014DE102012109228A1 Verfahren zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; A method for determining the permeability of a dielectric layer of an optoelectronic component; Vorrichtung zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; Apparatus for determining the permeability of a dielectric layer of an optoelectronic component; optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes optoelectronic device and method for producing an optoelectronic component
04/03/2014DE102012109207A1 Verfahren und Vorrichtung zum Herstellen eines optoelektronischen Bauelementes Method and apparatus for producing an optoelectronic component
04/03/2014DE102012105708A1 Optoelectronic semiconductor device manufacturing method, involves separating substrate along main extension plane of substrate for producing optoelectronic semiconductor arrangements such that arrangements partially include layer sequences
04/03/2014DE102008051673B4 Verfahren zum gleichzeitigen Auftrennen eines Verbundstabs aus Silicium in eine Vielzahl von Scheiben A method for simultaneously separating a composite rod of silicon into a plurality of slices
04/03/2014DE102008051443B4 Halbleitermodul und Herstellungsverfahren hierfür Semiconductor module, and manufacturing method thereof
04/03/2014DE102008034467B4 Anordnung mit einem Leistungshalbleitermodul und mit einer Verbindungseinrichtung Arrangement with a power semiconductor module and with a connecting device
04/02/2014EP2713391A2 Heat radiating plate and method for producing same
04/02/2014EP2713390A2 System and method of encapsulated multi metal branch foot structures for advanced back-end-of-line metallization
04/02/2014EP2713389A2 System and method of novel MX to MX-2
04/02/2014EP2713388A2 Filament lamp for heating
04/02/2014EP2713387A2 ZnO based compound semiconductor device, and method for producing the same
04/02/2014EP2713386A1 Process for manufacturing semiconductor devices, such as super-barrier sbr rectifiers
04/02/2014EP2713385A1 Active layer ion implantation method and active layer ion implantation method for thin-film transistor
04/02/2014EP2713384A1 Method for forming patterned doping regions
04/02/2014EP2713138A1 Light source and optical coherence tomography apparatus using the same
04/02/2014EP2712466A1 Heterojunction unipolar diode with low turn-on voltage
04/02/2014CN203521423U Insulated gate bipolar transistor
04/02/2014CN203521416U Organic light emitting diode display
04/02/2014CN203521409U Thin film transistor preparation system, thin film transistor and array substrate
04/02/2014CN203521405U Embedded integrated circuit device
04/02/2014CN203521394U Chip packaging structure
04/02/2014CN203521391U Flexible substrate prefabricated assembly
04/02/2014CN203521390U Solar wafer fixing device
04/02/2014CN203521389U Wafer fixing device
04/02/2014CN203521388U Automatic positioning device for SMD support
04/02/2014CN203521387U High-temperature storage rack for packaging components
04/02/2014CN203521386U Silicon wafer accommodating device
04/02/2014CN203521385U Quartz bearing boat
04/02/2014CN203521384U Silicon slice box
04/02/2014CN203521383U Degumming tool
04/02/2014CN203521382U Wafer-bearing box used for cleaning silicon wafer
04/02/2014CN203521381U Ejector mechanism for automatic LED wafer sorter
04/02/2014CN203521380U Thin film molding device
04/02/2014CN203521379U Ultraviolet light and ozone surface cleaning and oxidation modification vacuum equipment
04/02/2014CN203521378U Reballing equipment used in ball grid array structure
04/02/2014CN203521377U Silica-gel chip packaging mould
04/02/2014CN203521376U Air suspension track for stepping system of intelligent card module packaging equipment
04/02/2014CN203513559U Adhesive tape for processing follow-up film and wafer
04/02/2014CN203508487U Blowing device used for cleaning surfaces of wafers
04/02/2014CN103703566A Semiconductor device, and manufacturing method for same
04/02/2014CN103703564A Memory cells and methods of storing information
04/02/2014CN103703560A Semiconductor device and method for producing same
04/02/2014CN103703557A Semiconductor device and method for manufacturing semiconductor device
04/02/2014CN103703556A Semiconductor device and method for producing same
04/02/2014CN103703555A Sensor device
04/02/2014CN103703554A Etching laser-cut semiconductor before dicing die attach film (daf) or other material layer
04/02/2014CN103703553A Improved system for substrate processing
04/02/2014CN103703552A Method of laser separation of the epitaxial film or of the epitaxial film layer from the growth substrate of the epitaxial semiconductor structure (variations)
04/02/2014CN103703551A Method and systems for semiconductor chip pick & transfer and bonding
04/02/2014CN103703550A Heat treatment by injection of a heat-transfer gas
04/02/2014CN103703549A Exposed die package for direct surface mounting
04/02/2014CN103703548A Glass composition for semiconductor junction protection, method for producing semiconductor device, and semiconductor device
04/02/2014CN103703547A Etching method and devices produced using etching method
04/02/2014CN103703546A Wafer dicing using hybrid galvanic laser scribing process with plasma etch
04/02/2014CN103703545A Hybrid laser and plasma etch wafer dicing using substrate carrier
04/02/2014CN103703544A Multi-chamber cvd processing system
04/02/2014CN103703543A Method and apparatus for forming a graphene pattern using a delamination technique
04/02/2014CN103703542A Composite wafer and manufacturing method therefor
04/02/2014CN103703541A Techniques and structures for testing integrated circuits in flip-chip assemblies background
04/02/2014CN103703424A Processing facility
04/02/2014CN103703341A Pattern measurement device and pattern measurement method
04/02/2014CN103703168A Solder-coated ball and method for manufacturing same
04/02/2014CN103703094A Temporary fixing composition
04/02/2014CN103703088A Temporary adhesion of chemically similar substrates
04/02/2014CN103703087A A one-component, dual-cure adhesive for use on electronics
04/02/2014CN103702933A Method for forming silicon oxynitride film, and substrate having silicon oxynitride film produced using this formation method
04/02/2014CN103702798A Polishing head, polishing device, and workpiece polishing method
04/02/2014CN103700724A Diffusion furnace exhaust gas collection device
04/02/2014CN103700723A Method for preparing boron-back-field solar cell
04/02/2014CN103700712A Structure of fast recovery diode (FRD) and manufacturing method thereof
04/02/2014CN103700710A IGZO (indium gallium zinc oxide) thin film transistor and preparing method thereof
04/02/2014CN103700709A Thin film transistor and preparation method thereof, array substrate and display
04/02/2014CN103700708A Thin film transistor and manufacturing method thereof as well as array substrate and display device thereof
04/02/2014CN103700707A Thin-film transistor, thin-film transistor array substrate and preparation method thereof and display device
04/02/2014CN103700706A Thin film transistor, array substrate, respective preparation method thereof and display device
04/02/2014CN103700705A IGZO (Indium Gallium Zinc Oxide) transistor structure, manufacture method and display panel thereof
04/02/2014CN103700700A Compound semiconductor device and method of manufacturing the same
04/02/2014CN103700699A Gate metal structure and manufacturing method thereof
04/02/2014CN103700698A Preparation method of thin film transistor, thin film transistor and display panel
04/02/2014CN103700695A Low-temperature polycrystalline silicon film as well as preparation method thereof and transistor
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