Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2007
06/19/2007US7232770 High temperature and chemical resistant process for wafer thinning and backside processing
06/19/2007US7232769 Method of forming amorphous silica-based coating film with low dielectric constant and thus obtained silica-based coating film
06/19/2007US7232768 Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials
06/19/2007US7232767 Slotted electrostatic shield modification for improved etch and CVD process uniformity
06/19/2007US7232766 System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
06/19/2007US7232765 Utilization of a Ta-containing cap over copper to facilitate concurrent formation of copper vias and memory element structures
06/19/2007US7232764 Semiconductor device fabrication method
06/19/2007US7232763 Method of manufacturing semiconductor device
06/19/2007US7232762 Method for forming an improved low power SRAM contact
06/19/2007US7232761 Method of chemical mechanical polishing with high throughput and low dishing
06/19/2007US7232760 Method for producing semiconductor device, polishing apparatus, and polishing method
06/19/2007US7232759 Providing a silicon germanium substrate; andapplying a solution to the silicon germanium substrate, solution consisting of ammonium hydroxide (NH4OH), water (H2O), a chelating agent, and a surfactant for cleaning
06/19/2007US7232758 Method of correcting lithographic process and method of forming overlay mark
06/19/2007US7232757 Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device
06/19/2007US7232756 Nickel salicide process with reduced dopant deactivation
06/19/2007US7232755 Process for fabricating pad frame and integrated circuit package
06/19/2007US7232754 Microelectronic devices and methods for forming interconnects in microelectronic devices
06/19/2007US7232753 Method of fabricating semiconductor device
06/19/2007US7232752 Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation
06/19/2007US7232751 Semiconductor device and manufacturing method therefor
06/19/2007US7232750 Methods involving spin-on polymers that reversibly bind charge carriers
06/19/2007US7232749 Integrated circuit inductane and the fabrication method thereof
06/19/2007US7232748 BARC/resist via etchback process
06/19/2007US7232747 Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation
06/19/2007US7232746 Method for forming dual damascene interconnection in semiconductor device
06/19/2007US7232745 Body capacitor for SOI memory description
06/19/2007US7232744 Method for implanting dopants within a substrate by tilting the substrate relative to the implant source
06/19/2007US7232743 Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same
06/19/2007US7232742 Method of manufacturing a semiconductor device that includes forming a material with a high tensile stress in contact with a semiconductor film to getter impurities from the semiconductor film
06/19/2007US7232741 Wafer dividing method
06/19/2007US7232740 Method for bumping a thin wafer
06/19/2007US7232739 Multifunctional metallic bonding
06/19/2007US7232738 Device and method for cutting an assembly
06/19/2007US7232737 Treatment of a removed layer of silicon-germanium
06/19/2007US7232736 Semiconductor devices with capacitors of metal/insulator/metal structure and methods for forming the same
06/19/2007US7232735 Semiconductor device having a cylindrical capacitor and method for manufacturing the same using a two-layer structure and etching to prevent blockage
06/19/2007US7232734 Radiation emitting semiconductor device and method of manufacturing such a device
06/19/2007US7232733 Method of forming an integrated circuit incorporating higher voltage devices and low voltage devices therein
06/19/2007US7232732 Semiconductor device with a toroidal-like junction
06/19/2007US7232731 Method for fabricating transistor of semiconductor device
06/19/2007US7232730 Method of forming a locally strained transistor
06/19/2007US7232729 Method for manufacturing a double bitline implant
06/19/2007US7232728 High quality oxide on an epitaxial layer
06/19/2007US7232727 Method for fabricating semiconductor device with recessed channel region
06/19/2007US7232726 Trench-gate semiconductor device and method of manufacturing
06/19/2007US7232725 Split gate memory device and fabricating method thereof
06/19/2007US7232724 Radical oxidation for bitline oxide of SONOS
06/19/2007US7232723 Method of fabricating semiconductor device
06/19/2007US7232722 Method of making a multibit non-volatile memory
06/19/2007US7232721 Structures and methods for enhancing capacitors in integrated circuits
06/19/2007US7232720 Method for fabricating a semiconductor device having an insulation film with reduced water content
06/19/2007US7232719 Memories having a charge storage node at least partially located in a trench in a semiconductor substrate and electrically coupled to a source/drain region formed in the substrate
06/19/2007US7232718 Method for forming a deep trench capacitor buried plate
06/19/2007US7232717 Method of manufacturing non-volatile DRAM
06/19/2007US7232716 Display device and method for manufacturing the same
06/19/2007US7232715 Method for fabricating semiconductor film and semiconductor device and laser processing apparatus
06/19/2007US7232714 Semiconductor device
06/19/2007US7232713 Methods of forming interconnect lines
06/19/2007US7232712 CMOS image sensor and method for fabricating the same
06/19/2007US7232711 Method and structure to prevent circuit network charging during fabrication of integrated circuits
06/19/2007US7232710 Method of making cascaded die mountings with springs-loaded contact-bond options
06/19/2007US7232709 Process for producing a semiconductor device
06/19/2007US7232708 Multi-mode integrated circuit structure
06/19/2007US7232707 Method of making a semiconductor chip assembly with an interlocked contact terminal
06/19/2007US7232706 Method of making a semiconductor chip assembly with a precision-formed metal pillar
06/19/2007US7232705 Integrated circuit bond pad structures and methods of making
06/19/2007US7232704 Semiconductor device assembly method and semiconductor device assembly apparatus
06/19/2007US7232703 Non-volatile memory and the fabrication method
06/19/2007US7232702 Dual panel type organic electroluminescent device and method of fabricating the same
06/19/2007US7232701 Microelectromechanical (MEM) device with a protective cap that functions as a motion stop
06/19/2007US7232700 Integrated all-Si capacitive microgyro with vertical differential sense and control and process for preparing an integrated all-Si capacitive microgyro with vertical differential sense
06/19/2007US7232699 Method of making a high precision microelectromechanical capacitor with programmable voltage source
06/19/2007US7232698 Method for fabricating CMOS image sensor protecting low temperature oxide delamination
06/19/2007US7232697 Semiconductor device having enhanced photo sensitivity and method for manufacture thereof
06/19/2007US7232696 Semiconductor integrated circuit and method for detecting soft defects in static memory cell
06/19/2007US7232694 System and method for active array temperature sensing and cooling
06/19/2007US7232693 Method for manufacturing ferroelectric memory
06/19/2007US7232692 Photo-imaged stress management layer for semiconductor devices
06/19/2007US7232651 Optical recording materials
06/19/2007US7232643 Composition of a resin which contains an acid dissociable dissolution inhibiting group, an acid generator and a cycloalkylester or ether substituted triphenyl methane compound; semiconductor elements and liquid crystal display elements
06/19/2007US7232621 magnetic recording media comprising ferromagnetic recording segments formed on substrates and having antiferromagnetic seperators, used for high density recording
06/19/2007US7232591 Method of using an adhesive for temperature control during plasma processing
06/19/2007US7232555 Alleviated cracking and improved utilization rate and cost effectiveness; preferably both of the principal faces of the wafer are mirror-polished and the peripheral edge is ground.
06/19/2007US7232552 Apparatus for decomposing perfluorinated compounds and system for processing perfluorinated compounds using the apparatus
06/19/2007US7232529 Oxidizing agent; water; a protective film-forming agent; and a water-soluble polymer, especially alginic acid, pectic acid, agar, curdlan, pullulan, polyvinyl pyrrolidone or polyacrolein; useful in forming wirings of semiconductors
06/19/2007US7232528 Surface treatment agent for copper and copper alloy
06/19/2007US7232526 Method and apparatus for controlling material removal from semiconductor substrate using induced current endpointing
06/19/2007US7232514 Minimizing damage to the surface to remove conductive materials by an electrochemical polishing technique using an acid-based electrolyte, chelating agent, corrosion inhibitor, acid salt; buffer, oxidizer and solvents; semiconductors
06/19/2007US7232502 Sheet-fed treating device
06/19/2007US7232492 Method of forming thin film for improved productivity
06/19/2007US7232488 Method of fabrication of a substrate for an epitaxial growth
06/19/2007US7232484 Method and apparatus for doping semiconductors
06/19/2007US7232328 Insert and electronic component handling apparatus provided with the same
06/19/2007US7232286 Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber
06/19/2007US7232284 Device for loading substrates into and unloading them from a clean room
06/19/2007US7232257 Hydrostatic bearing and stage apparatus using same
06/19/2007US7232233 Catoptric reduction projection optical system and exposure apparatus using the same
06/19/2007US7232037 LCD glass cassette
06/19/2007US7231712 Method of manufacturing a module
06/14/2007WO2007067998A2 Device and method for assembling a top and bottom exposed packaged semiconductor
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