Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/03/2014US20140094031 Method for generating mask data and method for manufacturing integrated circuit device
04/03/2014US20140094030 Manufacturing method of semiconductor apparatus
04/03/2014US20140094029 Method for forming an electrical connection between metal layers
04/03/2014US20140094028 Contact and Via Interconnects Using Metal Around Dielectric Pillars
04/03/2014US20140094026 Method for providing electrical connections to spaced conductive lines
04/03/2014US20140094025 Method of processing a semiconductor assembly
04/03/2014US20140094024 Plasma doping apparatus, plasma doping method, and method for manufacturing semiconductor device
04/03/2014US20140094023 Fabricating method of semiconductor chip
04/03/2014US20140094021 Method for producing graphene oxide with tunable gap
04/03/2014US20140094020 Method of manufacturing semiconductor device
04/03/2014US20140094019 Wafer processing method
04/03/2014US20140094018 Method for Dicing a Substrate with Back Metal
04/03/2014US20140094017 Manufacturing method for a shallow trench isolation
04/03/2014US20140094016 Alignment for Backside Illumination Sensor
04/03/2014US20140094015 Alignment measurement system, overlay measurement system, and method for manufacturing semiconductor device
04/03/2014US20140094011 Self-Aligned Method Of Forming A Semiconductor Memory Array Of Floating Gate Memory Cells With Single Poly Layer
04/03/2014US20140094010 Method of forming electronic components with increased reliability
04/03/2014US20140094009 Semiconductor device with self-aligned interconnects
04/03/2014US20140094008 CMOS Devices with Schottky Source and Drain Regions
04/03/2014US20140094006 Transistor formation using cold welding
04/03/2014US20140094005 Enhancement-Mode GaN MOSFET with Low Leakage Current and Improved Reliability
04/03/2014US20140094004 Printed Dopant Layers
04/03/2014US20140094002 Active layer ion implantation method and active layer ion implantation method for thin-film transistor
04/03/2014US20140094001 Semiconductor device and method for manufacturing the same
04/03/2014US20140093999 Embedded structures for package-on-package architecture
04/03/2014US20140093996 Method and apparatus for diffusinon into semiconductor materials
04/03/2014US20140093991 Method for manufacturing high efficiency light-emitting diodes
04/03/2014US20140093987 Residue Detection with Spectrographic Sensor
04/03/2014US20140093985 In situ optical diagnostic for monitoring or control of sodium diffusion in photovoltaics manufacturing
04/03/2014US20140093984 Substrate processing apparatus, substrate transfer method and storage medium
04/03/2014US20140093336 Substrate transfer apparatus
04/03/2014US20140093218 Silicon-based optical fiber clamp and methods of fabricating the same
04/03/2014US20140092573 Contact protection for integrated circuit device loading
04/03/2014US20140092384 Diffraction grating manufacturing method, spectrophotometer, and semiconductor device manufacturing method
04/03/2014US20140091845 High breakdown voltage iii-n depletion mode mos capacitors
04/03/2014US20140091483 Method of manufacturing semiconductor apparatus and semiconductor apparatus
04/03/2014US20140091482 Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP
04/03/2014US20140091480 Dicing tape-integrated wafer back surface protective film
04/03/2014US20140091477 System and method for chemical-mechanical planarization of a metal layer
04/03/2014US20140091476 Directed self assembly of block copolymers to form vias aligned with interconnects
04/03/2014US20140091474 Localized high density substrate routing
04/03/2014US20140091473 Novel three dimensional integrated circuits stacking approach
04/03/2014US20140091472 Semiconductor device and manufacturing method of the same
04/03/2014US20140091471 Apparatus and Method for a Component Package
04/03/2014US20140091469 Methods of providing dielectric to conductor adhesion in package structures
04/03/2014US20140091468 Semiconductor device and manufacturing method thereof
04/03/2014US20140091467 Forming barrier walls, capping, or alloys /compounds within metal lines
04/03/2014US20140091466 Pitch quartering to create pitch halved trenches and pitch halved air gaps
04/03/2014US20140091465 Leadframe having sloped metal terminals for wirebonding
04/03/2014US20140091462 Semiconductor package and fabrication method thereof
04/03/2014US20140091461 Die cap for use with flip chip package
04/03/2014US20140091459 Chip-size, double side connection package and method for manufacturing the same
04/03/2014US20140091458 Encapsulated wafer-level chip scale (wlscp) pedestal packaging
04/03/2014US20140091457 Controlled solder height packages and assembly processes
04/03/2014US20140091456 Using collapse limiter structures between elements to reduce solder bump bridging
04/03/2014US20140091455 Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
04/03/2014US20140091454 Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package
04/03/2014US20140091451 Semiconductor device comprising a crack stop structure
04/03/2014US20140091448 Semiconductor Package with Corner Pins
04/03/2014US20140091447 Semiconductor device and production method thereof
04/03/2014US20140091446 Semiconductor device employing aluminum alloy lead-frame with anodized aluminum
04/03/2014US20140091445 Bumpless build-up layer package including an integrated heat spreader
04/03/2014US20140091444 Semiconductor unit and method for manufacturing the same
04/03/2014US20140091443 Surface mount package for a semiconductor integrated device, related assembly and manufacturing process
04/03/2014US20140091442 High density second level interconnection for bumpless build up layer (bbul) packaging technology
04/03/2014US20140091441 Ic wafer having electromagnetic shielding effects and method for making the same
04/03/2014US20140091440 System in package with embedded rf die in coreless substrate
04/03/2014US20140091439 Silicon shaping
04/03/2014US20140091438 Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same
04/03/2014US20140091437 Chip package and method of manufacturing the same
04/03/2014US20140091435 Etching of Block-Copolymers
04/03/2014US20140091434 Patterned Bases, and Patterning Methods
04/03/2014US20140091433 Method of producing semiconductor wafer, and semiconductor wafer
04/03/2014US20140091428 Land side and die side cavities to reduce package z-height
04/03/2014US20140091422 Thin Film with Improved Temperature Range
04/03/2014US20140091406 MEMS Microphone System for Harsh Environments
04/03/2014US20140091398 Semiconductor device, semiconductor wafer, method for producing semiconductor wafer, and method for producing semiconductor device
04/03/2014US20140091397 Semiconductor integrated circuit device and method of manufacturing thereof
04/03/2014US20140091395 Transistor
04/03/2014US20140091394 Multi-gate field effect transistor (fet) including isolated fin body
04/03/2014US20140091393 Semiconductor device, semiconductor wafer, method for producing semiconductor wafer, and method for producing semiconductor device
04/03/2014US20140091392 Semiconductor device, semiconductor wafer, method for producing semiconductor wafer, and method for producing semiconductor device
04/03/2014US20140091390 Protection Layer for Halftone Process of Third Metal
04/03/2014US20140091382 Split-Gate Memory Cell With Substrate Stressor Region, And Method Of Making Same
04/03/2014US20140091381 Support lines to prevent line collapse in arrays
04/03/2014US20140091361 Methods of containing defects for non-silicon device engineering
04/03/2014US20140091360 Trench confined epitaxially grown device layer(s)
04/03/2014US20140091353 Vertical structure leds
04/03/2014US20140091348 Encapsulating sheet-covered semiconductor element, producing method thereof, semiconductor device, and producing method thereof
04/03/2014US20140091326 Light Blocking Structure in Leadframe
04/03/2014US20140091317 Method of manufacturing semiconductor crystal substrate, method of manufacturing semiconductor apparatus, semiconductor crystal substrate, and semiconductor apparatus
04/03/2014US20140091309 Predisposed high electron mobility transistor
04/03/2014US20140091308 Self-aligned structures and methods for asymmetric gan transistors & enhancement mode operation
04/03/2014US20140091305 Polysilicon Thin Film And Manufacturing Method Thereof, Array Substrate And Display Device
04/03/2014US20140091281 Non-volatile memory device employing semiconductor nanoparticles
04/03/2014US20140091279 Non-planar semiconductor device having germanium-based active region with release etch-passivation surface
04/03/2014US20140091273 Resistive random access memory and fabrication method thereof
04/03/2014US20140091270 Low energy memristors with engineered switching channel materials
04/03/2014US20140091131 Assembly jig for a semiconductor device and assembly method for a semiconductor device
04/03/2014US20140091077 Supporting unit, substrate treating device including the same, and method of manufacturing the supporting unit
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