| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/05/2007 | US7226505 Method for vanishing defects in single crystal silicon and single crystal silicon |
| 06/05/2007 | US7226504 Method to form thick relaxed SiGe layer with trench structure |
| 06/05/2007 | US7226488 Fast heating and cooling apparatus for semiconductor wafers |
| 06/05/2007 | US7226336 Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips |
| 06/05/2007 | US7226296 Ball grid array contacts with spring action |
| 06/05/2007 | US7226270 Apparatus for transferring semiconductor device in handler |
| 06/05/2007 | US7226269 Substrate edge grip apparatus |
| 06/05/2007 | US7226219 High-frequency signal transmitting optical module and method of fabricating the same |
| 06/05/2007 | US7226177 Catoptric projection optical system |
| 06/05/2007 | US7225934 Cassette for receiving glass substrates |
| 06/05/2007 | US7225864 Multi-channel temperature control system for semiconductor processing facilities |
| 06/05/2007 | US7225835 Modular substrate gas panel having manifold connections in a common plane |
| 06/05/2007 | US7225820 High-pressure processing chamber for a semiconductor wafer |
| 06/05/2007 | US7225819 Apparatus process and method for mounting and treating a substrate |
| 06/05/2007 | US7225754 Plasma processing apparatus including a plurality of plasma processing units having reduced variation |
| 06/05/2007 | US7225538 Resilient contact structures formed and then attached to a substrate |
| 06/05/2007 | CA2284826C Preparation of copper-indium-gallium-diselenide precursor films by electrodeposition for fabricating high efficiency solar cells |
| 06/05/2007 | CA2261425C Method and apparatus for three-dimensional micro-fabrication and processing on flexible filamentary substrates |
| 06/05/2007 | CA2258080C Nitride semiconductor growth method, nitride semiconductor substrate, and nitride semiconductor device |
| 06/05/2007 | CA2248141C Semiconductor device shielded by an array of electrically conducting pins and a method to manufacture such a device |
| 05/31/2007 | WO2007062383A2 Integration of pore sealing liner into dual-damascene methods and devices |
| 05/31/2007 | WO2007062345A2 Method and system for iteratively, selectively tuning a parameter of a doped workpiece using a pulsed laser |
| 05/31/2007 | WO2007062305A2 Radio frequency identification (rfid) tag lamination process using liner |
| 05/31/2007 | WO2007062199A2 Device and method for holding a substrate |
| 05/31/2007 | WO2007062163A2 Technique for implementing virtual fabric membership assignments for devices in a storage area network |
| 05/31/2007 | WO2007062096A2 Silicon-germanium hydrides and methods for making and using same |
| 05/31/2007 | WO2007062056A2 Silicon-germanium hydrides and methods for making and using same |
| 05/31/2007 | WO2007062031A2 Rectifying contact to an n-type oxide material or a substantially insulating oxide material |
| 05/31/2007 | WO2007061996A2 Ball grid attachment |
| 05/31/2007 | WO2007061756A2 A tri-axis accelerometer |
| 05/31/2007 | WO2007061669A1 Dielectric media including surface-treated metal oxide particles |
| 05/31/2007 | WO2007061563A1 Large area semiconductor on glass insulator |
| 05/31/2007 | WO2007061531A2 Radiation hardened isolation structures and fabrication methods |
| 05/31/2007 | WO2007061388A1 Detection of warp in an ic substrate |
| 05/31/2007 | WO2007061226A1 Pick and place apparatus |
| 05/31/2007 | WO2007061221A1 Pad having reference mark and pad alignment method using thereof |
| 05/31/2007 | WO2007061216A1 Method for bonding between electrical devices using ultrasonic vibration |
| 05/31/2007 | WO2007061189A2 Occupancy based pattern generation method for maskless lithography |
| 05/31/2007 | WO2007061170A1 Loading device of chemical mechanical polishing equipment for semiconductor wafers |
| 05/31/2007 | WO2007061137A1 Infrared detection unit using a semiconductor optical lens |
| 05/31/2007 | WO2007061134A1 Method for forming porous insulating film, apparatus for manufacturing semiconductor device, method for manufacturing semiconductor device and semiconductor device |
| 05/31/2007 | WO2007061125A1 Electronic component soldering structure and electronic component soldering method |
| 05/31/2007 | WO2007061124A1 Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line |
| 05/31/2007 | WO2007061116A1 Substrate processing equipment |
| 05/31/2007 | WO2007061064A1 Polishing pad for device wafer |
| 05/31/2007 | WO2007061050A1 Sensor device and method for manufacturing same |
| 05/31/2007 | WO2007061048A1 Resin sealing mold assembly and method of resin sealing |
| 05/31/2007 | WO2007061025A1 Mark structure, mark measuring apparatus, pattern forming apparatus, pattern detecting apparatus, detecting method and device manufacturing method |
| 05/31/2007 | WO2007060971A1 Washing liquid for photolithography, and method for washing exposure device using the same |
| 05/31/2007 | WO2007060938A1 Semiconductor device and production method thereof |
| 05/31/2007 | WO2007060936A1 Soldering apparatus and soldering method |
| 05/31/2007 | WO2007060931A1 Nitride semiconductor device |
| 05/31/2007 | WO2007060919A1 Radiation-sensitive resin composition |
| 05/31/2007 | WO2007060904A1 Semiconductor device and operating method thereof |
| 05/31/2007 | WO2007060895A1 Semiconductor substrate, semiconductor device, and semiconductor substrate manufacturing method |
| 05/31/2007 | WO2007060892A1 Resin encapsulation equipment and resin encapsulation process |
| 05/31/2007 | WO2007060881A1 Method for manufacturing semiconductor device |
| 05/31/2007 | WO2007060878A1 Laser processing method |
| 05/31/2007 | WO2007060877A1 Transparent oxide semiconductor junction |
| 05/31/2007 | WO2007060876A1 Plasma processing apparatus and plasma processing method |
| 05/31/2007 | WO2007060869A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
| 05/31/2007 | WO2007060868A1 Logic block control system and logic block control method |
| 05/31/2007 | WO2007060867A1 Microwave introduction device |
| 05/31/2007 | WO2007060859A1 Polishing fluid for polishing aluminum films and method for polishing aluminum films with the same |
| 05/31/2007 | WO2007060855A1 Bonding sheet sticking equipment and method |
| 05/31/2007 | WO2007060844A1 Substrate processing apparatus, substrate cleaning/drying apparatus, substrate processing method and substrate processing program |
| 05/31/2007 | WO2007060837A1 Method of manufacturing semiconductor device |
| 05/31/2007 | WO2007060834A1 Optical integrator, illumination optical device, exposure device, and device manufacturing method |
| 05/31/2007 | WO2007060812A1 Semiconductor device and method for manufacturing semiconductor device |
| 05/31/2007 | WO2007060806A1 Method for producing epitaxial wafer and epitaxial wafer |
| 05/31/2007 | WO2007060805A1 Conveying apparatus |
| 05/31/2007 | WO2007060803A1 Sheet adhering apparatus and sheet adhering method |
| 05/31/2007 | WO2007060797A1 Semiconductor device and method for manufacturing same |
| 05/31/2007 | WO2007060763A1 Semiconductor device |
| 05/31/2007 | WO2007060745A1 Semiconductor device and method for manufacturing same |
| 05/31/2007 | WO2007060738A1 Semiconductor device |
| 05/31/2007 | WO2007060735A1 Semiconductor device and method for manufacturing same |
| 05/31/2007 | WO2007060724A1 Method for fabricating semiconductor device |
| 05/31/2007 | WO2007060641A1 Method of fabricating self aligned schottky junctions for semiconductors devices |
| 05/31/2007 | WO2007060640A2 Method of forming a self aligned copper capping layer |
| 05/31/2007 | WO2007060314A1 Process for fabricating a flexible electronic device of the screen type, including a plurality of thin-film components |
| 05/31/2007 | WO2007060179A1 Method of manufacturing porous dielectric films having a very low permittivity |
| 05/31/2007 | WO2007060145A1 Process and equipment for bonding by molecular adhesion |
| 05/31/2007 | WO2007059925A1 Apparatus and method for wet-chemical processing of flat, thin substrates in a continuous method |
| 05/31/2007 | WO2007059887A1 Bipolar carrier wafer and mobile bipolar electrostatic wafer arrangement |
| 05/31/2007 | WO2007059750A1 Method for producing a plurality of regularly arranged nanoconnections on a substrate |
| 05/31/2007 | WO2007059734A1 Multi-fin component arrangement and method for producing a multi-fin component arrangement |
| 05/31/2007 | WO2007059578A1 High efficiency solar cell fabrication |
| 05/31/2007 | WO2007059577A1 Metallisation method for thin-film semiconductor structures |
| 05/31/2007 | WO2007059551A1 Low area screen printed metal contact structure and method |
| 05/31/2007 | WO2007043152A9 Semiconductor device and method for manufacturing same |
| 05/31/2007 | WO2007043128A9 Ferroelectric memory, method of manufacturing the same, and method of manufacturing semiconductor device |
| 05/31/2007 | WO2007043116A9 Semiconductor device and its fabrication method |
| 05/31/2007 | WO2007040845A3 A method of forming an oxide layer |
| 05/31/2007 | WO2007038077A3 Compositions and methods for tantalum cmp |
| 05/31/2007 | WO2007038054A3 Apparatus for the removal of an edge polymer from a substrate and methods therefor |
| 05/31/2007 | WO2007037553A9 Process for producing substrate with metal wiring |
| 05/31/2007 | WO2007033829A3 Power semiconductor module and a method for the production thereof |
| 05/31/2007 | WO2007028074A3 Workpiece transfer device |
| 05/31/2007 | WO2007021668A3 Sram cell with separate read-write circuitry |