Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2007
06/14/2007WO2007067982A2 Flip chip mlp with conductive ink
06/14/2007WO2007067838A2 One dimensional nanostructure spiral inductors
06/14/2007WO2007067604A2 Method of making undoped, alloyed and doped chalcogenide films by mocvd processes
06/14/2007WO2007067591A2 Solder deposition and thermal processing of thin-die thermal interface material
06/14/2007WO2007067543A1 System and method for employing infrared illumination for machine vision
06/14/2007WO2007067541A2 Systems and methods for processing a film, and thin films
06/14/2007WO2007067533A2 System and method for frit sealing glass packages
06/14/2007WO2007067458A1 Self-aligned trench field effect transistors with regrown gates and bipolar junction transistors with regrown base contact regions and methods of making
06/14/2007WO2007067384A2 Hermetically sealed glass package and method of manufacture
06/14/2007WO2007067330A2 Leadless semiconductor package and method of manufacture
06/14/2007WO2007067312A1 Magnetic annealing tool heat exchange system and processes
06/14/2007WO2007067086A1 Plasma processing device
06/14/2007WO2007067001A1 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
06/14/2007WO2007066937A1 Method of manufacturing semiconductor device
06/14/2007WO2007066886A1 Silicon wafer for semiconductor with powersupply system on the backside of wafer
06/14/2007WO2007066811A1 Distortion relaxed germanium film, process for producing the same, and multilayered film structure
06/14/2007WO2007066758A1 Substrate holding device, exposure device, exposure method, and device fabrication method
06/14/2007WO2007066716A1 Semiconductor light emitting element and method for manufacturing semiconductor light emitting element
06/14/2007WO2007066700A1 Laser light source device, exposure method, and device
06/14/2007WO2007066692A1 Exposure method, exposure apparatus, and method for manufacturing device
06/14/2007WO2007066690A1 Load port
06/14/2007WO2007066687A1 Temperature measuring method, exposure method, exposure apparatus and method for manufacturing device
06/14/2007WO2007066679A1 Exposure apparatus, exposure method, projection optical system and device manufacturing method
06/14/2007WO2007066661A1 Positive photoresist composition and method of forming photoresist pattern using the same
06/14/2007WO2007066659A1 Surface roughness tester
06/14/2007WO2007066658A1 Method for forming dielectric film
06/14/2007WO2007066653A1 Polysiloxane and radiation-sensitive resin composition
06/14/2007WO2007066643A1 Probe pin, probe card, and probe device
06/14/2007WO2007066628A1 Appearance inspecting device
06/14/2007WO2007066626A1 Electrostatic breakdown protection circuit and semiconductor integrated circuit device provided with same
06/14/2007WO2007066622A1 Probe card
06/14/2007WO2007066610A1 Tape bonding device and tape bonding method
06/14/2007WO2007066609A1 Tape bonding device, mount device, and mount method
06/14/2007WO2007066605A1 Process for producing semiconductor light emitting element
06/14/2007WO2007066597A1 Silicon-containing resist underlying layer film forming composition for formation of photocrosslinking cured resist underlying layer film
06/14/2007WO2007066591A1 Positive resist composition for immersion exposure and method for forming resist pattern
06/14/2007WO2007066582A1 Temperature control apparatus, exposure apparatus, temperature control method and device manufacturing method
06/14/2007WO2007066574A1 Sheet plasma film forming apparatus
06/14/2007WO2007066572A1 Electrode sheet for electrostatic chuck, and electrostatic chuck
06/14/2007WO2007066560A1 Mass body for controlling vibration
06/14/2007WO2007066559A1 Chip mounting apparatus and chip mounting method
06/14/2007WO2007066553A1 Pressure-sensitive adhesive sheet and process for producing electronic part therewith
06/14/2007WO2007066548A1 Sheet plasma film-forming apparatus
06/14/2007WO2007066536A1 Loading tray and thin-plate holding container
06/14/2007WO2007066511A1 Film forming apparatus and method of forming film
06/14/2007WO2007066472A1 Gas head and thin-film production apparatus
06/14/2007WO2007066457A1 Double side grinding machine for semiconductor wafer, static pressure pad, and double side grinding method using such static pressure pad
06/14/2007WO2007066418A1 Retainer ring for cmp device
06/14/2007WO2007066404A1 Semiconductor manufacturing device, its controlling system and its controlling method
06/14/2007WO2007066400A1 Semiconductor device
06/14/2007WO2007066396A1 Semiconductor device and method of analyzing failures
06/14/2007WO2007066384A1 Semiconductor wafer storage case and method of storing wafers
06/14/2007WO2007066314A1 Magnetic annealing tool heat exchange system and processes
06/14/2007WO2007066277A2 A method of forming a layer over a surface of a first material embedded in a second material in a structure for a semiconductor device
06/14/2007WO2007066037A1 Resistance in an integrated circuit
06/14/2007WO2007065953A1 Isolation trench intersection structure with reduced gap width
06/14/2007WO2007065936A1 A sealed enclosure for transporting and storing semiconductor substrates
06/14/2007WO2007065658A2 Method for dry chemical treatment of substrates and use thereof
06/14/2007WO2007065305A1 A method of fabricating solar cell
06/14/2007WO2007050754A3 Stackable wafer or die packaging with enhanced thermal and device performance
06/14/2007WO2007047390A3 Integration process flow for flash devices
06/14/2007WO2007044232A3 Pre-treatment to eliminate the defects formed during electrochemical plating
06/14/2007WO2007038263A3 Ozonation for elimination of bacteria for wet processing systems
06/14/2007WO2007038096A3 Discontinuous conveyor system
06/14/2007WO2007035050B1 Sputtering deposition device
06/14/2007WO2007030343A3 Silicided recessed silicon
06/14/2007WO2007026010A3 Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
06/14/2007WO2007024433B1 Method for the manufacture of a strained silicon-on-insulator structure
06/14/2007WO2007021849A3 Variable reflectivity coatings with constant optical thickness and phase
06/14/2007WO2006130360A3 Improved amorphization/templated recrystallization method for hybrid orientation substrates
06/14/2007WO2006127107A3 Semiconductor package and method for forming the same
06/14/2007WO2006101947A3 Chemical-mechanical polishing endpoint detection
06/14/2007WO2006083401A3 Method of making a planar double-gated transistor
06/14/2007WO2006073437A3 Photovoltaic thin-film cell produced from metallic blend using high-temperature printing
06/14/2007WO2006068654A3 Systems and methods for nanowire growth and manufacturing
06/14/2007WO2006065759A3 Dual stressed soi substrates
06/14/2007WO2006041656A3 Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency
06/14/2007WO2006014421A3 METHOD FOR WAFER BONDING (Al, In, Ga)N AND Zn(S, Se) FOR OPTOELECTRONIC APPLICATIONS
06/14/2007US20070136711 Layout design apparatus, layout design method, and computer product
06/14/2007US20070136710 Layout design apparatus, layout design method, and computer product
06/14/2007US20070136702 Semiconductor device layout inspection method
06/14/2007US20070135958 Integrated endpoint detection system with optical and eddy current monitoring
06/14/2007US20070135957 Model generating apparatus, model generating system, and fault detecting apparatus
06/14/2007US20070135655 Use of fluorinated additives in the etching or polishing of integrated circuits
06/14/2007US20070135581 Underlayer coating forming composition containing dextrin ester compound
06/14/2007US20070135565 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
06/14/2007US20070135550 Negative thermal expansion material filler for low CTE composites
06/14/2007US20070135543 Hot melt adhesive composition
06/14/2007US20070135322 Substrate surface cleaning liquid medium and cleaning method
06/14/2007US20070135072 Wireless communication system
06/14/2007US20070135022 Apparatus for reduction of defects in wet procssed layers
06/14/2007US20070135020 Polishing apparatus and polishing method
06/14/2007US20070134943 Subtractive - Additive Edge Defined Lithography
06/14/2007US20070134942 Hafnium tantalum titanium oxide films
06/14/2007US20070134941 Structure and method to prevent charge damage from e-beam curing process
06/14/2007US20070134940 Substrate processing method, photomask manufacturing method, photomask, and device manufacturing method
06/14/2007US20070134939 Fabrication of enclosed nanochannels using silica nanoparticles
06/14/2007US20070134938 Plasma processing method, storage medium storing program for implementing the method, and plasma processing apparatus
06/14/2007US20070134937 Inhibiting underfill flow using nanoparticles
06/14/2007US20070134936 Method for fabricating semiconductor device
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