| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/08/2014 | US8691666 Method for producing chip with adhesive applied |
| 04/08/2014 | US8691665 Method for producing bonded wafer |
| 04/08/2014 | US8691664 Backside process for a substrate |
| 04/08/2014 | US8691663 Methods of manipulating stressed epistructures |
| 04/08/2014 | US8691662 Process for fabricating a silicon-on-insulator structure employing two rapid thermal annealing processes, and related structures |
| 04/08/2014 | US8691661 Trench with reduced silicon loss |
| 04/08/2014 | US8691660 Semiconductor component with trench isolation and corresponding production method |
| 04/08/2014 | US8691659 Method for forming void-free dielectric layer |
| 04/08/2014 | US8691658 Orientation of an electronic CMOS structure with respect to a buried structure in the case of a bonded and thinned-back stack of semiconductor wafers |
| 04/08/2014 | US8691657 Method for prevention of corona effect in a monolithic microwave integrated circuit (MMIC) |
| 04/08/2014 | US8691656 Methods of forming an interconnect between a substrate bit line contact and a bit line in DRAM |
| 04/08/2014 | US8691655 Method of semiconductor integrated circuit fabrication |
| 04/08/2014 | US8691654 Semiconductor device having stressor film and method of manufacturing semiconductor device |
| 04/08/2014 | US8691653 Semiconductor structure with reduced surface field effect and manufacturing process thereof |
| 04/08/2014 | US8691652 Semiconductor process |
| 04/08/2014 | US8691651 Method of forming non-planar FET |
| 04/08/2014 | US8691650 MOSFET with recessed channel film and abrupt junctions |
| 04/08/2014 | US8691649 Methods of forming recessed channel array transistors and methods of manufacturing semiconductor devices |
| 04/08/2014 | US8691648 Methods for fabricating semiconductor memory with process induced strain |
| 04/08/2014 | US8691647 Memory devices containing a high-K dielectric layer |
| 04/08/2014 | US8691646 FINFET compatible PC-bounded ESD diode |
| 04/08/2014 | US8691645 Method of manufacturing convex shaped thin-film transistor device |
| 04/08/2014 | US8691644 Method of forming a CMOS device with a stressed-channel NMOS transistor and a strained-channel PMOS transistor |
| 04/08/2014 | US8691643 Methods of forming semiconductor devices |
| 04/08/2014 | US8691642 Method of fabricating semiconductor device including forming epitaxial blocking layers by nitridation process |
| 04/08/2014 | US8691641 Method for manufacturing semiconductor device |
| 04/08/2014 | US8691640 Methods of forming dielectrically isolated fins for a FinFET semiconductor by performing an etching process wherein the etch rate is modified via inclusion of a dopant material |
| 04/08/2014 | US8691639 Manufacture methods of thin film transistor and array substrate and mask |
| 04/08/2014 | US8691638 High-K metal gate device |
| 04/08/2014 | US8691637 Solid-state image pickup device and method of manufacturing same |
| 04/08/2014 | US8691636 Method for removing germanium suboxide |
| 04/08/2014 | US8691634 Optically triggered semiconductor device and method for making the same |
| 04/08/2014 | US8691633 Metal structure for memory device |
| 04/08/2014 | US8691632 Wafer level package and fabrication method |
| 04/08/2014 | US8691631 Device including two mounting surfaces |
| 04/08/2014 | US8691630 Semiconductor package structure and manufacturing method thereof |
| 04/08/2014 | US8691629 Packaging jig and process for semiconductor packaging |
| 04/08/2014 | US8691628 Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus |
| 04/08/2014 | US8691627 Wafer level packaged GaN power device and manufacturing method thereof |
| 04/08/2014 | US8691626 Semiconductor chip device with underfill |
| 04/08/2014 | US8691625 Method for making a chip package |
| 04/08/2014 | US8691624 Die fixing method and apparatus |
| 04/08/2014 | US8691623 Semiconductor device and manufacturing method thereof |
| 04/08/2014 | US8691622 Memory cells and methods of forming memory cells |
| 04/08/2014 | US8691618 Metal species surface treatment of thin film photovoltaic cell and manufacturing method |
| 04/08/2014 | US8691617 Method of manufacturing image sensor having backside illumination structure |
| 04/08/2014 | US8691616 Method for manufacturing thin film solar cell |
| 04/08/2014 | US8691615 Image sensor and method of manufacturing the same |
| 04/08/2014 | US8691613 Method for manufacturing photoelectric conversion device |
| 04/08/2014 | US8691612 Method of creating micro-scale silver telluride grains covered with bismuth nanoparticles |
| 04/08/2014 | US8691611 Method for creating a micromechanical membrane structure and MEMS component |
| 04/08/2014 | US8691610 Semiconductor device and method for manufacturing the same |
| 04/08/2014 | US8691609 Gas sensor materials and methods for preparation thereof |
| 04/08/2014 | US8691608 Semiconductor devices having nanochannels confined by nanometer-spaced electrodes |
| 04/08/2014 | US8691607 Hermetically sealed MEMS device and method of fabrication |
| 04/08/2014 | US8691606 Method for manufacturing a light emitting diode with smooth surface for reflective electrode |
| 04/08/2014 | US8691605 Crystallization processing for semiconductor applications |
| 04/08/2014 | US8691604 Semiconductor device and manufacturing method thereof, delamination method, and transferring method |
| 04/08/2014 | US8691603 Organic el device manufacturing method, organic el device, and electronic apparatus having a luminescent layer disposed over another luminescent layer |
| 04/08/2014 | US8691602 Method for producing semiconductor light-emitting chip |
| 04/08/2014 | US8691600 Method for testing through-silicon-via (TSV) structures |
| 04/08/2014 | US8691599 Parameter extraction method for semiconductor device |
| 04/08/2014 | US8691598 Dual-loop control for laser annealing of semiconductor wafers |
| 04/08/2014 | US8691597 Method for manufacturing a semiconductor device including application of a plating voltage |
| 04/08/2014 | US8691596 Magnetoresistive element and method of manufacturing the same |
| 04/08/2014 | US8691404 High energy-density radioisotope micro power sources |
| 04/08/2014 | US8691392 Junctions comprising molecular bilayers for the use in electronic devices |
| 04/08/2014 | US8691048 Plasma stabilization method and plasma apparatus |
| 04/08/2014 | US8691047 Large area plasma processing chamber with at-electrode RF matching |
| 04/08/2014 | US8691027 Method for removing material from semiconductor wafer and apparatus for performing the same |
| 04/08/2014 | US8691016 Deposition apparatus, and deposition method |
| 04/08/2014 | US8691015 Method and system for binding halide-based contaminants |
| 04/08/2014 | US8690516 Method of adjusting velocity of transfer member, method of transferring substrate using the method, and substrate-processing apparatus |
| 04/08/2014 | US8689812 Methods and loadport for purging a substrate carrier |
| 04/08/2014 | US8689733 Plasma processor |
| 04/08/2014 | CA2676495C Mechanical barrier element for improved thermal reliability of electronic components |
| 04/04/2014 | CA2829191A1 Method of making a light-emitting-diode lamp tube |
| 04/03/2014 | WO2014052948A1 Semiconductor device with breakdown preventing layer |
| 04/03/2014 | WO2014052811A1 Inspection of substrates using calibration and imaging |
| 04/03/2014 | WO2014052742A1 Leadframe having sloped metal terminals for wirebonding |
| 04/03/2014 | WO2014052624A1 Particle control near reticle and optics using showerhead |
| 04/03/2014 | WO2014052508A1 Gas expansion displacement cnx concept, methods and apparatus. |
| 04/03/2014 | WO2014052486A1 Process chamber having more uniform gas flow |
| 04/03/2014 | WO2014052476A2 Methods for wafer bonding, and for nucleating bonding nanophases |
| 04/03/2014 | WO2014052445A1 Method for dicing a substrate with back metal |
| 04/03/2014 | WO2014052388A1 An apparatus and method for purging gaseous compounds |
| 04/03/2014 | WO2014052301A1 Controlling temperature in substrate processing systems |
| 04/03/2014 | WO2014052274A1 Flexible, space-efficient i/o circuitry for integrated circuits |
| 04/03/2014 | WO2014052228A1 Bottom and side plasma tuning having closed loop control |
| 04/03/2014 | WO2014052134A1 Directed self assembly of block copolymers to form vias aligned with interconnects |
| 04/03/2014 | WO2014052130A1 Modified microgrinding process |
| 04/03/2014 | WO2014052012A1 Assembling thin silicon chips on a contact lens |
| 04/03/2014 | WO2014052001A1 Periphery transistor of a non-volatile memory and method of forming the same |
| 04/03/2014 | WO2014051970A1 Spin transfer torque memory (sttm) device with topographically smooth electrode and method to form same |
| 04/03/2014 | WO2014051909A1 Chamber clean with in gas heating source |
| 04/03/2014 | WO2014051875A1 Cmos and si nanophotonics stress engineered multi-layers |
| 04/03/2014 | WO2014051874A1 Improved edge ring lip |
| 04/03/2014 | WO2014051856A1 Self-aligned method of forming a semiconductor memory array of floating gate memory cells with single poly layer |
| 04/03/2014 | WO2014051779A1 Epitaxial buffer layers for group iii-n transistors on silicon substrates |
| 04/03/2014 | WO2014051773A1 Semiconductor device having germanium active layer with underlying parasitic leakage barrier layer |