Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2007
06/28/2007WO2007072405A2 Semiconductor device with recessed field plate and method of manufacturing the same
06/28/2007WO2007072304A2 Integrated high voltage diode and manufacturing method therefof
06/28/2007WO2007072292A1 Asymmetrical field-effect semiconductor device with sti region
06/28/2007WO2007072247A2 An improved lift-off technique suitable for nanometer-scale patterning of metal layers
06/28/2007WO2007072023A1 Semiconductor device and method of manufacture thereof
06/28/2007WO2007071787A1 Process for simplification of a finishing sequence and structure obtained by the process
06/28/2007WO2007071772A1 Method for the manufacture of substrates, in particular for the optical, electronic or optoelectronic areas, and the substrate obtained in accordance with the said method
06/28/2007WO2007071771A1 Method for making a composite substrate and composite substrate according to said method
06/28/2007WO2007071696A1 Process for the collective fabrication of 3d electronic modules
06/28/2007WO2007071555A1 Reduced-resistance finfets and methods of manufacturing the same
06/28/2007WO2007071491A1 Thinned image sensor having trench-isolated contact pads
06/28/2007WO2007071353A1 Imaging device in a projection exposure machine
06/28/2007WO2007053281A3 Mems actuator and method of manufacture for mems particle sorting device
06/28/2007WO2007043709A9 Method and apparatus for manufacturing semiconductor device
06/28/2007WO2007041199A3 Polishing slurries and methods for utilizing same
06/28/2007WO2007030231A3 Registration mark within an overlap of dopant regions
06/28/2007WO2007027740A3 Heat sink assembly and related methods for semiconductor vacuum processing systems
06/28/2007WO2007027380A3 Mems package and method of forming the same
06/28/2007WO2007021029A3 Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method
06/28/2007WO2007019455A3 Copper barrier reflow process employing high speed optical annealing
06/28/2007WO2007014882A3 Low-k interlevel dielectric materials and method of forming low-k interlevel dielectric layers and structures
06/28/2007WO2007002151A3 Packaging technique for the fabrication of polarized light emitting diodes
06/28/2007WO2006138628A3 Method for activating nitride surfaces for amine-reactive chemistry
06/28/2007WO2006127157A3 Method of transferring a thin crystalline semiconductor layer
06/28/2007WO2006124295A3 Backside method and system for fabricating semiconductor components with conductive interconnects
06/28/2007WO2006115649A3 Multi-chip module and method of manufacture
06/28/2007WO2006102539A3 Method and system for electroprocessing conductive layers
06/28/2007WO2006076083A3 Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
06/28/2007WO2006055145A3 Current collimation for thin seed and direct plating
06/28/2007WO2006029651A9 Method of manufacturing a silicon dioxide layer
06/28/2007WO2005122264A3 Method and process intermediate for electrostatic discharge protection in flat panel imaging detectors
06/28/2007WO2005112094A3 Method for making a semiconductor structure using silicon germanium
06/28/2007WO2004102622A3 Screen print under-bump metalization (ubm) to produce low cost flip chip substrate
06/28/2007WO2004051724A8 Silica glass jig used in process for manufacturing semiconductor and method of manufacturing silica glass jig
06/28/2007US20070150850 Photomask evaluation method, photomask evaluation apparatus, and semiconductor device manufacturing method
06/28/2007US20070150218 Timing analysis apparatus and method of timing analysis
06/28/2007US20070149086 Excimer lamp and ultraviolet-rays irradiation apparatus having the same
06/28/2007US20070148991 Method of fabricating nanodevices
06/28/2007US20070148990 Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby
06/28/2007US20070148989 Method of Manufacturing Semiconductor Device
06/28/2007US20070148988 Fabrication method for alignment film
06/28/2007US20070148987 Passivation layer for semiconductor device and manufacturing method thereof
06/28/2007US20070148986 Semiconductor device and method for manufacturing same
06/28/2007US20070148985 Method of manufacturing trench structure for device
06/28/2007US20070148984 Method for integrated circuit fabrication using pitch multiplication
06/28/2007US20070148983 Method for Manufacturing Semiconductor Device
06/28/2007US20070148982 Methods of forming semiconductor constructions
06/28/2007US20070148981 Electronic micromodule and method for manufacturing the same
06/28/2007US20070148980 Method for fabricating semiconductor device with bulb-shaped recess gate
06/28/2007US20070148979 Method for fabricating semiconductor device having top round recess pattern
06/28/2007US20070148977 Method of forming thin insulating layer in mram device
06/28/2007US20070148976 Method for Manufacturing Image Sensor
06/28/2007US20070148975 Method for realizing a multispacer structure, use of said structure as a mold and circuital architectures obtained from said mold
06/28/2007US20070148974 Hardmask compositions for resist underlayer films
06/28/2007US20070148973 Fabrication of semiconductor device for flash memory with increased select gate width
06/28/2007US20070148972 Method of repairing seed layer for damascene interconnects
06/28/2007US20070148971 Method of substrate manufacture that decreases the package resistance
06/28/2007US20070148970 Method of fabricating circuitry without conductive circle
06/28/2007US20070148969 Method for manufacturing semiconductor device
06/28/2007US20070148968 Method of forming self-aligned double pattern
06/28/2007US20070148967 Method for Manufacturing Semiconductor Device
06/28/2007US20070148966 Method of forming an interconnect structure
06/28/2007US20070148965 Method and composition for plasma etching of a self-aligned contact opening
06/28/2007US20070148964 Method for forming contact hole in semiconductor device
06/28/2007US20070148963 Semiconductor devices incorporating carbon nanotubes and composites thereof
06/28/2007US20070148962 Single, multi-walled, functionalized and doped carbon nanotubes and composites thereof
06/28/2007US20070148961 Semiconductor device and method for manufacturing the same
06/28/2007US20070148960 Semiconductor device and method for manufacturing the same
06/28/2007US20070148959 Method of manufacturing a semiconductor device having a pre-metal dielectric liner
06/28/2007US20070148958 Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
06/28/2007US20070148957 Method of manufacturing metal insulating layer in semiconductor device
06/28/2007US20070148956 Method of forming fuse region in semiconductor damascene process
06/28/2007US20070148955 Method for forming metal lines in a semiconductor device
06/28/2007US20070148954 Method of manufacturing semiconductor device
06/28/2007US20070148953 Method for fabricating semiconductor device and method for fabricating magnetic head
06/28/2007US20070148952 Conformal electroless deposition of barrier layer materials
06/28/2007US20070148951 System and method for flip chip substrate pad
06/28/2007US20070148950 Object and bonding method thereof
06/28/2007US20070148949 Nanostructure-based package interconnect
06/28/2007US20070148948 Image forming system, image forming apparatus and device, and recording medium
06/28/2007US20070148947 Semi-conductor device with inductive component and method of making
06/28/2007US20070148946 Multi-layered metal wiring structure of semiconductor device and manufacturing method thereof
06/28/2007US20070148945 Method for forming a fine pattern of a semiconductor device
06/28/2007US20070148944 Interconnection of Semiconductor Device and Method for Manufacturing the Same
06/28/2007US20070148943 Method for manufacturing semiconductor device
06/28/2007US20070148942 Method for fabricating contact hole of semiconductor device
06/28/2007US20070148941 Microelectronic component with photo-imageable substrate
06/28/2007US20070148940 Method for manufacturing a semiconductor device
06/28/2007US20070148939 Low leakage heterojunction vertical transistors and high performance devices thereof
06/28/2007US20070148938 Semiconductor device and method for fabricating the same
06/28/2007US20070148937 Semiconductor device and manufacturing method of semiconductor device
06/28/2007US20070148936 Manufacturing method of semiconductor device
06/28/2007US20070148935 Implantation of gate regions in semiconductor device fabrication
06/28/2007US20070148934 Method for fabricating semiconductor device with bulb shaped recess gate pattern
06/28/2007US20070148933 Nonvolatile memory device and method of fabricating the same
06/28/2007US20070148932 Systems and methods for forming niobium and/or vanadium containing layers using atomic layer deposition
06/28/2007US20070148931 Semiconductor device and method of fabricating the same
06/28/2007US20070148930 Method of manufacturing a multilayered doped conductor for a contact in an integrated circuit device
06/28/2007US20070148929 Method for Manufacturing CMOS Image Sensor
06/28/2007US20070148928 Apparatus and Method for Manufacturing Semiconductor Device
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