| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 06/14/2007 | US20070131653 Methods and apparatus for processing a substrate |
| 06/14/2007 | US20070131652 Plasma etching method |
| 06/14/2007 | US20070131651 Radical generating method, etching method and apparatus for use in these methods |
| 06/14/2007 | US20070131650 Plasma chamber wall segment temperature control |
| 06/14/2007 | US20070131649 Etching method |
| 06/14/2007 | US20070131645 Method of making an electronic device cooling system |
| 06/14/2007 | US20070131557 low-resistance; improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) |
| 06/14/2007 | US20070131537 System and method for performing semiconductor processing on target substrate |
| 06/14/2007 | US20070131354 Plasma processing apparatus |
| 06/14/2007 | US20070131349 Method for manufacturing an electronic module, and an electronic module |
| 06/14/2007 | US20070131344 Mounting apparatus and mounting method |
| 06/14/2007 | US20070131278 Electrode stacks for electroactive devices and methods of fabricating the same |
| 06/14/2007 | US20070131256 Substrate cleaning method, substrate cleaning apparatus and computer readable recording medium |
| 06/14/2007 | US20070131246 Substrate processing method and substrate processing apparatus |
| 06/14/2007 | US20070131245 Method of cleaning plasma etching apparatus, and thus-cleanable plasma etching apparatus |
| 06/14/2007 | US20070131244 Method and apparatus for removing minute particles from a surface |
| 06/14/2007 | US20070131173 Wafer support system |
| 06/14/2007 | US20070131170 Plasma CVD apparatus, and method for forming film and method for forming semiconductor device using the same |
| 06/14/2007 | US20070131167 Substrate processing apparatus and lid supporting apparatus for the substrate processing apparatus |
| 06/14/2007 | US20070130763 Method of fabricating electrical connection terminal of embedded chip |
| 06/14/2007 | US20070130759 Semiconductor device package leadframe formed from multiple metal layers |
| 06/14/2007 | US20070130745 Die storage tray having machined grooves and vacuum channels |
| 06/14/2007 | US20070130739 Method for fabricating piezoelectric element |
| 06/14/2007 | US20070130738 Vacuum processing apparatus and zonal airflow generating unit |
| 06/14/2007 | DE19957326B4 Verfahren zur Herstellung von Kontaktstrukturen A method for producing contact structures |
| 06/14/2007 | DE19837336B4 Verfahren zur Herstellung einer Platte von gekapselten integrierten Schaltkreisen und Form zum Kapseln eines plattenförmigen Substrats von integrierten Schaltkreisen A method for manufacturing a plate of the encapsulated integrated circuits and to form capsules of a plate-shaped substrate of integrated circuits |
| 06/14/2007 | DE19722507B4 Verfahren zur Herstellung einer elektrtrisch leitend mit einer integrierten Schaltung verbundenen Litze integrierte Schaltung mit einem Anschluss und Drehzahlsensor A method for producing a conductive elektrtrisch integrated with an integrated circuit connected to a terminal wire circuit and speed sensor |
| 06/14/2007 | DE19708325B4 Klebeverbindung von elektrisch leitenden Fügeteilen Adhesive bond electrically conductive parts to be joined |
| 06/14/2007 | DE19634617B4 Verfahren zur Herstellung einer Siliziumsolarzelle mit verringerter Rekombination nahe der Solarzellenoberfläche A process for producing a silicon solar cell with reduced recombination close to the solar cell surface |
| 06/14/2007 | DE19620677B4 Verfahren zur Bildung eines SOG-Films bei einem Halbleiterbauelement und Halbleiterbauelement mit einem SOG-Film A method for forming a SOG film in a semiconductor device and semiconductor device comprising an SOG film |
| 06/14/2007 | DE112005001822T5 Verfahren zum Herstellen eines Halbleitersubstrats und Halbleitersubstrat A method for producing a semiconductor substrate and the semiconductor substrate |
| 06/14/2007 | DE112005001733T5 Ultraviolettbestrahlungseinrichtung Ultraviolet irradiation device |
| 06/14/2007 | DE112005001675T5 Leistungshalbleiterbauelement mit einem oberseitigen Drain unter Verwendung eines Sinker-Trenches Power semiconductor device having a top-side drain using a sinker trench |
| 06/14/2007 | DE10248728B4 Heizaggregat für die Herstellung einer Halbleitervorrichtung und dessen Verwendung The heater assembly for the production of a semiconductor device and its use |
| 06/14/2007 | DE102006058002A1 Method of producing a multi-bit flash memory cell and such a cell and device implants ions into channel, forms a dielectric tunnel layer followed by floating and control gates |
| 06/14/2007 | DE102006057352A1 Halbleitervorrichtungen und Verfahren zu ihrer Herstellung Semiconductor devices and processes for their preparation |
| 06/14/2007 | DE102006053943A1 Guide for recirculating bandsaw blade dividing silicon monocrystals to make wafers used in electronics industry, is grooved, water-cushioned, and replaceably dovetail-mounted |
| 06/14/2007 | DE102006052714A1 Laserstrahlbearbeitungsmaschine Laser beam processing machine |
| 06/14/2007 | DE102006047541A1 Mikroelektronisches Bauelement und Verfahren zum Herstellen eines mikroelektronischen Bauelements Microelectronic device and method for manufacturing a microelectronic device |
| 06/14/2007 | DE102006042007A1 Interferometer system, has measurement channel for providing signal indicating measurement along path, and another measurement channel for providing signal indicating measurement having component one direction |
| 06/14/2007 | DE102006035487A1 Gruppe III/Nitrid-basierte Verbindungshalbleitervorrichtung und dessen Herstellungsverfahren Group III / nitride-based compound semiconductor device and its manufacturing method |
| 06/14/2007 | DE102006027656A1 Halbleiterelement, Fertigungsprozess für dieses, Halbleiterlaser und Fertigungsprozess für diesen Semiconductor element manufacturing process for this, semiconductor lasers and manufacturing process for these |
| 06/14/2007 | DE102006025992A1 Sensorchip-Bruchfestigkeits-Inspektionsvorrichtung sowie Verfahren zur Inspektion der Bruchfestigkeit eines Sensorchips Sensor chip breaking strength inspection apparatus and method for inspecting the breaking strength of a sensor chip |
| 06/14/2007 | DE102006001254A1 Verfahren zur Herstellung von Lotkugeln mit einer stabilen Oxidschicht durch Steuern der Aufschmelzumgebung A process for producing solder balls having a stable oxide layer by controlling the Aufschmelzumgebung |
| 06/14/2007 | DE102005061821A1 Verfahren zum Steuern einer Dicke einer ersten Schicht und Verfahren zum Anpassen der Dicke unterschiedlicher erster Schichten A method of controlling a thickness of a first layer and method for adjusting the thickness of different first layers |
| 06/14/2007 | DE102005059035A1 Isolationsgrabenstruktur für hohe Spannungen Grave insulation structure for high voltages |
| 06/14/2007 | DE102005059034A1 Isolationsgrabenstruktur Isolation grave structure |
| 06/14/2007 | DE102005058794A1 Vorrichtung und getaktetes Verfahren zur Drucksinterverbindung Apparatus and method for pulsed pressure sintering connection |
| 06/14/2007 | DE102005058713A1 Verfahren zur trockenchemischen Behandlung von Substraten, sowie dessen Verwendung A process for the dry-chemical treatment of substrates, and the use thereof |
| 06/14/2007 | DE102005058654A1 Verfahren zum flächigen Fügen von Komponenten von Halbleiterbauelementen A method for the planar joining of components of semiconductor devices |
| 06/14/2007 | DE102005058466A1 Semiconductor device manufacture, by diffusing material from diffusion reservoir into channel region to form conductive contact lead-out of shorter length than channel path |
| 06/14/2007 | DE102005058435A1 Semiconductor component with channel stopper, has integrated channel stopper formed in edge zone of semiconductor component |
| 06/14/2007 | DE102005058269A1 Vorrichtung und Verfahren zum Reinigen eines gesägten Waferblocks Apparatus and method for cleaning a sawn wafer block |
| 06/14/2007 | DE102005057255A1 Storage capacitor esp for use in a semiconductor memory cell and having a dielectric layer containing a high k dielectric and silicon |
| 06/14/2007 | DE102005057061B3 Verfahren zum Entfernen einer Passivierungsschicht vor dem Abscheiden einer Barrierenschicht in einer Kupfer-metallisierungsschicht A method for removing a passivation layer prior to depositing a barrier layer in a copper metallization layer |
| 06/14/2007 | DE102005053842A1 Chip components made from semiconductor wafer, include connection elements coplanar with plastic mass, for surface mounting on higher-order circuit board |
| 06/14/2007 | DE102005051819B3 Herstellungsverfahren für Halbleiterstrukturen A method for manufacturing semiconductor structures, |
| 06/14/2007 | DE102005040741B4 Bearbeitungsanlage modularen Aufbaus für flächige Substrate Processing plant modular structure for planar substrates |
| 06/14/2007 | DE102005035735A1 Verfahren und System zum Abschätzen eines Zustands einer nicht initialisierten fortschrittlichen Prozesssteuerung durch Anwendung unterteilter Steuerungsdaten A method and system for estimating a state of a non-initialized advanced process control by use of divided control data |
| 06/14/2007 | DE102005011652B4 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device |
| 06/14/2007 | DE10196082B4 FLIP-CHIP-Montageverfahren Flip-chip mounting method |
| 06/14/2007 | DE10160961B4 Verfahren zur Anlagenanpassung für einen Halbleiterherstellungsprozess A method for plant adaptation for a semiconductor manufacturing process |
| 06/14/2007 | DE10149691B4 Integrierte Halbleiterschaltung mit Varactorbauteilen A semiconductor integrated circuit with Varactorbauteilen |
| 06/14/2007 | CA2632233A1 Self-aligned trench field effect transistors with regrown gates and bipolar junction transistors with regrown base contact regions and methods of making |
| 06/14/2007 | CA2631351A1 Vibration control mass body |
| 06/13/2007 | EP1796442A1 Plasma processing system |
| 06/13/2007 | EP1796267A1 Electronic component |
| 06/13/2007 | EP1796176A2 Field-effect transistor with via electrode and manufacturing method of the same |
| 06/13/2007 | EP1796174A1 Highly dielectric film, and utilizing the same, field-effect transistor and semiconductor integrated circuit apparatus, and process for producing the highly dielectric film |
| 06/13/2007 | EP1796165A2 Method of making an electronic device cooling system |
| 06/13/2007 | EP1796162A2 Circuit element having capacitor and field effect transistor comprising nanowires |
| 06/13/2007 | EP1796161A2 Integrated circuit and method of manufacturing the same |
| 06/13/2007 | EP1796160A1 Semiconductor device, power supply apparatus using the same, and electronic device |
| 06/13/2007 | EP1796159A2 Method for manufacturing a semiconductor device by using a dual damascene process |
| 06/13/2007 | EP1796158A1 Semiconductor manufacturing apparatus |
| 06/13/2007 | EP1796157A1 Semiconductor wafer evaluating method and semiconductor wafer evaluating apparatus |
| 06/13/2007 | EP1796156A1 Flip chip mounting method and flip chip mounting element |
| 06/13/2007 | EP1796155A1 Bump forming method and solder bump |
| 06/13/2007 | EP1796153A1 Ashing method and ashing apparatus |
| 06/13/2007 | EP1796152A1 Cmp polishing agent and method for polishing substrate |
| 06/13/2007 | EP1796151A1 Low work function metal alloy |
| 06/13/2007 | EP1796150A1 METHOD OF VAPOR-PHASE GROWING, AND VAPOR-PHASE GROWING APPARATUS, FOR AlGaN |
| 06/13/2007 | EP1796149A1 Quartz jig and semiconductor manufacturing equipment |
| 06/13/2007 | EP1796148A2 Silicon carbide semiconductor device and method for producing the same |
| 06/13/2007 | EP1796147A1 Lighting apparatus, exposure apparatus and maicrodevice manufacturing method |
| 06/13/2007 | EP1796146A1 Exposure apparatus, exposure method, and method for manufacturing device |
| 06/13/2007 | EP1796145A1 Exposure device, operation decision method, substrate treatment system and maintenance management method, and device manufacturing method |
| 06/13/2007 | EP1796144A1 Stage apparatus and exposure apparatus |
| 06/13/2007 | EP1796143A1 Substrate holder, stage apparatus, and exposure apparatus |
| 06/13/2007 | EP1796142A1 Optical characteristic measuring device, optical characteristic measuring method, exposure device, exposure method, and device manufacturing method |
| 06/13/2007 | EP1796141A1 Method for controlling exposure system, exposure method and system using same, and method for manufacturing device |
| 06/13/2007 | EP1796140A1 Inclination adjusting device and pattern forming device with inclination adjusting function |
| 06/13/2007 | EP1796139A1 Illumination optical equipment, exposure system and method |
| 06/13/2007 | EP1796138A2 Method of making an electronic device cooling system |
| 06/13/2007 | EP1796137A2 Apparatus and clocked method for pressure sintering |
| 06/13/2007 | EP1796136A1 Alignment information display method, program thereof, alignment method, exposure method, device manufacturing method, display system, display device, program, and measurement/inspection device |
| 06/13/2007 | EP1796026A1 A radio frequency device |
| 06/13/2007 | EP1795906A1 Microcontactor probe and electric probe unit |
| 06/13/2007 | EP1795905A1 Microcontactor probe and electric probe unit |
| 06/13/2007 | EP1795627A1 CVD method for forming a porous low dielectric constant SiOCH film |