Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2007
06/12/2007US7229847 Forming electrical contacts to a molecular layer
06/12/2007US7229846 Semiconductor package having an optical device and a method of making the same
06/12/2007US7229845 Automated sourcing of substrate microfabrication defects using defects signatures
06/12/2007US7229843 Device and method for monitoring process exhaust gas, semiconductor manufacturing device, and system and method for controlling semiconductor manufacturing device
06/12/2007US7229838 MEMS actuator and method of manufacture for MEMS particle sorting device
06/12/2007US7229748 Method for forming a micro pattern, micro pattern, method for fabricating a mold for forming the micro pattern through transcription, and mold for forming the micro pattern through transcription
06/12/2007US7229723 Method for forming an opening in a light-absorbing layer on a mask
06/12/2007US7229722 Alternating phase shift mask design for high performance circuitry
06/12/2007US7229693 Low defect density, ideal oxygen precipitating silicon
06/12/2007US7229692 Nanoconduits and nanoreplicants
06/12/2007US7229672 Silica sol, an organic siloxane homopolymer or a copolymer of a siloxane monomer and other monomer; and a polymer from methylsilsesquinoxane, hydrosilsesquinoxane and a hydrophobic organic solvent
06/12/2007US7229572 Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
06/12/2007US7229570 To polish and remove a barrier metal film
06/12/2007US7229569 For manufacturing a wiring using low resistance copper
06/12/2007US7229566 Position detecting method and apparatus
06/12/2007US7229563 Providing a nickel-containing layer overlying a substrate;introducing gas comprising a carbonyl gas and a hydrogen halide gas;forming plasma from said process gas; etching nickel-containing layer by exposing nickel-containing layer to plasma
06/12/2007US7229535 Hydrogen bubble reduction on the cathode using double-cell designs
06/12/2007US7229522 Substrate processing apparatus and substrate processing method
06/12/2007US7229521 Etching system using a deionized water adding device
06/12/2007US7229502 Method of forming a silicon nitride layer
06/12/2007US7229501 Silicon epitaxial wafer and process for manufacturing the same
06/12/2007US7229499 Manufacturing method for semiconductor device, semiconductor device and semiconductor wafer
06/12/2007US7229496 Process for producing silicon single crystal layer and silicon single crystal layer
06/12/2007US7229493 3-5 group compound semiconductor, process for producing the same, and compound semiconductor element using the same
06/12/2007US7229340 Monitoring a metal layer during chemical mechanical polishing
06/12/2007US7229337 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
06/12/2007US7229336 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
06/12/2007US7229273 Imprint lithography template having a feature size under 250 nm
06/12/2007US7229240 Substrate processing apparatus and substrate processing method
06/12/2007US7228865 FRAM capacitor stack clean
06/12/2007US7228623 Process for fabricating a multi layer circuit assembly
06/12/2007US7228622 Electronic device carrier and manufacture tape
06/12/2007CA2351687C Device for increasing heat transfer
06/07/2007WO2007065096A2 Chalcogenide solar cells
06/07/2007WO2007064982A1 Angled implantation for removal of thin film layers
06/07/2007WO2007064812A2 Pulsed-continuous etching
06/07/2007WO2007064501A1 Device with gaps for capacitance reduction
06/07/2007WO2007064499A1 Self-aligned pitch reduction
06/07/2007WO2007064492A1 Dielectric interface for group iii-v semiconductor device
06/07/2007WO2007064488A1 Device with self aligned gaps for capacitance reduction
06/07/2007WO2007064474A1 Multi-operational mode transistor with multiple-channel device structure
06/07/2007WO2007064472A1 Technique for reducing crystal defects in strained transistors by tilted preamorphization
06/07/2007WO2007064471A1 A technique for increasing adhesion of metallization layers by providing dummy vias
06/07/2007WO2007064342A2 Phosphor deposition method and apparatus
06/07/2007WO2007064087A1 Method of fabricating polycrystalline silicon thin film
06/07/2007WO2007064073A1 Bump with multiple vias for semiconductor package, method of fabrication method thereof, and semiconductor package using the same
06/07/2007WO2007064048A1 Semiconductor storage device, method for driving same, and method for manufacturing same
06/07/2007WO2007064012A1 METHOD FOR FORMING Cu FILM
06/07/2007WO2007063991A1 Thin film transistor substrate and display device
06/07/2007WO2007063990A1 Semiconductor device and method for manufacturing same
06/07/2007WO2007063988A1 Semiconductor device and method for manufacturing same
06/07/2007WO2007063987A1 Method for processing/washing with ultra-pure water plasma foams and apparatus for the method
06/07/2007WO2007063985A1 Cleaning liquid for photolithography and method of cleaning substrate therewith
06/07/2007WO2007063966A1 Tft substrate and tft substrate manufacturing method
06/07/2007WO2007063963A1 Semiconductor device
06/07/2007WO2007063962A1 Substrate processing apparatus
06/07/2007WO2007063942A1 Semiconductor surface treatment agent
06/07/2007WO2007063938A1 Method and purification of unsaturated fluorinated carbon compound, method for formation of fluorocarbon film, and method for manufacture of semiconductor device
06/07/2007WO2007063921A1 Method for forming wiring film
06/07/2007WO2007063908A1 Semiconductor device and method for manufacturing same
06/07/2007WO2007063873A1 Polishing method and polishing apparatus
06/07/2007WO2007063841A1 Method of heat treatment and heat treatment apparatus
06/07/2007WO2007063838A1 Substrate processing apparatus and method for manufacturing semiconductor device
06/07/2007WO2007063804A1 Wafer cleaning apparatus
06/07/2007WO2007063767A1 Cleaning solution for semiconductor device or display device, and cleaning method
06/07/2007WO2007063746A1 Cleaning apparatus and method of cleaning
06/07/2007WO2007063721A1 Positive photosensitive resin composition, and semiconductor device and display using same
06/07/2007WO2007063718A1 Nonvolatile memory device
06/07/2007WO2007063708A1 Plasma treatment device
06/07/2007WO2007063677A1 Method for grinding surface of semiconductor wafer and method for manufacturing semiconductor wafer
06/07/2007WO2007063673A1 Resin-sealed molding apparatus with sealing means, and method of dismounting constituent part of die assembly fitted therein
06/07/2007WO2007063602A1 Semiconductor device and its manufacturing method
06/07/2007WO2007063576A1 Method of detaching resist and resist detaching apparatus
06/07/2007WO2007063573A1 Semiconductor device and method for fabricating the same
06/07/2007WO2007062590A1 Low density drain hemts
06/07/2007WO2007044429A3 Linear and cross-linked high molecular weight polysilanes, polygermanes, and copolymers thereof, compositions containing the same, and methods of making and using such compounds and compositions
06/07/2007WO2007044190A3 Semiconductor device having nano-pillars and method therefor
06/07/2007WO2007043419A9 Transistor element, display device and these manufacturing methods
06/07/2007WO2007043355A9 Method of mounting electronic components
06/07/2007WO2007043340A9 Semiconductor device
06/07/2007WO2007043319A9 Semiconductor device
06/07/2007WO2007043285A9 Manufacturing method of semiconductor device
06/07/2007WO2007042520A3 Self-organized pin-type nanostructures, and production thereof on silicon
06/07/2007WO2007029178A3 Method of manufacturing a semiconductor device with an isolation region and a device manufactured by the method
06/07/2007WO2007028898B1 Mechanochemical polishing composition, method for preparing and using same
06/07/2007WO2007022471A3 Substrate support having brazed plates and heater
06/07/2007WO2007021716A3 Abrasive-free polishing system
06/07/2007WO2007018918A3 Nitride-based transistors and fabrication methods with an etch stop layer
06/07/2007WO2007018821A3 Dual-gate device and method
06/07/2007WO2007008171A3 Integrated circuit device and method of manufacturing thereof
06/07/2007WO2007002915A3 Slurry for chemical mechanical polishing of aluminum
06/07/2007WO2006104582A3 Method and system for increasing tensile stress in a thin film using collimated electromagnetic radiation
06/07/2007WO2006071724A3 Mtj elements with high spin polarization layers configured for spin-transfer switching and spintronics devices using the magnetic elements
06/07/2007WO2006071341A3 Method and apparatus to determine consumable part condition
06/07/2007WO2006063153A3 Multiple-wavelength laser micromachining of semiconductor devices
06/07/2007WO2006055937A3 Systems and methods for achieving isothermal batch processing of substrates used for the production of micro-electro-mechanical systems
06/07/2007WO2006044349A3 Planar substrate devices integrated with finfets and method of manufacture
06/07/2007WO2006031956A3 Multi-single wafer processing apparatus
06/07/2007WO2006029160A3 Copper processing using an ozone-solvent solution
06/07/2007WO2005062944A3 Method of manufacturing self-aligned non-volatile memory device