Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2014
04/09/2014CN102116980B Thin film transistor array substrate and method for fabricating same
04/09/2014CN102105282B Method for compression-molding electronic component and die apparatus
04/09/2014CN102098876B Manufacturing process for circuit substrate
04/09/2014CN102097371B Substrate dividing device
04/09/2014CN102057332B Method and system for thermally conditioning optical element
04/09/2014CN102017102B Apparatus and methods for hyperbaric rapid thermal processing
04/09/2014CN102017073B Methods of forming isolated active areas, trenches, and conductive lines in semiconductor structures and semiconductor structures including same
04/09/2014CN101996978B Chip package body and forming method thereof
04/09/2014CN101930981B Dynamic random access memory(DRAM) cell
04/09/2014CN101908532B Thin double-faced display OLED (Organic Light Emitting Diode) device and manufacturing method thereof
04/09/2014CN101866864B Electronic component mounting apparatus
04/09/2014CN101853775B Sticking and mounting system of electronic component and control method thereof
04/09/2014CN101819938B Semiconductor device manufacturing method
04/09/2014CN101796212B III nitride structure and method for manufacturing III nitride semiconductor fine columnar crystal
04/09/2014CN101728312B SOI substrate and method for manufacturing same
04/09/2014CN101661922B Copper interconnection line with silicon through hole having high depth-to-width ratio and preparation method thereof
04/09/2014CN101645403B Method of manufacturing flat panel display device
04/09/2014CN101604724B Light emitting elements, light emitting devices including light emitting elements and methods for manufacturing such light emitting elements and/or devices
04/09/2014CN101589461B Electron blocking layers for electronic devices
04/09/2014CN101562125B Method of forming fine patterns of semiconductor device
04/09/2014CN101533812B Semiconductor package having side walls and method for manufacturing same
04/09/2014CN101437364B Device mounting structure and device mounting method
04/08/2014US8694145 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
04/08/2014US8693811 High data-rate SOI optical modulator including a modified structure for reducing the capacitive effect between doped areas and a substrate
04/08/2014US8693163 Cylindrical embedded capacitors
04/08/2014US8692968 Chip component mounting structure, chip component mounting method and liquid crystal display device
04/08/2014US8692750 Liquid crystal display device having GOLDD type TFT and LDD type TFT and method of making same
04/08/2014US8692389 Dicing tape-integrated film for semiconductor back surface
04/08/2014US8692364 Semiconductor device and method for manufacturing the same
04/08/2014US8692357 Semiconductor wafer and processing method therefor
04/08/2014US8692351 Dummy shoulder structure for line stress reduction
04/08/2014US8692350 Semiconductor device and method of manufacturing the same
04/08/2014US8692335 Source/drain region, contact hole and method for forming the same
04/08/2014US8692334 Resistor integrated with transistor having metal gate
04/08/2014US8692332 Strained-silicon transistor and method of making the same
04/08/2014US8692327 Lateral double diffused metal oxide semiconductor device and method for manufacturing the same
04/08/2014US8692315 Semiconductor device and fabrication method thereof
04/08/2014US8692306 Decoupling capacitor and method of making same
04/08/2014US8692297 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
04/08/2014US8692296 Semiconductor devices and manufacturing methods thereof
04/08/2014US8692294 Semiconductor devices with field plates
04/08/2014US8692290 Silicon controlled rectifier structure with improved junction breakdown and leakage control
04/08/2014US8692288 Heterojunction bipolar transistors and methods of manufacture
04/08/2014US8692286 Light emitting device with bonded interface
04/08/2014US8692266 Circuit substrate structure
04/08/2014US8692264 Light-emitting element, method of manufacturing light-emitting element, self-scanning light-emitting element array, optical writing head, and image forming apparatus
04/08/2014US8692258 Array substrate of TFT-LCD including a black matrix and method for manufacturing the same
04/08/2014US8692246 Leakage measurement structure having through silicon vias
04/08/2014US8692245 Crack stop structure and method for forming the same
04/08/2014US8692243 Semiconductor device and method for manufacturing the same
04/08/2014US8692226 Materials and configurations of a field emission device
04/08/2014US8692216 Ion implantation apparatus and control method thereof
04/08/2014US8692208 Ion supply device and workpiece processing system provided with the same
04/08/2014US8692207 Method to produce a scintillator-photosensor sandwich, scintillator-photosensor sandwich, and radiation detector
04/08/2014US8692166 Substrate heating device and substrate heating method
04/08/2014US8692151 Laser beam positioning system
04/08/2014US8692111 High throughput laser ablation processes and structures for forming contact holes in solar cells
04/08/2014US8691710 Group IV metal complexes for metal-containing film deposition
04/08/2014US8691709 Method of forming metal carbide barrier layers for fluorocarbon films
04/08/2014US8691708 Method of manufacturing semiconductor device and substrate processing apparatus
04/08/2014US8691707 Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection
04/08/2014US8691706 Reducing substrate warpage in semiconductor processing
04/08/2014US8691705 Method of patterning metal alloy material layer having hafnium and molybdenum
04/08/2014US8691704 Methods for forming semiconductor constructions, and methods for selectively etching silicon nitride relative to conductive material
04/08/2014US8691703 Method of manufacturing semiconductor device
04/08/2014US8691702 Method and apparatus for plasma dicing a semi-conductor wafer
04/08/2014US8691701 Strip with reduced low-K dielectric damage
04/08/2014US8691700 Gas cluster ion beam etch profile control using beam divergence
04/08/2014US8691699 Manufacturing method of semiconductor device and semiconductor device
04/08/2014US8691698 Controlled gas mixing for smooth sidewall rapid alternating etch process
04/08/2014US8691697 Self-aligned devices and methods of manufacture
04/08/2014US8691696 Methods for forming an integrated circuit with straightened recess profile
04/08/2014US8691695 CMP compositions and methods for suppressing polysilicon removal rates
04/08/2014US8691694 Solderless back contact solar cell module assembly process
04/08/2014US8691693 Methods of manufacturing semiconductor device
04/08/2014US8691692 Semiconductor chips and methods of forming the same
04/08/2014US8691691 TSV pillar as an interconnecting structure
04/08/2014US8691690 Contact formation method incorporating preventative etch step reducing interlayer dielectric material flake defects
04/08/2014US8691689 Methods for fabricating integrated circuits having low resistance device contacts
04/08/2014US8691688 Method of manufacturing semiconductor structure
04/08/2014US8691687 Superfilled metal contact vias for semiconductor devices
04/08/2014US8691686 Method of manufacturing semiconductor device, semiconductor device, and electronic apparatus
04/08/2014US8691685 Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
04/08/2014US8691684 Layout and pad floor plan of power transistor for good performance of SPU and STOG
04/08/2014US8691683 Flip-chip mounting method and bump formation method
04/08/2014US8691682 Semiconductor device and method for forming the same
04/08/2014US8691681 Semiconductor device having a metal gate and fabricating method thereof
04/08/2014US8691680 Method for fabricating memory device with buried digit lines and buried word lines
04/08/2014US8691679 Semiconductor device and method of manufacturing the same
04/08/2014US8691678 Composition and method for alloy having improved stress relaxation resistance
04/08/2014US8691677 Method for boron doping silicon wafers
04/08/2014US8691676 Substrate heat treating apparatus, temperature control method of substrate heat treating apparatus, manufacturing method of semiconductor device, temperature control program of substrate heat treating apparatus, and recording medium
04/08/2014US8691675 Vapor phase deposition processes for doping silicon
04/08/2014US8691674 Method for producing group 3-5 nitride semiconductor and method for producing light-emitting device
04/08/2014US8691673 Semiconductor structure with suppressed STI dishing effect at resistor region
04/08/2014US8691671 Planar nonpolar group-III nitride films grown on miscut substrates
04/08/2014US8691670 Methods of forming a semiconductor device
04/08/2014US8691669 Vapor deposition reactor for forming thin film
04/08/2014US8691668 Dihalide germanium(II) precursors for germanium-containing film depositions
04/08/2014US8691667 Method and apparatus for depositing a pattern on a substrate