Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/27/2014US20140084463 Method of fabricating semiconductor package structure
03/27/2014US20140084461 Flux materials for heated solder placement and associated techniques and configurations
03/27/2014US20140084460 Contact bumps methods of making contact bumps
03/27/2014US20140084458 Chip package and method for forming the same
03/27/2014US20140084455 Semiconductor package and fabrication method thereof
03/27/2014US20140084454 Direct multiple substrate die assembly
03/27/2014US20140084453 Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package
03/27/2014US20140084450 Processes for multi-layer devices utilizing layer transfer
03/27/2014US20140084449 Semiconductor Housing with Rear-Side Structuring
03/27/2014US20140084445 Thermal Dissipation Through Seal Rings in 3DIC Structure
03/27/2014US20140084444 Thermal Dissipation Through Seal Rings in 3DIC Structure
03/27/2014US20140084441 Stacked-die package including die in package substrate
03/27/2014US20140084440 Semiconductor device
03/27/2014US20140084439 Semiconductor device, electronic device and method for fabricating the semiconductor device
03/27/2014US20140084436 Semiconductor device and method of manufacturing the same
03/27/2014US20140084433 Semiconductor Device Having a Clip Contact
03/27/2014US20140084432 Method and apparatus for multi-chip structure semiconductor package
03/27/2014US20140084429 Extremely thin package
03/27/2014US20140084428 Integrated circuit with electrical through-contact and method for producing electrical through-contact
03/27/2014US20140084427 Multi-core dies produced by reticle set modification
03/27/2014US20140084426 Substrate member and method of manufacturing chip
03/27/2014US20140084425 Perimeter trench sensor array package
03/27/2014US20140084423 Protective member and wafer processing method
03/27/2014US20140084422 Reclaimed Wafer And A Method For Reclaiming A Wafer
03/27/2014US20140084421 Adhesion Promoter Apparatus and Method
03/27/2014US20140084420 Method to bridge extrinsic and intrinsic base by selective epitaxy in bicmos technology
03/27/2014US20140084414 Vertical meander inductor for small core voltage regulators
03/27/2014US20140084412 Semiconductor structure with integrated passive structures
03/27/2014US20140084411 Semiconductor-on-insulator (soi) deep trench capacitor
03/27/2014US20140084399 Spin transfer torque memory (sttm) device with topographically smooth electrode and method to form same
03/27/2014US20140084392 Semiconductor device and method of manufacturing the same
03/27/2014US20140084387 Non-planar iii-v field effect transistors with conformal metal gate electrode & nitrogen doping of gate dielectric interface
03/27/2014US20140084383 Methods of forming 3-d semiconductor devices using a replacement gate technique and a novel 3-d device
03/27/2014US20140084381 Precision resistor for non-planar semiconductor device architecture
03/27/2014US20140084377 Semiconductor device and fabricating method thereof
03/27/2014US20140084370 Three-dimensional germanium-based semiconductor devices formed on globally or locally isolated substrates
03/27/2014US20140084364 Semiconductor device and method for manufacturing semiconductor device
03/27/2014US20140084357 Semiconductor device and method of fabricating the same
03/27/2014US20140084356 Semiconductor storage device and method for manufacturing the same
03/27/2014US20140084354 Flash memory with p-type floating gate
03/27/2014US20140084352 Ferroelectric random access memory with optimized hardmask
03/27/2014US20140084351 Replacement channels for semiconductor devices and methods for forming the same using dopant concentration boost
03/27/2014US20140084347 Bidirectional heterojunction compound semiconductor protection devices and methods of forming the same
03/27/2014US20140084345 Compound semiconductor device and method of manufacturing the same
03/27/2014US20140084342 Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates
03/27/2014US20140084341 Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same
03/27/2014US20140084340 Contact Structure Of Semiconductor Device
03/27/2014US20140084339 Compound semiconductor device and method of manufacturing the same
03/27/2014US20140084338 Semiconductor wafer, semiconductor device, and method for manufacturing nitride semiconductor layer
03/27/2014US20140084331 Heterojunction compound semiconductor protection clamps and methods of forming the same
03/27/2014US20140084302 Integrated circuit, a chip package and a method for manufacturing an integrated circuit
03/27/2014US20140084297 Group iii nitride wafers and fabrication method and testing method
03/27/2014US20140084296 Nitride semiconductor wafer, nitride semiconductor device, and method for manufacturing nitride semiconductor wafer
03/27/2014US20140084292 Connection to First Metal Layer in Thin Film Transistor Process
03/27/2014US20140084291 Active Device Array Substrate and Manufacturing Method Thereof
03/27/2014US20140084290 Manufacturing method for a semiconductor on insulator type substrate for radiofrequency applications
03/27/2014US20140084288 ZnO BASED COMPOUND SEMICONDUCTOR ELEMENT, AND METHOD FOR PRODUCING THE SAME
03/27/2014US20140084272 Surface planarisation
03/27/2014US20140084268 Method of forming polysilicon film, thin film transistor and display device including polysilicon film
03/27/2014US20140084263 Organic layer deposition apparatus, organic light-emitting display apparatus, and method of manufacturing the organic light-emitting display apparatus
03/27/2014US20140084247 Threshold adjustment for quantum dot array devices with metal source and drain
03/27/2014US20140084234 Post manufacturing strain manipulation in semiconductor devices
03/27/2014US20140084233 Electrode structure for a non-volatile memory device and method
03/27/2014US20140084184 Apparatus for and method of drawing
03/27/2014US20140083902 Package structure for substrate storage container
03/27/2014US20140083612 Baffle and method for treating surface of the baffle, and substrate treating apparatus and method for treating surface of the apparatus
03/27/2014US20140083468 Substrate processing apparatus
03/27/2014US20140083361 Controlling temperature in substrate processing systems
03/27/2014US20140083360 Process chamber having more uniform gas flow
03/27/2014US20140082936 Method of manufacturing a wiring substrate
03/27/2014US20140082906 Welded bellows for semiconductor manufacturing device
03/27/2014DE112012002493T5 Polierkopf und Poliervorrichtung Polishing head and polishing machine
03/27/2014DE112012002326T5 Harzbeschichtungsvorrichtung und Harzbeschichtungsverfahren Resin coating apparatus and resin coating method
03/27/2014DE112012001870T5 Optimierter ringförmiger Kupfer-TSV Optimized annular copper TSV
03/27/2014DE112012001618T5 Gestapelter Halbleiterkörper, Verfahren zum Herstellen desselben und Halbleiterelement Of the same stacked semiconductor body, method for manufacturing the semiconductor element and
03/27/2014DE112011105316T5 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
03/27/2014DE112010000867B4 Herstellungsverfahren für SiC-Einkristall vom n-Typ, dadurch erhaltener SiC-Einkristall vom n-Typ und dessen Anwendung Manufacturing method for SiC single crystal n-type, characterized got SiC single crystal n-type and its application
03/27/2014DE112009004375B4 Halbleitervorrichtung Semiconductor device
03/27/2014DE112005002397B4 Nicht-planare Halbleitereinrichtung mit verjüngtem unteren Körperabschnitt und Verfahren zur Herstellung Non-planar semiconductor device having a tapered lower body portion and methods for preparing
03/27/2014DE10334384B4 Chipvorrichtung Chip device
03/27/2014DE102013219271A1 Schutzelement und Bearbeitungsverfahren Protection element and processing methods
03/27/2014DE102013218805A1 Method for processing wafer e.g. disc-shaped semiconductor wafer, involves grinding back side of wafer to reduce the thickness of wafer such that end surface of an embedded electrode is not exposed to back side of wafer
03/27/2014DE102013210850B3 Method for manufacturing semiconductor module, involves carrying out removal of adhesive upper surface of circuit carrier, locating projections from bottom face of carrier, and inserting circuit carrier in through-holes of adhesion carrier
03/27/2014DE102013110541A1 Integrierte schaltung, chipgehäuse und verfahren zur herstellung einer integrierten schaltung An integrated circuit chip package and method for manufacturing an integrated circuit
03/27/2014DE102013110180A1 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
03/27/2014DE102013110126A1 Verfahren zur Herstellung eines Halbleitersubstrats und Verfahren zur Herstellung von Halbleiterbauelementen, die in ein Halbleitersubstrat integriert sind A process for producing a semiconductor substrate and process for producing semiconductor devices which are integrated in a semiconductor substrate
03/27/2014DE102013109834A1 Bidirektionale Heteroübergangshalbleiterschutzvorrichtungen und Verfahren zur Bildung derselben Bidirectional heterojunction semiconductor protection devices and methods of forming the same
03/27/2014DE102013109831A1 Schutzbegrenzer für Heteroübergangsverbindungshalbleiter und Verfahren zu deren Herstellung Schutzbegrenzer for hetero-junction compound semiconductor and process for their preparation
03/27/2014DE102013103578A1 Gehäuseanordnung und Verfahren zum Herstellen derselben Housing assembly and method of manufacturing the same
03/27/2014DE102013103489A1 Wärmeableitung durch Dichtungsringe in 3DIC-Struktur Heat dissipation by sealing rings in 3DIC structure
03/27/2014DE102013015942A1 Halbleiterbauelement mit einem Clipkontakt Semiconductor component with a clip contact
03/27/2014DE102012217644A1 Optoelektronisches Bauelement Optoelectronic component
03/27/2014DE102012217633A1 Method for testing crack in optoelectronic component used for dark field illumination, involves classifying detected structure as crack, when detected structure has geometric feature corresponding to predetermined geometry parameters
03/27/2014DE102012217631A1 Optoelektronisches Bauelement mit einer Schichtstruktur Optoelectronic component with a layer structure
03/27/2014DE102012217154A1 Halbleitervorrichtung und Herstellungsverfahren für eine Halbleitervorrichtung A semiconductor device and manufacturing method of a semiconductor device
03/27/2014DE102012217078A1 Photovoltaische Solarzelle und Verfahren zum Herstellen einer photovoltaischen Solarzelle Photovoltaic solar cell and method for fabricating a photovoltaic solar cell
03/27/2014DE102012217073A1 Vertikales mikroelektronisches Bauelement und entsprechendes Herstellungsverfahren Vertical microelectronic component and corresponding production method
03/27/2014DE102012217048A1 Method for structuring material in semiconductor structure for forming e.g. tri-gate-transistors in structure during manufacturing integrated circuit, involves selective etching of exposed part of material relative to another material
03/27/2014DE102012216956A1 Lead frame for lighting device e.g. LED module, has fitting station for semiconductor light source that is arranged adjacent to contact surface of conductive paths that are non-destructive pivotable towards connecting portions
03/27/2014DE102012215449A1 Gehäuse für ein elektronisches bauelement, elektronische baugruppe, verfahren zum herstellen eines gehäuses für ein elektronisches bauelement und verfahren zum herstellen einer elektronischen baugruppe Housing for an electronic component, electronic module, method for manufacturing a housing for an electronic component and method for manufacturing an electronic module,
1 ... 293 294 295 296 297 298 299 300 301 302 303 304 305 306 307 308 309 310 311 312 313 ... 6590