Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2007
06/07/2007US20070129839 System for controlling semiconductor device manufacturing process and method of controlling semiconductor device manufacturing process
06/07/2007US20070128985 Method of polishing work
06/07/2007US20070128890 Stacked annealing system
06/07/2007US20070128889 Substrate heat treatment apparatus
06/07/2007US20070128888 Substrate heat treatment apparatus
06/07/2007US20070128887 Spin-on glass passivation process
06/07/2007US20070128886 Substrate, method for producing the same, and patterning process using the same
06/07/2007US20070128885 Method for fabricating a semiconductor device
06/07/2007US20070128884 Metal oxynitride electrode catalyst
06/07/2007US20070128883 Carbon nanotube reinforced metallic layer
06/07/2007US20070128882 Advanced low dielectric constant organosilicon plasma chemical vapor deposition films
06/07/2007US20070128881 Adhesion by plasma conditioning of semiconductor chip surfaces
06/07/2007US20070128880 Process and apparatus for forming oxide film, and electronic device material
06/07/2007US20070128879 Reactive cyclodextrin derivatives as pore-forming templates, and low dielectric materials prepared by using the same
06/07/2007US20070128878 Substrate processing apparatus and method for producing a semiconductor device
06/07/2007US20070128877 Polymer coating for vapor deposition tool
06/07/2007US20070128876 Chamber dry cleaning
06/07/2007US20070128875 Dry etch release method for micro-electro-mechanical systems (MEMS)
06/07/2007US20070128874 Chemical mechanical polishing method and method of manufacturing semiconductor device
06/07/2007US20070128873 Aqueous dispersion for cmp, polishing method and method for manufacturing semiconductor device
06/07/2007US20070128872 Polishing composition and polishing method
06/07/2007US20070128871 Etching apparatus and etching method
06/07/2007US20070128870 Surface Topology Improvement Method for Plug Surface Areas
06/07/2007US20070128869 Method and apparatus for annealing copper films
06/07/2007US20070128868 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
06/07/2007US20070128867 Method for enhanced uni-directional diffusion of metal and subsequent silicide formation
06/07/2007US20070128866 Apparatus for fabricating tungsten contacts with tungsten nitride barrier layers in semiconductor devices
06/07/2007US20070128865 Method of forming insulating film, method of manufacturing semiconductor device and their controlling computer program
06/07/2007US20070128864 Apparatus and process for plasma-enhanced atomic layer deposition
06/07/2007US20070128863 Apparatus and process for plasma-enhanced atomic layer deposition
06/07/2007US20070128862 Apparatus and process for plasma-enhanced atomic layer deposition
06/07/2007US20070128861 CVD apparatus for depositing polysilicon
06/07/2007US20070128860 Method and apparatus for improving breakdown voltage of integrated circuits formed using a dielectric layer process
06/07/2007US20070128859 Combined Stepper And Deposition Tool
06/07/2007US20070128858 Method of producing thin films
06/07/2007US20070128857 Method for manufacturing copper wires on substrate of flat panel display device
06/07/2007US20070128856 Pitch reduced patterns relative to photolithography features
06/07/2007US20070128855 Printed wiring board and method for manufacturing the same
06/07/2007US20070128854 Near-field optical probe based on SOI substrate and fabrication method thereof
06/07/2007US20070128853 Method for forming inter-layer dielectric of low dielectric constant and method for forming copper wiring using the same
06/07/2007US20070128852 Method for manufacturing semiconductor device having via holes
06/07/2007US20070128851 Fabrication of semiconductor interconnect structures
06/07/2007US20070128850 Method for manufacturing semiconductor device by using dual damascene process and method for manufacturing article having communicating hole
06/07/2007US20070128849 Waferless automatic cleaning after barrier removal
06/07/2007US20070128848 Dual damascene wiring and method
06/07/2007US20070128847 Semiconductor device and a method for manufacturing the same
06/07/2007US20070128846 Integrated circuit device gate structures and methods of forming the same
06/07/2007US20070128845 Interconnect structure of an integrated circuit and manufacturing method thereof
06/07/2007US20070128844 Non-polar (a1,b,in,ga)n quantum wells
06/07/2007US20070128843 Manufacturing method of workpiece
06/07/2007US20070128842 Method for fabricating semiconductor device
06/07/2007US20070128841 Solid-state image capturing device, manufacturing method for the same and electronic information device
06/07/2007US20070128840 Method of forming thin sgoi wafers with high relaxation and low stacking fault defect density
06/07/2007US20070128839 Quantum dot laser diode and method of manufacturing the same
06/07/2007US20070128838 Method for producing SOI substrate and SOI substrate
06/07/2007US20070128837 Semiconductor processing
06/07/2007US20070128836 Manufacturing method of semiconductor wafer and semiconductor wafer manufactured by this method
06/07/2007US20070128835 Semiconductor package structure and method for separating package of wafer level package
06/07/2007US20070128834 Wafer dividing method
06/07/2007US20070128833 Manufacturing method of semiconductor device
06/07/2007US20070128832 Supporting plate, and method for attaching supporting plate
06/07/2007US20070128831 Process for fabricating a micro-electro-mechanical system with movable components
06/07/2007US20070128830 Method for producing dislocation-free strained crystalline films
06/07/2007US20070128829 Method for fabricating thin layer device
06/07/2007US20070128828 Micro electro-mechanical system packaging and interconnect
06/07/2007US20070128827 Method and system for increasing yield of vertically integrated devices
06/07/2007US20070128826 Article with multilayered coating and method for manufacturing same
06/07/2007US20070128825 Method for bonding substrates and device for bonding substrates
06/07/2007US20070128824 Double-sided etching method using embedded alignment mark
06/07/2007US20070128823 Method of fabricating semiconductor integrated circuit device
06/07/2007US20070128822 Varistor and production method
06/07/2007US20070128821 System and method for implementing transformer on package substrate
06/07/2007US20070128820 Apparatus and method of fabricating a MOSFET transistor having a self-aligned implant
06/07/2007US20070128819 Film forming method and method of manufacturing semiconductor device
06/07/2007US20070128818 Method and system for hermetically sealing packages for optics
06/07/2007US20070128817 Method for the production of transistor structures with ldd
06/07/2007US20070128816 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same
06/07/2007US20070128815 Nonvolatile semiconductor memory and fabrication method for the same
06/07/2007US20070128814 Semiconductor device
06/07/2007US20070128813 Silicon-on-insulator (soi) read only memory (rom) array and method of making a soi rom
06/07/2007US20070128812 Method of manufacturing a semiconductor integrated circuit using a selective disposable spacer technique and semiconductor integrated circuit manufactured thereby
06/07/2007US20070128811 Method of forming a low capacitance semiconductor device and structure therefor
06/07/2007US20070128810 Ultra high voltage MOS transistor device and method of making the same
06/07/2007US20070128809 Methods of reducing floating body effect
06/07/2007US20070128808 Method for producing nanowires using a porous template
06/07/2007US20070128807 Piston ring and method for the production thereof
06/07/2007US20070128806 High performance CMOS transistors using PMD liner stress
06/07/2007US20070128805 Semiconductor memory device and method for fabricating the same
06/07/2007US20070128804 Method for Fabricating Isolation Structures for Flash Memory Semiconductor Devices
06/07/2007US20070128803 Nonvolatile semiconductor memory device
06/07/2007US20070128802 Nonvolatile semiconductor memory and manufacturing method thereof
06/07/2007US20070128801 Electrically erasable programmable read-only memory cell and memory device and manufacturing method thereof
06/07/2007US20070128800 Use of chlorine to fabricate trench dielectric in integrated circuits
06/07/2007US20070128799 Method of fabricating flash memory
06/07/2007US20070128798 Nonvolatile memory device and method for fabricating the same
06/07/2007US20070128797 Flash memory device and method for fabricating the same
06/07/2007US20070128796 Method for manufacturing non-volatile memory
06/07/2007US20070128795 Semiconductor memory device and method for fabricating the same
06/07/2007US20070128794 Monolithic ceramic capacitor and method for adjusting equivalent series resistance thereof
06/07/2007US20070128793 Capacitor device of a semiconductor
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