Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/10/2007US7241202 Substrate polishing apparatus
07/10/2007US7241099 Center ball O-ring
07/10/2007US7240847 Chip card
07/10/2007US7240822 Ball mounting method
07/10/2007US7240711 Apparatus and method for alignment of a bonding tool
07/10/2007US7240680 Substrate processing apparatus
07/10/2007US7240679 System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
07/10/2007US7240438 Aligning apparatus
07/10/2007US7240434 Stage apparatus
07/10/2007US7240432 Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece
07/10/2007US7240429 Manufacturing method for a printed circuit board
07/10/2007US7240424 Method of laminating low temperature co-fired ceramic (LTCC) Material
07/10/2007US7240422 Apparatus for semiconductor chip detachment
07/10/2007CA2403310C Single crystal gan substrate, method of growing same and method of producing same
07/10/2007CA2268797C Method to control cavity dimensions of fired multilayer circuit boards on a support
07/10/2007CA2136886C Apparatus, system and method for real-time wafer temperature measurement based on light scattering
07/05/2007WO2007076424A1 Process for forming electrical contacts on a semiconductor wafer using a phase changing ink
07/05/2007WO2007076271A2 Semiconductor device with antireflective coating
07/05/2007WO2007076251A2 Semiconductor device fabricated using disassociated chlorohydrocarbon
07/05/2007WO2007076250A2 Semiconductor device fabricated using sublimation
07/05/2007WO2007076217A2 Method of manufacturing customized electroluminescent display
07/05/2007WO2007076189A2 Rotary chip attach
07/05/2007WO2007076076A2 Gas coupler for substrate processing chamber
07/05/2007WO2007076022A2 Method and system for providing an integral radio frequency shield in a molded array package
07/05/2007WO2007075998A2 Three dimensional microstructures and methods for making three dimensional microstructures
07/05/2007WO2007075965A2 Inorganic-organic hybrid thin-film transistors using inorganic semiconducting films
07/05/2007WO2007075840A2 Extended mainframe designs for semiconductor device manufacturing equipment
07/05/2007WO2007075727A2 Microelectronic packages and methods therefor
07/05/2007WO2007075648A2 Component stacking for integrated circuit electronic package
07/05/2007WO2007075506A1 Wide web laser ablation
07/05/2007WO2007075369A1 Low temperature doped silicon layer formation
07/05/2007WO2007075309A1 Multigate device with recessed strain regions
07/05/2007WO2007075305A1 Method of fabricating a mosfet transistor having an anti-halo for modifying narrow width device performance
07/05/2007WO2007075274A1 Flame-perforated aperture masks
07/05/2007WO2007075070A1 Substrate of probe card and method for regenerating thereof
07/05/2007WO2007075004A1 Probe card for semiconductor test
07/05/2007WO2007074897A1 Semiconductor light emitting element and process for producing the same
07/05/2007WO2007074889A1 Soldering method, semiconductor module manufacturing method and soldering apparatus
07/05/2007WO2007074874A1 Complex oxide film and method for producing same, composite body and method for producing same, dielectric material, piezoelectric material, capacitor, piezoelectric element and electronic device
07/05/2007WO2007074862A1 Cleaning liquid for photolithography and method of circulation and use of the same
07/05/2007WO2007074855A1 Non-contact delivery device
07/05/2007WO2007074854A1 Non-contact delivery device
07/05/2007WO2007074823A1 Laser beam machining method and semiconductor chip
07/05/2007WO2007074798A1 Method of conveying substrate to substrate processing device
07/05/2007WO2007074775A1 Nmosfet and method for manufacturing same, and cmosfet and method for manufacturing same
07/05/2007WO2007074770A1 Defect inspection device for inspecting defect by image analysis
07/05/2007WO2007074757A1 Reticle carrier, exposure device, reticle carrying method, reticle processing method, device manufacturing method and reticle cover managing method
07/05/2007WO2007074734A1 Abrasive grain-free polishing liquid and cmp polishing method
07/05/2007WO2007074695A1 Etching method and recording medium
07/05/2007WO2007074688A1 Nitride compound semiconductor element and method for manufacturing same
07/05/2007WO2007074678A1 Film forming apparatus, film forming method, precoating layer, and method for precoating layer formation
07/05/2007WO2007074652A1 Adhesive composition, circuit connecting material and connecting structure of circuit member
07/05/2007WO2007074640A1 Pattern forming apparatus and pattern forming method
07/05/2007WO2007074607A1 Substrate processing device and substrate processing method
07/05/2007WO2007074556A1 Active matrix substrate, display device, television receiver, and method for repairing defects of active matrix substrate
07/05/2007WO2007074552A1 Process for producing soi wafer and soi wafer
07/05/2007WO2007074551A1 Process for producing soi wafer and soi wafer
07/05/2007WO2007074550A1 Process for producing soi wafer and soi wafer
07/05/2007WO2007074530A1 Semiconductor device
07/05/2007WO2007074529A1 Semiconductor device
07/05/2007WO2007074352A1 Electronic component and a method of fabricating an electronic component
07/05/2007WO2007074351A1 Substrate with contact studs of improved quality
07/05/2007WO2007074242A1 Method for making a plate-like detachable structure, in particular made of silicon, and use of said method
07/05/2007WO2007074153A2 Method for relaxing a stressed thin film
07/05/2007WO2007074152A1 Process for producing an electroluminescent p-n junction made of a semiconductor material by molecular bonding
07/05/2007WO2007074111A1 Reliability improvement of metal-interconnect structure by capping spacers
07/05/2007WO2007074027A1 Simplified method of producing an epitaxially grown structure
07/05/2007WO2007073887A1 Device and method for treating the surfaces of substrates
07/05/2007WO2007056369A3 Batch photoresist dry strip and ash system and process
07/05/2007WO2007055853A3 Electronic device including a transistor structure having an active region adjacent to a stressor layer and a process for forming the electronic device
07/05/2007WO2007055843A3 Method for manufacturing a semiconductor component using a sacrificial masking structure
07/05/2007WO2007055817A3 Recessed channel negative differential resistance-based memory cell
07/05/2007WO2007054595A3 Method of reducing excess noise in electronic devices
07/05/2007WO2007046062A3 Redistribution layer for wafer-level chip scale package and method therefor
07/05/2007WO2007042497A3 Sensor module
07/05/2007WO2007039881A3 Semiconductor soi device
07/05/2007WO2007039880A3 Electrostatic discharge protection device
07/05/2007WO2007029444A3 Semiconductor device and method of manufacturing the same
07/05/2007WO2007024402A3 Method and apparatus for breaking semiconductor wafers
07/05/2007WO2007019103A3 Method and apparatus for sorting particles with a mems device
07/05/2007WO2006135861B1 Power semiconductor device
07/05/2007WO2006134216A3 Circuit board structure and method for manufacturing a circuit board structure
07/05/2007WO2006123298A3 Through-wafer interconnection
07/05/2007WO2006116162A3 Semiconductor package
07/05/2007WO2006038030A9 Equipment for wafer bonding
07/05/2007WO2006036820A3 Methods and apparatus for monitoring a process in a plasma processing system by measuring impedance
07/05/2007WO2006027739A3 Semiconductor devices and methods of manufacture thereof
07/05/2007WO2005104680A3 A method of base formation in a bicmos process
07/05/2007WO2005098920A3 Aqueous solution for removing post-etch residue
07/05/2007US20070156368 Method and system for generating test pulses to test electronic elements
07/05/2007US20070155444 Power supply IC having switching regulator and series regulator
07/05/2007US20070155294 Chemical mechanical polishing system
07/05/2007US20070155190 Systems and methods for forming metal oxide layers
07/05/2007US20070155189 Use of TEOS oxides in integrated circuit fabrication processes
07/05/2007US20070155188 Method of forming photoresist pattern and method of manufacturing perpendicular magnetic recording head
07/05/2007US20070155187 Method for preparing a gate oxide layer
07/05/2007US20070155186 OPTIMIZED SiCN CAPPING LAYER
07/05/2007US20070155185 Electrical sensor for real-time feedback control of plasma nitridation
07/05/2007US20070155184 Method for producing a nanostructure such as a nanoscale cantilever
07/05/2007US20070155183 Process for manufacturing wafers usable in the semiconductor industry