Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/03/2014WO2014051769A1 Methods of containing defects for non-silicon device engineering
04/03/2014WO2014051762A1 Trench confined epitaxially grown device layer(s)
04/03/2014WO2014051761A1 High breakdown voltage iii-n depletion mode mos capacitors
04/03/2014WO2014051760A1 Extended drain non-planar mosfets for electrostatic discharge (esd) protection
04/03/2014WO2014051738A1 Non-planar semiconductor device having group iii-v material active region with multi-dielectric gate stack
04/03/2014WO2014051732A1 Self-aligned structures and methods for asymmetric gan transistors & enhancement mode operation
04/03/2014WO2014051731A1 Non-planar semiconductor device having channel region with low band-gap cladding layer
04/03/2014WO2014051726A1 Testing device for validating stacked semiconductor devices
04/03/2014WO2014051725A1 Low voltage embedded memory having conductive oxide and electrode stacks
04/03/2014WO2014051723A1 Non-planar semiconductor device having germanium-based active region with release etch-passivation surface
04/03/2014WO2014051719A1 Three-dimensional germanium-based semiconductor devices formed on globally or locally isolated substrates
04/03/2014WO2014051684A1 Group iii nitride wafers and fabrication method and testing method
04/03/2014WO2014051355A1 Method for forming fine pattern, and fine pattern formed using same
04/03/2014WO2014051230A1 Apparatus for manufacturing flexible integrated circuit device package
04/03/2014WO2014051189A1 Door for thin board container
04/03/2014WO2014051121A1 Light-exposure method and device, and device production method
04/03/2014WO2014051104A1 Polishing pad
04/03/2014WO2014051063A1 Substrate processing method, computer storage medium, and substrate processing system
04/03/2014WO2014051018A1 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device
04/03/2014WO2014050979A1 Method for producing semiconductor device, substrate processing device, and recording medium
04/03/2014WO2014050941A1 Processing fluid supply device, substrate processing device, processing fluid supply method, substrate processing method, processing fluid processing device, and processing fluid processing method
04/03/2014WO2014050915A1 Normal temperature bonding device and normal temperature bonding method
04/03/2014WO2014050905A1 Self-organizing composition for forming pattern, method for forming pattern by self-organization of block copolymer using same, and pattern
04/03/2014WO2014050903A1 Plasma etching device
04/03/2014WO2014050891A1 Reflective mask blank for euv-lithography and manufacturing method therefor, and reflective mask for euv-lithography and manufacturing method therefor
04/03/2014WO2014050878A1 Resin composition, cured film, laminated film, and method for manufacturing semiconductor device
04/03/2014WO2014050855A1 Curable composition for optical imprinting, pattern forming method, fine pattern, and method for manufacturing semiconductor device
04/03/2014WO2014050831A1 Method for manufacturing substrate with multilayer reflective film
04/03/2014WO2014050808A1 Integrated management system, management device, method for displaying information for substrate processing device, and storage medium
04/03/2014WO2014050793A1 Semiconductor device or crystal, and method for producing semiconductor device or crystal
04/03/2014WO2014050763A1 Radiation-curing adhesive tape for dicing
04/03/2014WO2014050740A1 Switching element
04/03/2014WO2014050663A1 Adhesive sheet for semiconductor device production, semiconductor device, and method for producing semiconductor device
04/03/2014WO2014050658A1 Dicing film
04/03/2014WO2014050636A1 Semiconductor device, display panel, and semiconductor device manufacturing method
04/03/2014WO2014050633A1 Resin composition, photosensitive resin composition, and color filter
04/03/2014WO2014050627A1 Photosensitive resin composition, method for forming cured film using same, cured film, liquid crystal display device, and organic el display device
04/03/2014WO2014050626A1 Photosensitive resin composition, method for producing cured film using same, cured film, liquid crystal display device, and organic el display device
04/03/2014WO2014050590A1 Semiconductor device and method for manufacturing same
04/03/2014WO2014050587A1 Chemical solution for formation of protective film
04/03/2014WO2014050538A1 Temporary adhesive for semiconductor device production, adhesive substrate using same, and semiconductor device production method
04/03/2014WO2014050494A1 Transfer method, adhesion method, and adhesion device
04/03/2014WO2014050484A1 Adhesion device, and adhesion method
04/03/2014WO2014050464A1 Substrate processing apparatus, substrate processing method, and semiconductor device manufacturing method
04/03/2014WO2014050457A1 Electronic device, image display device, sensor and method for manufacturing electronic device
04/03/2014WO2014050455A1 Temporary adhesive for semiconductor device production, adhesive substrate using same, and semiconductor device production method
04/03/2014WO2014050428A1 Substrate-cleaning device and substrate-cleaning method
04/03/2014WO2014050422A1 Chip diode and method for manufacturing same
04/03/2014WO2014050421A1 Method for forming wiring pattern, and wiring pattern formation
04/03/2014WO2014050407A1 Semiconductor device
04/03/2014WO2014050405A1 Exposure/rendering device, exposure/rendering system, program, and exposure/rendering method
04/03/2014WO2014050384A1 Exposure/rendering device, exposure/rendering system, program, and exposure/rendering method
04/03/2014WO2014050380A1 Storage element, storage device, and magnetic head
04/03/2014WO2014050379A1 Storage element, storage device, and magnetic head
04/03/2014WO2014050347A1 Temporary bonding layer for semiconductor-device production, stacked body, and semiconductor-device production method
04/03/2014WO2014050338A1 Heat treatment apparatus
04/03/2014WO2014050324A1 Photosensitive resin composition and production method for pattern using same
04/03/2014WO2014050308A1 Diffraction optical element and method and device for producing diffraction optical element
04/03/2014WO2014050305A1 Pattern measurement device, evaluation method of polymer compounds used in self-assembly lithography, and computer program
04/03/2014WO2014050250A1 Laminated semiconductor substrate and semiconductor element
04/03/2014WO2014050228A1 Substrate processing device
04/03/2014WO2014050207A1 Data generation system and data generation method
04/03/2014WO2014050198A1 Switching element and method for manufacturing same
04/03/2014WO2014050187A1 Method for planarizing surface of germanium layer, and semiconductor structure and process for producing same
04/03/2014WO2014050183A1 Production method for sealing material containing fluorescent body, sealing material containing fluorescent body, production method for light-emitting device, and dispenser
04/03/2014WO2014050054A1 Semiconductor device
04/03/2014WO2014050051A1 Semiconductor device and manufacturing method thereof
04/03/2014WO2014049970A1 Thin film transistor array and image display apparatus
04/03/2014WO2014049968A1 Thin-film transistor and method for producing same
04/03/2014WO2014049967A1 Layered structure and thin-film-transistor array, and method for producing same
04/03/2014WO2014049959A1 Substrate cleaning method, substrate cleaning device, and vacuum processing system
04/03/2014WO2014049915A1 Substrate treatment device, substrate treatment method, and production method for semiconductor device
04/03/2014WO2014049885A1 Group-iii nitride semiconductor element and method for manufacturing same
04/03/2014WO2014049827A1 Semiconductor device manufacturing method and semiconductor device
04/03/2014WO2014049806A1 Silicon carbide semiconductor device and method for manufacturing same
04/03/2014WO2014049696A1 Semiconductor device manufacturing method and semiconductor manufacturing apparatus
04/03/2014WO2014049638A1 Semiconductor device, oscillating element, and semiconductor device manufacturing method
04/03/2014WO2014049551A1 Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method
04/03/2014WO2014049414A1 Direct bonding process
04/03/2014WO2014049038A1 Method for separating regions of a semiconductor layer
04/03/2014WO2014048805A1 Optoelectronic component and method for producing an optoelectronic component
04/03/2014WO2014048449A1 Electronic device and method for forming an electrical connection
04/03/2014WO2014048226A1 Method for manufacturing fs-type insulated gate bipolar transistor
04/03/2014WO2014048211A1 Position matching structure and position matching method for two-sided stepper
04/03/2014WO2014047991A1 Manufacturing method for semiconductor structure
04/03/2014WO2014047990A1 Manufacturing method for semiconductor structure
04/03/2014WO2014047981A1 Method for manufacturing thin-film transistor and thin-film transistor manufactured thereby
04/03/2014WO2014047980A1 Method for manufacturing thin-film transistor active device and thin-film transistor active device manufactured thereby
04/03/2014WO2014023287A3 Contact bump connection and contact bump and method for producing a contact bump connection
04/03/2014WO2013154236A8 Polishing slurry and method of polishing using the same
04/03/2014WO2013078065A8 Chamber sealing member
04/03/2014US20140094040 Plasma processing method
04/03/2014US20140094039 Edge ring lip
04/03/2014US20140094038 Enhancing adhesion of cap layer films
04/03/2014US20140094037 Method and Apparatus for Preventing Native Oxide Regrowth
04/03/2014US20140094036 Directional sio2 etch using low-temperature etchant deposition and plasma post-treatment
04/03/2014US20140094035 Carbon deposition-etch-ash gap fill process
04/03/2014US20140094034 Pattern forming method
04/03/2014US20140094033 Polishing composition
04/03/2014US20140094032 Polishing agent and polishing method