Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/05/2007US20070155081 Method for Manufacturing CMOS Image Sensor
07/05/2007US20070155080 Thim film transistor substrate and manufacturing method thereof
07/05/2007US20070155079 Gate structure of semiconductor device and method of manufacturing the same
07/05/2007US20070155078 Semiconductor device and method for manufacturing the same
07/05/2007US20070155077 Memory Cell Array
07/05/2007US20070155076 Method for fabricating saddle type fin transistor
07/05/2007US20070155075 Method for forming fin transistor
07/05/2007US20070155074 Method for fabricating semiconductor device to lower source/drain sheet resistance
07/05/2007US20070155073 Method of forming device having a raised extension region
07/05/2007US20070155072 Method for fabricating a MESFET
07/05/2007US20070155071 Method of reducing edge height at the overlap of a layer deposited on a stepped substrate
07/05/2007US20070155070 Semiconductor device and method for manufacturing the same
07/05/2007US20070155069 Laser level
07/05/2007US20070155068 Method for fabricating thin film transistor substrate
07/05/2007US20070155067 Method of fabricating polycrystalline silicon film and method of fabricating thin film transistor using the same
07/05/2007US20070155066 Hemi-spherical structure and method for fabricating the same
07/05/2007US20070155065 Statistical circuit design with carbon nanotubes
07/05/2007US20070155064 Method for manufacturing carbon nano-tube FET
07/05/2007US20070155063 Tensile strained NMOS transistor using group III-N source/drain regions
07/05/2007US20070155062 Method and apparatus for controlling a circuit with a high voltage sense device
07/05/2007US20070155061 Method and device for producing layout patterns of a semiconductor device having an even wafer surface
07/05/2007US20070155060 Method for manufacturing high-frequency module device
07/05/2007US20070155059 Package warpage control
07/05/2007US20070155058 Clipless and wireless semiconductor die package and method for making the same
07/05/2007US20070155057 Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same
07/05/2007US20070155056 Silicon direct bonding method
07/05/2007US20070155055 Method of dicing wafer and die
07/05/2007US20070155054 Wafer-level chip package process
07/05/2007US20070155053 Semiconductor Multi-Package Module Having Package Stacked Over Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
07/05/2007US20070155052 Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light
07/05/2007US20070155051 Method of creating MEMS device cavities by a non-etching process
07/05/2007US20070155050 Electronic device and method of manufacturing the same, circuit board, and electronic instrument
07/05/2007US20070155049 Method for Manufacturing Chip Package Structures
07/05/2007US20070155048 Methods for packaging microelectronic devices and microelectronic devices formed using such methods
07/05/2007US20070155047 Wafer-level processing of chip-packaging compositions including bis-maleimides
07/05/2007US20070155046 Leadframe based flash memory cards
07/05/2007US20070155044 Method for Manufacturing CMOS Image Sensor
07/05/2007US20070155043 Photoelectric conversion apparatus, producing method therefor, image pickup module and image pickup system
07/05/2007US20070155042 Solid-state imaging device, production method and drive method thereof, and camera
07/05/2007US20070155041 Method for Manufacturing CMOS image sensor
07/05/2007US20070155040 Photodiode with self-aligned implants for high quantum efficiency and method of formation
07/05/2007US20070155039 Method for manufacturing CMOS image sensor
07/05/2007US20070155038 Method of Manufacturing Complementary Metal Oxide Semiconductor Image Sensor
07/05/2007US20070155037 Reference PH sensor, preparation and application thereof
07/05/2007US20070155036 Method for Manufacturing CMOS Image Sensor
07/05/2007US20070155035 Method of fabricating a thin film transistor and manufacturing equipment
07/05/2007US20070155034 Method for manufacturing a bottom substrate of a liquid crystal display device
07/05/2007US20070155033 Method of manufacturing light emitting diode package
07/05/2007US20070155032 Method of fabricating vertical structure nitrede semiconductor light emitting device
07/05/2007US20070155031 Method for producing semiconductor optical device
07/05/2007US20070155030 Method for making red-light emitting diode having silicon quantum dots
07/05/2007US20070155029 Methods for processing semiconductor devices in a singulated form
07/05/2007US20070155028 Semiconductor Process Evaluation Methods Including Variable Ion Implanting Conditions
07/05/2007US20070155027 Dry etch stop process for eliminating electrical shorting in MRAM device structures
07/05/2007US20070155026 Method for manufacturing a semiconductor device, method for manufacturing magnetic memory, and the magnetic memory thereof
07/05/2007US20070155025 Nanowire structures and devices for use in large-area electronics and methods of making the same
07/05/2007US20070154725 cyclic silylvinylsiloxane mixed with a germanium alkoxylate or halide; dielectrics for integrated circuits; improved mechanical properties and low dielectric constant
07/05/2007US20070154631 Polyimide compositions and use thereof in ceramic product defect repair
07/05/2007US20070153398 Microlithographic reduction projection catadioptric objective
07/05/2007US20070153295 Transmission shear grating in checkerboard configuration for EUV wavefront sensor
07/05/2007US20070153264 Apparatus and method for inspecting defects
07/05/2007US20070153263 Method and apparatus for performing limited area spectral analysis
07/05/2007US20070153252 Projection system for EUV lithograhphy
07/05/2007US20070153248 Exposure apparatus
07/05/2007US20070153169 Display device
07/05/2007US20070152776 Method for non-damaging charge injection and system thereof
07/05/2007US20070152743 256 Meg dynamic random access memory
07/05/2007US20070152735 Semiconductor integrated circuit device
07/05/2007US20070152693 Method and system of trace pull test
07/05/2007US20070152351 Topographically indexed support substrates
07/05/2007US20070152350 Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package
07/05/2007US20070152349 Wafer level package having a stress relief spacer and manufacturing method thereof
07/05/2007US20070152343 Semiconductor device comprising a contact structure with increased etch selectivity
07/05/2007US20070152341 Copper wiring protected by capping metal layer and method for forming for the same
07/05/2007US20070152340 Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry
07/05/2007US20070152339 Method for testing component built in circuit board
07/05/2007US20070152338 Method of forming FPGA of multi-parallel structure and FPGA structure thereof
07/05/2007US20070152337 Semiconductor device and manufacturing method therefor
07/05/2007US20070152334 Semiconductor device and manufacturing method
07/05/2007US20070152333 Metal Interconnection of Semiconductor Device and Method of Fabricating the Same
07/05/2007US20070152332 Single or dual damascene via level wirings and/or devices, and methods of fabricating same
07/05/2007US20070152330 Package structure and manufacturing method thereof
07/05/2007US20070152328 Fluxless chip attached processes and devices
07/05/2007US20070152325 Chip package dielectric sheet for body-biasing
07/05/2007US20070152324 Forced heat transfer apparatus for heating stacked dice
07/05/2007US20070152321 Fluxless heat spreader bonding with cold form solder
07/05/2007US20070152320 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
07/05/2007US20070152314 Low stress stacked die packages
07/05/2007US20070152312 Dual die package with high-speed interconnect
07/05/2007US20070152311 Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same
07/05/2007US20070152306 Semiconductor device and fabrication method thereof
07/05/2007US20070152305 Method for forming a mask pattern for ion-implantation
07/05/2007US20070152302 Resistor of Semiconductor Device and Method for Fabricating the Same
07/05/2007US20070152294 Robust shallow trench isolation structures and a method for forming shallow trench isolation structures
07/05/2007US20070152293 Method for manufacturing semiconductor device
07/05/2007US20070152284 Transistor device and method for manufacturing the same
07/05/2007US20070152283 Semiconductor device and method of manufacturing the same
07/05/2007US20070152280 Semiconductor memory device with triple well structure and method of manufacturing the same
07/05/2007US20070152277 MOS field-effect transistor and manufacturing method thereof
07/05/2007US20070152274 Semiconductor device